Transcend TS4G-32GSDHC6-P2 Manual de usuario

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SDHC Memory Card + Reader P2

Transcend Information Inc.

Description

Transcend High Capacity SD Card series are

specifically designed to meet the High Capacity, High

Definition Audio and Video requirement for the latest

Digital Cameras, DV Recorders, Mobile Phones, etc,.

The new defined Speed Class enables the host to

support AV applications to perform real time

recording to the SD memory card.

Placement

Front Back

Features

•RoHS compliant product.

•Card Lid material: PC (comply with UL94,Flame Class:HB)

•Operating Voltage: 2.7 ~ 3.6V

•Operating Temperature: -25 ~ 85°C

•Durability: 10,000 insertion/removal cycles

•Compatible with SD Specification Ver. 2.0

•Comply with SD File System Specification Ver. 2.0

•Mechanical Write Protection Switch

•Supports Speed Class Specification up to Class 6

•Supports Copy Protection for Recorded Media (CPRM) for

SD-Audio

•Seamless compatibility with SDMI-compliant digital audio

devices

•Form Factor: 24mm x 32mm x 2.1mm

Pin Definition

SD Mode SPI Mode

Pin No.

Name

Type

Description Name

Type

Description

CD/DAT I/O/PP

Card Detect/Data Line [Bit3] CS I Chip Select (neg true)

CMD PP Command/Response DI I Data In

SS1

S Supply voltage ground VSS S Supply voltage ground

S Supply voltage VDD S Supply voltage

CLK I Clock SCLK

I Clock

SS2

S Supply voltage ground VSS2

S Supply voltage ground

DAT0

I/O/PP

Data Line [Bit0] DO O/PP Data Out

DAT1

I/O/PP

Data Line [Bit1] RSV

DAT2

I/O/PP

Data Line [Bit2] RSV

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Architecture

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Bus Operating Conditions

• General

Parameter Symbol

Min. Max. Unit Remark

Peak voltage on all lines -0.3 V

+0.3

All Inputs

Input Leakage Current -10 10 µA

All Outputs

Output Leakage Current -10 10 µA

• Power Supply Voltage

Parameter Symbol

Min. Max. Unit Remark

Supply voltage V

2.7 3.6 V

Output High Voltage V

0.75* V

V I

=-100uA@V

Min.

Output Low Voltage V

0.125* V

V I

=100uA@V

Min.

Input High Voltage V

0.625* V

+0.3

Input Low Voltage V

-0.3 0.25* V

Power up time 250 ms From 0v to V

Min.

• Current Consumption

The current consumption is measured by averaging over 1 second.

•

Before first command: Maximum 15 mA

•

During initialization: Maximum 100 mA

•

Operation in Default Mode: Maximum 100 mA

•

Operation in High Speed Mode: Maximum 200 mA

•

Operation with other functions: Maximum 500 mA.

•

Bus Signal Line Load

The total capacitance C

the CLK line of the SD Memory Card bus is the sum of the bus master capacitance C

HOST

, the bus

capacitance C

BUS

itself and the capacitance C

CARD

of each card connected to this line:

= C

HOST

+ C

BUS

+ Ν*C

CARD

Where N is the number of connected cards.

Parameter Symbol

Min. Max. Unit Remark

Pull-up resistance R

CMD

DAT

10 100 kΩTo prevent bus floating

Bus signal line capacitance C

40 pF 1 card

HOST

BUS

shall not exceed

30 pF

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SDHC Memory Card + Reader P2

Transcend Information Inc.

Single card capacitance C

CARD

10 pF

Maximum signal line inductance 16 nH f

≤ 20 MHz

Pull-up resistance inside card (pin1) R

DAT3

10 90 kΩMay be used for card

detection

Note that the total capacitance of CMD and DAT lines will be consist of C

HOST

, C

BUS

and one C

CARD

only because they are

connected separately to the SD Memory Card host.

Host should consider total bus capacitance for each signal as the sum of C

HOST

, C

BUS

, and C

CARD

, these parameters are

defined by per signal. The host can determine C

HOST

and C

BUS

so that total bus capacitance is less than the card estimated

capacitance load (C

=40 pF). The SD Memory Card guarantees its bus timing when total bus capacitance is less than

maximum value of C

(40 pF).

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•

Bus Signal Levels

As the bus can be supplied with a variable supply voltage, all signal levels are related to the supply voltage.

To meet the requirements of the JEDEC specification JESD8-1A and JESD8-7, the card input and output voltages shall be

within the following specified ranges for any V

of the allowed voltage range:

Parameter Symbol Min. Max. Unit Remark

Output HIGH voltage V

0.75*V

V I

= -100 µA @V

min

Output LOW voltage V

0.125*V

V I

= -100 µA @V

min

Input HIGH voltage V

0.625*V

+ 0.3 V

Input LOW voltage V

– 0.3 0.25*V

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•

Bus Timing

Parameter Symbol

Min Max. Unit Remark

Clock CLK (All values are referred to min (V

) and max (V

)

Clock frequency Data Transfer Mode f

0 25 MHz C

CARD

≤ 10 pF, (1 card)

Clock frequency Identification Mode f

(1)

/100

400 KHz C

CARD

≤ 10 pF, (1 card)

Clock low time t

10 ns C

CARD

≤ 10 pF, (1 card)

Clock high time t

10 ns C

CARD

≤ 10 pF, (1 card)

Clock rise time t

TLH

10 ns C

CARD

≤ 10 pF, (1 card)

Clock fall time t

THL

10 ns C

CARD

≤ 10 pF, (1 card)

Inputs CMD, DAT (referenced to CLK)

Input set-up time t

ISU

5 ns C

CARD

≤ 10 pF, (1 card)

Input hold time t

5 ns C

CARD

≤ 10 pF, (1 card)

Outputs CMD, DAT (referenced to CLK)

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Output Delay time during Data Transfer Mode t

ODLY

0 14 ns C

≤ 40 pF, (1 card)

Output Delay time during Identification Mode t

ODLY

0 50 ns C

≤ 40 pF, (1 card)

(1) 0 Hz means to stop the clock. The given minimum frequency range is for cases were continues clock is required

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•

Bus Timing (High Speed Mode)

Parameter Symbol

Min Max. Unit Remark

Clock CLK (All values are referred to min (V

) and max (V

)

Clock frequency Data Transfer Mode f

0 50 MHz C

CARD

≤ 10 pF, (1 card)

Clock low time t

7 ns C

CARD

≤ 10 pF, (1 card)

Clock high time t

7 ns C

CARD

≤ 10 pF, (1 card)

Clock rise time t

TLH

3 ns C

CARD

≤ 10 pF, (1 card)

Clock fall time t

THL

3 ns C

CARD

≤ 10 pF, (1 card)

Inputs CMD, DAT (referenced to CLK)

Input set-up time t

ISU

6 ns C

CARD

≤ 10 pF, (1 card)

Input hold time t

2 ns C

CARD

≤ 10 pF, (1 card)

Outputs CMD, DAT (referenced to CLK)

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Transcend Information Inc.

Output Delay time during Data Transfer Mode t

ODLY

14 ns C

≤ 40 pF, (1 card)

Output Hold time t

2.5 ns C

≤ 40 pF, (1 card)

Total System capacitance for each line

40 pF (1 card)

1) In order to satisfy severe timing, host shall drive only one card.

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Reliability and Durability

Temperature Operation: -25°C / 85°C

Storage: -40°C (168h) / 85°C (500h)

Junction temperature: max. 95°C

Moisture and corrosion Operation: 25°C / 95% rel. humidity

Storage: 40°C / 93% rel. hum./500h

Salt Water Spray: 3% NaCl/35C; 24h acc. MIL STD Method 1009

Durability 10.000 mating cycles; test procedure: tbd.

Bending 10N

Torque 0.15N.m or +/-2.5 deg

Drop test 1.5m free fall

UV light exposure UV: 254nm, 15Ws/cm² according to ISO 7816-1

X-ray exposure 0.1 Gy of medium-energy radiation (70 keV to 140 keV,

cumulative dose per year) to

both sides of the card, according to ISO7816-1.

Visual inspection

Shape and form

No warp page; no mold skin; complete form; no cavities surface smoothness <= -

0.1

mm/cm² within contour; no cracks; no pollution (fat, oil dust, etc.)

Minimum moving force of WP witch

40gf (Ensures that the WP switch will not slide while it is inserted to the connector.)

WP Switch cycles minimum 1000 Cycles(@Slide force 0.4N to 5N)

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