TQ TQMxE40C1 Manual de usuario

TQMxE40C1

User's Manual

TQMxE40C1.UM.0100

13.12.2021

TABLE OF CONTENTS

1. ABOUT THIS MANUAL ........................................................................................................................................................................5

1.1 Copyright and License Expenses ....................................................................................................................................................5

1.2 Registered Trademarks ......................................................................................................................................................................5

1.3 Disclaimer...............................................................................................................................................................................................5

1.4 Imprint.....................................................................................................................................................................................................5

1.5 Service and Support............................................................................................................................................................................5

1.6 Tips on Safety........................................................................................................................................................................................6

1.7 Symbols and Typographic Conventions.......................................................................................................................................6

1.8 Handling and ESD Tips.......................................................................................................................................................................6

1.9 Naming of Signals................................................................................................................................................................................7

1.10 Further Applicable Documents / Presumed Knowledge.........................................................................................................7

2. INTRODUCTION ....................................................................................................................................................................................7

2.1 Overview.................................................................................................................................................................................................8

2.2 COM Express™ Specification Compliance ....................................................................................................................................9

2.3 Versions...................................................................................................................................................................................................9

2.4 Accessories.............................................................................................................................................................................................9

3. FUNCTION ........................................................................................................................................................................................... 10

3.1 Block Diagram.................................................................................................................................................................................... 10

3.2 Electrical Characteristics................................................................................................................................................................. 10

3.2.1 Supply Voltage .................................................................................................................................................................................. 10

3.2.2 Power Consumption........................................................................................................................................................................ 11

3.2.3 Real Time Clock Power Consumption ........................................................................................................................................ 12

3.3 Environmental Conditions............................................................................................................................................................. 12

3.4 System Components........................................................................................................................................................................ 13

3.4.1 Processor ............................................................................................................................................................................................. 13

3.4.2 Graphics............................................................................................................................................................................................... 13

3.4.3 Memory................................................................................................................................................................................................ 14

3.4.3.1 LPDDR4/4x SDRAM .......................................................................................................................................................................... 14

3.4.3.2 eMMC ................................................................................................................................................................................................... 14

3.4.3.3 SPI Boot Flash..................................................................................................................................................................................... 14

3.4.3.4 EEPROM ............................................................................................................................................................................................... 14

3.4.4 Real Time Clock ................................................................................................................................................................................. 14

3.4.5 Trusted Platform Module ............................................................................................................................................................... 14

3.4.6TQ flexible I/O configuration (TQ-flexiCFG).............................................................................................................................. 15

3.4.7 Ultra Deep Power State Green ECO-Off ..................................................................................................................................... 15

3.5 Interfaces ............................................................................................................................................................................................. 15

3.5.1 PCI Express.......................................................................................................................................................................................... 15

3.5.2 PCI Express for Graphics (PEG)...................................................................................................................................................... 15

3.5.3 Gigabit Ethernet................................................................................................................................................................................ 16

3.5.4 Serial ATA ............................................................................................................................................................................................ 16

3.5.5 Digital Display Interface.................................................................................................................................................................. 16

3.5.6 LVDS Interface.................................................................................................................................................................................... 16

3.5.7 USB Interfaces .................................................................................................................................................................................... 16

3.5.8 SD Card Interface .............................................................................................................................................................................. 17

3.5.9 General Purpose Input / Output................................................................................................................................................... 17

3.5.10 High Definition Audio Interface ................................................................................................................................................... 17

3.5.11 LPC Bus / eSPI..................................................................................................................................................................................... 17

3.5.12 I2C Bus................................................................................................................................................................................................... 17

3.5.13 SMBus ................................................................................................................................................................................................... 17

3.5.14 Serial Peripheral Interface .............................................................................................................................................................. 17

3.5.15 Serial Ports .......................................................................................................................................................................................... 18

3.5.16 CAN interface ..................................................................................................................................................................................... 18

3.5.17 Watchdog Timer................................................................................................................................................................................ 18

3.6 Connectors.......................................................................................................................................................................................... 19

3.6.1 COM Express™ Connector .............................................................................................................................................................. 19

3.6.2 Debug Header.................................................................................................................................................................................... 19

3.6.3 TQM Debug Card .............................................................................................................................................................................. 19

3.6.4 Debug Module LED .......................................................................................................................................................................... 19

3.7 COM Express™ Connector Pinout ................................................................................................................................................ 20

3.7.1 Signal Assignment Abbreviations ............................................................................................................................................... 20

3.7.2 COM Express™ Connector Pin Assignment............................................................................................................................... 21

4. MECHANICS ........................................................................................................................................................................................ 29

4.1 TQMxE40C1 Dimensions ................................................................................................................................................................ 29

4.2 Heat Spreader .................................................................................................................................................................................... 30

4.3 Mechanical and Thermal Considerations.................................................................................................................................. 30

4.4 Protection against External Effects.............................................................................................................................................. 30

4.5 Label placement................................................................................................................................................................................ 31

5. SOFTWARE .......................................................................................................................................................................................... 32

5.1 System Resources ............................................................................................................................................................................. 32

5.1.1 I2C Bus Devices................................................................................................................................................................................... 32

5.1.2 SMBus Devices................................................................................................................................................................................... 32

5.1.3 Memory Mapping ............................................................................................................................................................................. 32

5.1.4 Interrupt Mapping............................................................................................................................................................................ 32

5.2 Operating Systems ........................................................................................................................................................................... 32

5.2.1 Supported Operating Systems ..................................................................................................................................................... 32

5.2.2 Driver Download............................................................................................................................................................................... 32

5.3 TQ-Systems Embedded Application Programming Interface (EAPI) ................................................................................ 32

5.4 Software Tools ................................................................................................................................................................................... 32

6. BIOS....................................................................................................................................................................................................... 33

6.1 Continue Boot Process.................................................................................................................................................................... 33

6.2 Boot Manager .................................................................................................................................................................................... 33

6.3 Device Manager ................................................................................................................................................................................ 34

6.3.1 Driver Health Manager.................................................................................................................................................................... 34

6.3.2 Network Device List ......................................................................................................................................................................... 34

6.4 Boot From File.................................................................................................................................................................................... 34

6.5 Administer Secure Boot .................................................................................................................................................................. 34

6.6 Setup Utility........................................................................................................................................................................................ 35

6.6.1 Main ...................................................................................................................................................................................................... 35

6.6.2 Advanced ............................................................................................................................................................................................ 35

6.6.2.1.1 Boot Configuration........................................................................................................................................................................... 36

6.6.2.1.2 USB Configuration............................................................................................................................................................................ 36

6.6.2.1.3 Chipset Configuration ..................................................................................................................................................................... 36

6.6.2.1.4 ACPI Table/Features Control ......................................................................................................................................................... 36

6.6.2.1.5 RC Advanced Menu.......................................................................................................................................................................... 36

6.6.2.1.6 ACPI Settings...................................................................................................................................................................................... 37

6.6.2.1.7 CPU Configuration............................................................................................................................................................................ 37

6.6.2.1.8 Power & Performance...................................................................................................................................................................... 38

6.6.2.1.9 Intel® Time Coordinated Computing.......................................................................................................................................... 40

6.6.2.1.10 Memory Configuration.................................................................................................................................................................... 41

6.6.2.1.11 System Agent (SA) Configuration................................................................................................................................................ 41

6.6.2.1.12 PCH-IO Configuration...................................................................................................................................................................... 43

6.6.2.1.13 PCH-FW Configuration.................................................................................................................................................................... 47

6.6.2.1.14 Thermal Configuration.................................................................................................................................................................... 48

6.6.2.1.15 Platform Settings .............................................................................................................................................................................. 48

6.6.2.1.16 SIO TQMx86 ........................................................................................................................................................................................ 49

6.6.2.1.17 Console Redirection......................................................................................................................................................................... 50

6.6.2.1.18 H2OUVE Configuration ................................................................................................................................................................... 50

6.6.2.1.19 SIO F81214E........................................................................................................................................................................................ 51

6.6.2.1.20 NVM Express Information............................................................................................................................................................... 51

6.6.3 Security ................................................................................................................................................................................................ 51

6.6.4 Power.................................................................................................................................................................................................... 51

6.6.5 Boot....................................................................................................................................................................................................... 52

6.6.6 Exit......................................................................................................................................................................................................... 53

6.7 BIOS Update ....................................................................................................................................................................................... 53

6.7.1 Step 1: Preparing USB Stick............................................................................................................................................................ 53

6.7.2 Step 2: Preparing Management Engine (ME) FW for update .............................................................................................. 53

6.7.3 Step 3a: Updating uEFI BIOS via EFI Shell.................................................................................................................................. 55

6.7.4 Step 3b: Updating uEFI BIOS via Windows Operating System ........................................................................................... 56

6.7.5 Step 4: BIOS update check on the TQMxE40C1 Module....................................................................................................... 56

7. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS.................................................................................................. 58

7.1 EMC ....................................................................................................................................................................................................... 58

7.2 ESD ........................................................................................................................................................................................................ 58

7.3 Shock & Vibration ............................................................................................................................................................................. 58

7.4 Operational Safety and Personal Security................................................................................................................................. 58

7.5 Reliability and Service Life.............................................................................................................................................................. 58

8. ENVIRONMENT PROTECTION ........................................................................................................................................................ 59

8.1 RoHS...................................................................................................................................................................................................... 59

8.2 WEEE®................................................................................................................................................................................................... 59

8.3 REACH®................................................................................................................................................................................................ 59

8.4 EuP......................................................................................................................................................................................................... 59

8.5 Battery .................................................................................................................................................................................................. 59

8.6 Packaging............................................................................................................................................................................................ 59

8.7 Other entries ...................................................................................................................................................................................... 59

9. APPENDIX............................................................................................................................................................................................ 60

9.1 Acronyms and Definitions.............................................................................................................................................................. 60

9.2 References........................................................................................................................................................................................... 62

TABLE DIRECTORY

Table 1: Terms and Conventions .............................................................................................................................................................6

Table 2: TQMxE40C1 Power Consumption........................................................................................................................................ 11

Table 3: RTC Current Consumption...................................................................................................................................................... 12

Table 4: Intel® X6000E Series: Comparision of the SKUs................................................................................................................ 13

Table 5: Maximum Resolution Display Configuration.................................................................................................................... 14

Table 6: PCI Express port 0 – 7 configuration options.................................................................................................................... 15

Table 7: Serial Port COM Express™ Port Mapping............................................................................................................................ 18

Table 8: LED Boot Messages................................................................................................................................................................... 19

Table 9: Signal Assignment Abbreviations........................................................................................................................................ 20

Table 10: COM Express™ Connector Pin Assignment ....................................................................................................................... 21

Table 11: Labels on TQME40C1................................................................................................................................................................ 31

Table 12: I2C Address Mapping COM Express™ I2C Port ................................................................................................................... 32

Table 13: Acronyms..................................................................................................................................................................................... 60

Table 14: Further Applicable Documents and Links ......................................................................................................................... 62

ILLUSTRATION DIRECTORY

Illustration 1: TQMxE40C1 Block Diagram.................................................................................................................................................... 10

Illustration 2: TQM Debug Card....................................................................................................................................................................... 19

Illustration 3: Three-sided drawing of the TQMxE40C1 (dimensions in mm) ................................................................................... 29

Illustration 4: Bottom view drawing of the TQMxE40C1.......................................................................................................................... 29

Illustration 5: TQMxE40C1 Component Placement Top .......................................................................................................................... 30

Illustration 6: Label Placement ........................................................................................................................................................................ 31

Illustration 7: InsydeH2O BIOS Front Page................................................................................................................................................... 33

Illustration 8: RC Advanced Menu .................................................................................................................................................................. 54

Illustration 9: PCH-FW Configuration menu................................................................................................................................................ 54

Illustration 10: Firmware Update configuration menu............................................................................................................................... 54

Illustration 11: ME FW Image Re-Flash option............................................................................................................................................... 54

Illustration 12: EFI Shell......................................................................................................................................................................................... 55

Illustration 13: EFI Shell uEFI BIOS Update...................................................................................................................................................... 55

Illustration 14: Screen during BIOS Update.................................................................................................................................................... 55

Illustration 15: TQMxE40C1 Debug LED.......................................................................................................................................................... 56

Illustration 16: EFI BIOS Main Menu.................................................................................................................................................................. 57

REVISION HISTORY

Rev. Date Name Pos. Modification

0001 18.10.2021 FP Initial internal release

0100 13.12.2021 Kreuzer Initial public release

ABOUT THIS MANUAL

1.1

This User's Manual may not be copied, reproduced, translated, changed or distributed, completely or partially in electronic,

machine readable, or in any other form without the written consent of TQ-Systems GmbH.

The drivers and utilities for the components used as well as the BIOS are subject to copyrights of the respective manufacturers.

The licence conditions of the respective manufacturer are to be adhered to.

BIOS-licence expenses are paid by TQ-Systems GmbH and are included in the price.

Licence expenses for the operating system and applications are not taken into consideration and have to be calculated/declared

separately.

1.2

Registered Trademarks

TQ-Systems GmbH aims to adhere to copyrights of all graphics and texts used in all publications, and strives to use original

or license-free graphics and texts.

All brand names and trademarks mentioned in this User's Manual, including those protected by a third party, unless specified

otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the present

registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected by

a third party.

1.3

Disclaimer

TQ-Systems GmbH does not guarantee that the information in this User's Manual is up-to-date, correct, complete or of good

quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against

TQ-Systems GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information

given in this User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there is no proven

intentional or negligent fault of TQ-Systems GmbH.

TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this User's Manual or parts of it without

special notification.

1.4

Imprint

TQ-Systems GmbH

Gut Delling, Mühlstraße 2

D-82229 Seefeld

Tel: +49 8153 9308–0

Fax: +49 8153 9308–4223

E-Mail: Info@TQ-Group

Web: TQ-Group

1.5

Service and Support

Please visit our website www.tq-group.com for latest product documentation, drivers, utilities and technical support.

You can register on our website www.tq-group.com to have access to restricted information and automatic update services.

For direct technical support you can contact our FAE team by email: support@tq-group.com.

Our FAE team can also support you with additional information like 3D-STEP files and confidential information, which is not

provided on our public website.

For service/RMA, please contact our service team by email (service@tq-group.com) or your sales team at TQ-Systems GmbH.

1.6

Tips on Safety

Improper or incorrect handling of the product can substantially reduce its life span.

1.7

Symbols and Typographic Conventions

Table 1: Terms and Conventions

Symbol Meaning

This symbol represents the handling of electrostatic-sensitive modules and / or components. These

components are often damaged / destroyed by the transmission of a voltage higher than about 50 V.

A human body usually only experiences electrostatic discharges above approximately 3,000 V.

This symbol indicates the possible use of voltages higher than 24 V.

Please note the relevant statutory regulations in this regard.

Non-compliance with these regulations can lead to serious damage to your health and also cause

damage / destruction of the component.

This symbol indicates a possible source of danger. Acting against the procedure described can lead to

possible damage to your health and / or cause damage / destruction of the material used.

This symbol represents important details or aspects for working with TQ-products.

Command

A font with fixed-width is used to denote commands, contents, file names, or menu items.

1.8

Handling and ESD Tips

General handling of your TQ-products

The TQ-product may only be used and serviced by certified personnel who have taken note of the

information, the safety regulations in this document and all related rules and regulations.

A general rule is: do not touch the TQ-product during operation. This is especially important when

switching on, changing jumper settings or connecting other devices without ensuring beforehand

that the power supply of the system has been switched off.

Violation of this guideline may result in damage / destruction of the TQMxE40C1 and be dangerous

to your health.

Improper handling of your TQ-product would render the guarantee invalid.

Proper ESD handling

The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).

Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQ-

product in an ESD-safe environment. Especially when you switch modules on, change jumper settings,

or connect other devices.

1.9

Naming of Signals

A hash mark (#) at the end of the signal name indicates a low-active signal.

Example: RESET#

If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked

with a hash mark and shown at the end.

Example: C / D#

If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring.

The identification of the individual functions follows the above conventions.

Example: WE2# / OE#

1.10

Further Applicable Documents / Presumed Knowledge

•

Specifications and manual of the modules used:

These documents describe the service, functionality and special characteristics of the module used.

•

Specifications of the components used:

The manufacturer's specifications of the components used, for example CompactFlash cards, are to be taken note of.

They contain, if applicable, additional information that has to be taken note of for safe and reliable operation.

These documents are stored at TQ-Systems GmbH.

•

Chip errata:

It is the user's responsibility to make sure all errata published by the manufacturer of each component are taken note of.

The manufacturer’s advice should be followed.

•

Software behaviour:

No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.

•

General expertise:

Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.

Implementation information for the carrier board design is provided in the COM Express™ Design Guide (2), maintained by the

PICMG®. This Carrier Design Guide includes a very good guideline to design a COM Express™ carrier board.

It includes detailed information with schematics and detailed layout guidelines.

Please refer to the official PICMG®documentation for additional information (1), (3).

INTRODUCTION

The TQ module TQMxE40C1 is based on the latest generation of Intel®Atom®, Pentium®and Celeron®CPUs (code name

“Elkhart Lake”). It achieves a new level of computing performance, security and media processing performance in a very compact

form factor to empower real-time computing, industrial automation, digital surveillance, aviation, medical, retail and more.

The TQMxE40C1 corresponds to the internationally established PICMG®standard COM Express™ Compact (COM.0 R3.0) with

Type 6 pinout. 10 USB ports – including 2 USB 3.0 – and up to 8 PCIe lanes natively supported by the CPUs enable high

bandwidth communication with peripherals and additional interfaces on the carrier board. With the latest Intel®graphics

processor integrated, the TQMxE40C1 delivers 4K high resolution graphics output, immersive 3D processing and also greatly

increased video encode and playback performance.

Time coordinated computing capabilities enable time synchronized processes within IoT networks and industrial control

applications. On-board eMMC and the option for LVDS or native eDP enable flexibility and reduce overall BOM cost.

The integrated TQMx86 board controller enables high flexibility through “flexiCFG” and supports thermal management,

watchdog, 16550 compatible UARTs, I2C controllers, GPIO handling and “Green ECO-Off” with a minimum of standby power.

Combined with options like conformal coating and optimized cooling solutions the TQMxE40C1 also fits perfectly for mobile, low

power, ruggedized and battery driven applications in multiple vertical markets like industrial automation, medical devices,

transportation and others.

2.1

Overview

The following key functions are implemented on the TQMxE40C1:

Processor:

•Intel®Atom®X6000E Series: „Elkhart Lake“ with different SKUs

•optimized for Embedded, Industrial Functional Safety or PC Client applications

Memory:

•LPDDR4: 4 Gbyte, 8 Gbyte, 16 Gbyte with up to 4267MT/s and optional In Band ECC (IBECC)

•eMMC 5.0 on-board-flash

•EEPROM: 32 kbit (24AA32AT)

Graphics:

•2 × Digital Display Interface (DDI) (DP 1.2/1.3/1.4, HDMI 1.4b/2.0b)

•1 × Embedded Digital Display Interface (eDDI) or dual LVDS interface (eDP 1.3 or dual LVDS)

Peripheral interfaces:

•1 × Gigabit Ethernet (Marvell 88E1512)

•2 × USB 3.1 Gen2 (up to 10 Gb/s) with USB 3.0 and 2.0 backward compatibility

•8 × USB 2.0

•2 × SATA Gen3 (up to 6 Gb/s)

•8 × PCIe Gen3 (up to 8 Gb/s) – 7 (×1), 4 (×2), or 1 (×4)

•1 × PCIe Gen3 PEG port (up to 8 Gb/s) – Lane 0, 1 , 2, 8 and 9 (optionally multiplexed with PCIe)

•1 × LPC or eSPI Interfac

•1 × Intel®HD audio (HDA)

•1 × I2C, (optional 3 x I2C) (master/slave capable)

•1 × SMBus

•1 × SPI (for external uEFI BIOS flash)

•2 × Serial port (Rx/Tx, legacy compatible), 4-wire (Rx/Tx/RTS/CTS) optionally through TQ-flexiCFG

•1 × CAN interface (multiplexed with serial port 1)

1 × SD card interface / optional 8 × GPIO through TQ-flexiCFG (multiplexed, configurable in BIOS menu)

Security components:

•TPM (SLB9670 TPM 2.0)

Others:

•TQMx86 board controller with Watchdog and TQ-flexiCFG

Power supply voltage:

•4.75 V to 20 V

•5 V Standby (optional)

•3 V Battery for RTC

Environment:

•Standard temperature: 0 °C to +60 °C

•Extended temperature: -40 °C to +85 °C

•Relative humidity (operation): 10 % to 90 % (non-condensing)

•Relative humidity (storage): 5 % to 95 % (non-condensing, with conformal coating)

Form factor / dimensions:

•COMExpress™ Compact, Type 6, 95 mm × 95 mm

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