TQ TQMa62 L Series Manual de usuario

TQMa62xxL

Preliminary User's Manual

TQMa62xxL UM 0001

30.11.2023

TABLE OF CONTENTS

1. ABOUT THIS MANUAL.................................................................................................................................................................1

1.1 Copyright and license expenses..............................................................................................................................................1

1.2 Registered trademarks................................................................................................................................................................1

1.3 Disclaimer .......................................................................................................................................................................................1

1.4 Imprint .............................................................................................................................................................................................1

1.5 Tips on safety.................................................................................................................................................................................2

1.6 Symbols and typographic conventions.................................................................................................................................2

1.7 Handling and ESD tips ................................................................................................................................................................2

1.8 Naming of signals.........................................................................................................................................................................3

1.9 Further applicable documents / presumed knowledge...................................................................................................3

2. BRIEF DESCRIPTION......................................................................................................................................................................4

3. ELECTRONICS.................................................................................................................................................................................5

3.1 System overview...........................................................................................................................................................................5

3.1.1 System architecture / block diagram .....................................................................................................................................5

3.1.2 Functionality..................................................................................................................................................................................5

3.1.3 Pin multiplexing............................................................................................................................................................................6

3.2 System components....................................................................................................................................................................6

3.2.1 Processor derivatives...................................................................................................................................................................6

3.2.2 Booting............................................................................................................................................................................................7

3.2.2.1 Boot source ....................................................................................................................................................................................7

3.2.2.2 Boot device eMMc........................................................................................................................................................................8

3.2.2.3 Boot device NOR-flash ................................................................................................................................................................8

3.2.3 Memory ...........................................................................................................................................................................................9

3.2.3.1 LPDDR4 SDRAM ............................................................................................................................................................................9

3.2.3.2 eMMC...............................................................................................................................................................................................9

3.2.3.3 NOR-Flash .................................................................................................................................................................................... 10

3.2.3.4 EEPROMs ...................................................................................................................................................................................... 10

3.2.4 Clock supply................................................................................................................................................................................ 10

3.2.5 RTC ................................................................................................................................................................................................. 11

3.2.6 Secure Element .......................................................................................................................................................................... 12

3.2.7 Temperature sensor.................................................................................................................................................................. 12

3.2.8 Interfaces...................................................................................................................................................................................... 12

3.2.8.1 GPIO............................................................................................................................................................................................... 12

3.2.8.2 JTAG............................................................................................................................................................................................... 12

3.2.8.3 I2C ................................................................................................................................................................................................... 13

3.2.8.4 UART.............................................................................................................................................................................................. 13

3.2.8.5 EXTINT#......................................................................................................................................................................................... 13

3.2.9 Reset.............................................................................................................................................................................................. 14

3.2.9.1 Reset Options (Input) ............................................................................................................................................................... 14

3.2.9.1.1 TQMa62xxL_HARD_RST#........................................................................................................................................................ 14

3.2.9.1.3 MCU_PORz................................................................................................................................................................................... 15

3.2.9.1.4 MCU_RESETz............................................................................................................................................................................... 15

3.2.9.1.5 RESET_REQz................................................................................................................................................................................. 15

3.2.9.2 Reset Status (Output)............................................................................................................................................................... 15

3.2.9.2.1 PORz_OUT.................................................................................................................................................................................... 15

3.2.9.2.2 MCU_RESETSTATz ..................................................................................................................................................................... 15

3.2.9.2.3 RESETSTATz................................................................................................................................................................................. 15

3.2.9.3 Control signals............................................................................................................................................................................ 15

3.2.9.3.1 TQMa62xxL_PGOOD ................................................................................................................................................................ 15

3.2.9.3.2 VSEL_SD ....................................................................................................................................................................................... 15

3.2.10 Watchdog .................................................................................................................................................................................... 15

3.2.11 Power supply .............................................................................................................................................................................. 16

3.2.11.1 Main power supply ................................................................................................................................................................... 16

3.2.11.2 Overview TQMa62xxL supply ................................................................................................................................................ 16

3.2.11.3 Power sequenzing..................................................................................................................................................................... 17

3.2.11.4 Power modes.............................................................................................................................................................................. 17

3.2.11.5 Power consumption ................................................................................................................................................................. 18

3.3 TQMa62xxL interface................................................................................................................................................................ 18

3.3.1 Pin assignment........................................................................................................................................................................... 18

3.3.2 Pinout TQMa62xxL.................................................................................................................................................................... 20

4. SOFTWARE................................................................................................................................................................................... 38

5. MECHANICS................................................................................................................................................................................. 39

5.1 TQMa62xxL dimensions and footprint ............................................................................................................................... 39

5.2 TQMa62xxL component placement and labeling........................................................................................................... 40

5.3 Protection against external effects ...................................................................................................................................... 40

5.4 Thermal management ............................................................................................................................................................. 40

5.5 Structural requirements .......................................................................................................................................................... 41

6. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS .......................................................................................... 42

6.1 EMC................................................................................................................................................................................................ 42

6.2 ESD................................................................................................................................................................................................. 42

6.3 Operational safety and personal security .......................................................................................................................... 42

6.4 Climatic and operational conditions ................................................................................................................................... 42

6.5 Intended Use............................................................................................................................................................................... 42

6.6 Export Control and Sanctions Compliance ....................................................................................................................... 43

6.7 Warranty....................................................................................................................................................................................... 43

6.8 Reliability and service life........................................................................................................................................................ 43

6.9 Environment protection.......................................................................................................................................................... 43

6.9.1 RoHS .............................................................................................................................................................................................. 43

6.9.2 WEEE®............................................................................................................................................................................................ 43

6.10 REACH®......................................................................................................................................................................................... 43

6.11 EuP ................................................................................................................................................................................................. 44

6.12 Statement on California Proposition 65............................................................................................................................. 44

6.13 Battery........................................................................................................................................................................................... 44

6.14 Packaging .................................................................................................................................................................................... 44

6.15 Other entries............................................................................................................................................................................... 44

7. APPENDIX..................................................................................................................................................................................... 45

7.1 Acronyms and definitions....................................................................................................................................................... 45

7.2 References ................................................................................................................................................................................... 47

TABLE DIRECTORY

Table 1: Terms and Conventions .............................................................................................................................................................2

Table 2: AM62x derivatives (Source: Texas Instruments) ................................................................................................................6

Table 3: Selecting the General Boot Configuration............................................................................................................................7

Table 4: Boot device selection eMMC.....................................................................................................................................................8

Table 5: Selection of the boot device NOR flash .................................................................................................................................8

Table 6: eMMC Flash modes......................................................................................................................................................................9

Table 7: NOR-Flash modes...................................................................................................................................................................... 10

Table 8: JTAG signals ................................................................................................................................................................................ 13

Table 9: I2C address assignment on the module............................................................................................................................. 13

Table 10: Supply voltages.......................................................................................................................................................................... 16

Table 11: Current consumption TQMa62xx......................................................................................................................................... 18

Table 12: Pinout............................................................................................................................................................................................ 20

Table 13: Climate and operational conditions industrial temperature range........................................................................... 42

Table 14: Acronyms..................................................................................................................................................................................... 45

Table 15: Further applicable documents.............................................................................................................................................. 47

FIGURE DIRECTORY

Figure 1: Block diagram AM62x .................................................................................................................................................................4

Figure 2: Block diagram TQMa62xxL........................................................................................................................................................5

Figure 3: Block diagram boot strapping..................................................................................................................................................7

Figure 4: Block diagram DDR3L SDRAM connection...........................................................................................................................9

Figure 5: Block diagram eMMC flash interface......................................................................................................................................9

Figure 6: Block diagram NOR-Flash........................................................................................................................................................ 10

Figure 7: Block diagram clock supply.................................................................................................................................................... 10

Figure 8: Block diagram RTC .................................................................................................................................................................... 11

Figure 9: Block diagram SEC..................................................................................................................................................................... 12

Figure 10: Block diagram JTAG.................................................................................................................................................................. 12

Figure 11: Block diagram I2C bus on the TQMa62xx .......................................................................................................................... 13

Figure 12: Block diagram Reset ................................................................................................................................................................. 14

Figure 13: Block diagram power supply ................................................................................................................................................. 16

Figure 14: Recommended power up sequence ................................................................................................................................... 17

Figure 15: Pad placement ........................................................................................................................................................................... 19

Figure 16: Dimensions TQMa62xxL.......................................................................................................................................................... 39

Figure 17: TQMa62xxL top view................................................................................................................................................................ 40

REVISION HISTORY

Rev.

Date

Name

Pos.

Modification

0001

30.11.2023

M. Kreuzer

All

Initial release

1. ABOUT THIS MANUAL

1.1 Copyright and license expenses

This Preliminary User's Manual may not be copied, reproduced, translated, changed or distributed, completely or partially in

electronic, machine readable, or in any other form without the written consent of TQ-Systems GmbH.

The drivers and utilities for the components used as well as the BIOS are subject to the copyrights of the respective

manufacturers. The licence conditions of the respective manufacturer are to be adhered to.

Bootloader-licence expenses are paid by TQ-Systems GmbH and are included in the price.

Licence expenses for the operating system and applications are not taken into consideration and must be calculated / declared

separately.

1.2 Registered trademarks

TQ-Systems GmbH aims to adhere to copyrights of all graphics and texts used in all publications, and strives to use original

or license-free graphics and texts.

All brand names and trademarks mentioned in this Preliminary User's Manual, including those protected by a third party, unless

specified otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the

present registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected by a

third party.

1.3 Disclaimer

TQ-Systems GmbH does not guarantee that the information in this Preliminary User's Manual is up-to-date, correct, complete or

of good quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against TQ-

Systems GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information

given in this Preliminary User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there

is no proven intentional or negligent fault of TQ-Systems GmbH.

TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this Preliminary User's Manual or parts of it

without special notification.

Important Notice:

Before using the Starterkit MBa62xx or parts of the schematics of the MBa62xx, you must evaluate it and determine if it is suitable

for your intended application. You assume all risks and liability associated with such use. TQ-Systems GmbH makes no other

warranties including, but not limited to, any implied warranty of merchantability or fitness for a particular purpose. Except where

prohibited by law, TQ-Systems GmbH will not be liable for any indirect, special, incidental or consequential loss or damage

arising from the usage of the Starterkit MBa62xx or schematics used, regardless of the legal theory asserted.

1.4 Imprint

TQ-Systems GmbH

Gut Delling, Mühlstraße 2

D-82229 Seefeld

Tel: +49 8153 9308 0

Fax: +49 8153 9308 4223

E-Mail: Info@TQ-Group

Web: TQ-Group

1.5 Tips on safety

Improper or incorrect handling of the product can substantially reduce its life span.

1.6 Symbols and typographic conventions

Table 1: Terms and Conventions

Symbol

Meaning

This symbol represents the handling of electrostatic-sensitive devices and / or components. These

components are often damaged / destroyed by the transmission of a voltage higher than about 50 V.

A human body usually only experiences electrostatic discharges above approximately 3,000 V.

This symbol indicates the possible use of voltages higher than 24 V.

Please note the relevant statutory regulations in this regard.

Non-compliance with these regulations can lead to serious damage to your health and also cause

damage / destruction of the component.

This symbol indicates a possible source of danger. Acting against the procedure described can lead to

possible damage to your health and / or cause damage / destruction of the material used.

This symbol represents important details or aspects for working with TQ-products.

Command

A font with fixed-width is used to denote commands, file names, or menu items.

1.7 Handling and ESD tips

General handling of your TQ-products

The TQ-product may only be used and serviced by certified personnel who have taken note of the

information, the safety regulations in this document and all related rules and regulations.

A general rule is: do not touch the TQ-product during operation. This is especially important when

switching on, changing jumper settings or connecting other devices without ensuring beforehand

that the power supply of the system has been switched off.

Violation of this guideline may result in damage / destruction of the TQMa62xxL and be dangerous

to your health.

Improper handling of your TQ-product would render the guarantee invalid.

Proper ESD handling

The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).

Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQ-

product in an ESD-safe environment. Especially when you power up the TQMa62xxL or the Starterkit,

change jumper settings, or connect other devices.

1.8 Naming of signals

A hash mark (#) at the end of the signal name indicates a low-active signal.

Example: RESET#

If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked with

a hash mark and shown at the end.

Example: C / D#

If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring.

The identification of the individual functions follows the above conventions.

Example: WE2# / OE#

1.9 Further applicable documents / presumed knowledge

•Specifications and manuals of the modules used:

These documents describe the service, functionality and special characteristics of the module used (incl. BIOS).

•Specifications of the components used:

The manufacturer's specifications of the components used, for example CompactFlash cards, are to be taken note of.

They contain, if applicable, additional information that must be taken note of for safe and reliable operation.

These documents are stored at TQ-Systems GmbH.

•Chip errata:

It is the user's responsibility to make sure all errata published by the manufacturer of each component are taken note of.

The

•Software behaviour:

No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.

•General expertise:

Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.

The following documents are required to fully comprehend the following contents:

•MBa62xx circuit diagram

•MBa62xx User's Manual

•Sitara AM62x Data Sheet

•U-Boot documentation: www.denx.de/wiki/U-Boot/Documentation

•PTXdist documentation: www.ptxdist.de

•TQ-Support Wiki: support.tq-group.com/doku.php?id=en:arm:tqmax62xx

2. BRIEF DESCRIPTION

The TQMa62xxL is a universal TQ-LGA mini module based on the TI Sitara family AM62x with ARM Cortex A53 and Cortex M4F

cores.

This Preliminary User's Manual describes the hardware of the TQMa62xxL Rev.010x and refers to some software settings.

It does not replace the AM62x Reference Manual (2).

Figure 1: Block diagram AM62x

(Source: Texas Instruments)

All useful AM62x signals are routed to the TQMa62xxL LGA pads. There are no restrictions for customers using the TQMa62xxL

with respect to an integrated customised design.

Please take note of that not all interfaces can be used simultaneously.

3. ELECTRONICS

The information provided in this User's Manual is only valid in connection with the tailored boot loader,

which is preinstalled on the TQMa62xxL, and the BSP provided by TQ-Systems GmbH, see also section 4.

3.1 System overview

3.1.1 System architecture / block diagram

Figure 2: Block diagram TQMa62xxL

3.1.2 Functionality

The following key functions are implemented on the TQMa62xxL:

•Mini module with form factor 38 mm x 38 mm

•AM62x CPU (up to 4 x A53 and/ 1 x M4F)

•16-bit LPDDR4 memory

•1x eMMC NAND-Flash 5.1

•1x QSPI-NOR-Flash (optional)

•Clock supply

•EEPROM (optional)

•Real-time clock (optional)

•Secure Element chip (optional)

•Temperature sensor (optional)

•EEPROM (TQ-Data)

•Supervisor

•Single Power Supply 3.3 V

•Availability of all essential signals of the CPU at the LGA pads

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