Texas Instruments DP83867 Manual de usuario

User's Guide

DP83867 SFP Application Interface Card

ABSTRACT

This user's guide describes the design, setup, and function of the DP83867 Single-Port TSN Small Form-

factor Pluggable (SFP) Application Interface Card (AIC). The SPF AIC supports one Ethernet port with

1000/100/10 Mb/s and is compliant with the IEEE 802.3 standard. This reference design supports SGMII for

MAC connections.

The SFP AIC card can be interfaced to the Intel Raptor Lake-P CRB (COM-HPC) design.

Table of Contents

1 Introduction.............................................................................................................................................................................2

1.1 Overview............................................................................................................................................................................ 2

1.2 Hardware Features............................................................................................................................................................ 2

1.3 Software Features..............................................................................................................................................................2

1.4 Block Diagram....................................................................................................................................................................2

2 Board Overview...................................................................................................................................................................... 3

2.1 Components.......................................................................................................................................................................3

2.2 SFP Header Signals...........................................................................................................................................................3

3 Quick Start...............................................................................................................................................................................3

4 Schematic, Board Layout, and Bill of Materials...................................................................................................................4

4.1 Board Layout .....................................................................................................................................................................4

4.2 Schematic.......................................................................................................................................................................... 5

4.3 Bill of Materials...................................................................................................................................................................7

5 Revision History......................................................................................................................................................................8

Trademarks

All trademarks are the property of their respective owners.

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DP83867 SFP Application Interface Card 1

1 Introduction

1.1 Overview

Figure 1-1. DP83867 Single-Port TSN SFP Application Interface Card (Top View)

Figure 1-2. DP83867 Single-Port TSN SFP Application Interface Card (Bottom View)

The DP83867 Single-Port TSN SFP Application Interface Card plugs into the Intel Raptor Lake reference design

through the SFP interface connector. This is an easy way to evaluate the functionality of the DP83867 Ethernet

PHY with the Intel CPU reference design.

The SFP form factor carries the SGMII signaling for the Ethernet port, MDIO/MDC, power supply and control

signals.

The AIC supports MDIO access via dedicated a SMI interface over the SFP interface. The DP83867 PHY use

the MDIO addresses 0 to be addressed via the SMI interface.

1.2 Hardware Features

DP83867 Single-Port TSN SFP Application Interface Card features:

• DP83867 Gbit Ethernet PHY

• SGMII MAC interface

• Common serial management interface (SMI) with MDIO/MDC signals to access DP83867 Ethernet PHY

• One RJ45 jack connector

• Discrete magnetics

• On-board power generation for all PHYs, sourced by 3.3 V power supply through the SFP connector

1.3 Software Features

• The Ethernet PHY MDIO registers can be accessed via the SFP interface.

– DP83867 on Ethernet port has MDIO address #0

1.4 Block Diagram

DP83867 SFP AIC

SFP I/F

Raptor Lake-P CRB

SGMII TX

SGMII RX

SMB_SDA/MDIO

SMB_SCL/MDC

Sideband Signals

DP83867

SGMII TX P/N

SGMII RX P/N

MDIO

MDC

RESET_N

LINK

AUXTX / GPIO

XTAL1

XTAL2

MDI[3:0] RJ45

Figure 1-3. Block Diagram

Introduction www.ti.com

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2 Board Overview

2.1 Components

Figure 2-1 below gives a quick overview of the AIC board. The marked sections are described in the Table 2-1.

Figure 2-1. Connectors, Jumpers and LEDs

Table 2-1. Component Table

Section Description

1 RJ45 Gigabit Ethernet network connection Port 1 / TSN_0

2 DP83867 PHY1 for Port 1

3 Ethernet magnetic

4 SFP interface

5 25 MHz clock generation for PHY

2.2 SFP Header Signals

Please refer to the schematics in section Section 4.2 for the SFP signal assignment and description. The signal

assignment is following the signal layout of the Intel host platform.

2.2.1 MISC0 Signal Header

Table 2-2. SFP Signal Header

Pin Number Signal Description

12 SGMII_SFP_RX_D_N / SGMII_SON

13 SGMII_SFP_RX_D_P / SGMII_SOP

18 SGMII_SFP_TX_D_P / SGMII_SIP

19 SGMII_SFP_TX_D_N / SGMII_SIN

8 LINK

2 PHY GPIO_0 / SFP_AUX_TS

4 MDIO

5 MDC

6 SFP_MD_0, connected to GND

3, 7, 9 Not connected

1, 10, 11, 14, 17, 20 GND

15, 16 3.3V supply

3 Quick Start

1. Power down the Intel host platform (e.g Intel Raptor Lake).

2. Plug-in the DP83867 Single-Port TSN SFP Application Interface Card into the Intel host platform.

3. Power up the Intel host platform.

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DP83867 SFP Application Interface Card 3

4 Schematic, Board Layout, and Bill of Materials

4.1 Board Layout

Figure 4-1. Assembly Drawing Top Layer

Figure 4-2. Assembly Drawing Bottom Layer

Schematic, Board Layout, and Bill of Materials www.ti.com

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4.2 Schematic

GND

PHY1_TD_A_P

PHY1_TD_A_N

PHY1_TD_B_P

PHY1_TD_C_P

PHY1_TD_D_P

PHY1_TD_D_N

PHY1_TD_B_N

PHY1_TD_C_N

GND

GND GND

GND

MDIO Address 0

EARTH_GNDGND

16V

0.1uF

16V

0.1uF

16V

0.1uF

16V

0.1uF

16V

0.1uF

C7 16V

0.1uF

16V

0.1uF

C10

16V

0.1uF

C11

16V

0.1uF

C12

10V

1uF

C22

10V

1uF

C23

10V

1uF

C24

Mode 3

Mode 2

GND

SGMII_RX_N

VCC_2.5V

VCC_1.0V

0.1uFC30

0.1uF

C31

(Mode 1)

2.20kR4

2.20kR6

VCC_2.5V

VCC_1.0V

GND

SGMII_SFP_TX_D_P

SGMII_SFP_TX_D_N

SGMII_SFP_RX_D_P

SGMII_SFP_RX_D_N

SFP_LINK

RXCTL

SFP_LINK

SFP_MDC

SFP_MDIO

SFP_RESET_N

SFP-RJ45 contacts

0.1uFC26

0.1uF

C27

PHY1_TD_A_P

PHY1_TD_A_N

PHY1_TD_B_P

PHY1_TD_C_P

PHY1_TD_D_P

PHY1_TD_D_N

PHY1_TD_B_N

PHY1_TD_C_N

GND

EARTH_GND

2kV

1000pF

C37

2kV

1000pF

C45

RXDATA_0

75.0R1

75.0R2

75.0R5

75.0

0.1uFC25

0.1uFC28

0.1uFC32

0.1uF

C34

1 3

GND 2

GND 4

GND

P1_TD_A_P

P1_TD_A_N

P1_TD_B_P

P1_TD_B_N

P1_TD_C_P

P1_TD_C_N

P1_TD_D_P

P1_TD_D_N

SGMII_TX_P

SGMII_TX_N

SGMII_RX_P

SGMII_RX_N

74902011 1A

CLK_OUT

GPIO_0

GPIO_1

GTX_CLK

INT/PWDN

JTAG_CLK 20

JTAG_TDI 23

JTAG_TDO 21

JTAG_TMS 22

LED_0 47

LED_1 46

LED_2 45

MDC 16

MDIO 17

PAD 49

RBIAS 12

RX_CLK

32 RX_CTRL

RX_D0/SGMII_COP

RX_D1/SGMII_CON

RX_D2/SGMII_SOP

RX_D3/SGMII_SON

TD_M_A 2

TD_M_B 5

TD_M_C 8

TD_M_D 11

TD_P_A 1

TD_P_B 4

TD_P_C 7

TD_P_D 10

TX_CTRL

TX_D0/SGMII_SIN

TX_D1/SGMII_SIP

TX_D2

TX_D3

VDD1P0 42

VDD1P0 31

VDD1P0 24

VDD1P0 6

VDDA1P8 48

VDDA1P8 13

VDDA2P5

VDDIO

X_I

X_O

RESET

DP83867ERGZR

PHY1_GPIO_0

PHY1_GPIO_1

SGMII_RX_P

RXDATA_1

2.49k

R14

2.49k

R17

2.49k

R15

10.0k

R13

2.20kR7

5.76k

R12

8.2pF

C33

8.2pF

C35

PHY1_GPIO_0

SFP_LINK

+V3.3A

+V3.3A +V3.3A

+V3.3A

10.0kR3

PHY1_GPIO_0

Mode 1

1.00k

R24

1.00k

R25

PHY1_GPIO_1

Mode 1

6.3V

33pF

C16

For SGMII, add same

resistorloadto RXD0/1

as for RXD2/3

RX_D2/RX_D3: optinal

pull-downto discharge

voltagefor mode1.

Figure 4-3. Schematic : DP83867 Ethernet PHY

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DP83867 SFP Application Interface Card 5

VeeT

TD-

TD+

VeeT

VccT

VccR

VeeR

RD+

RD-

VeeR

BOTTOP

VeeT 1

TX_Fault 2

TX_Disable 3

MOD-DEF2 4

MOD-DEF1 5

MOD-DEF0 6

Rate Select 7

LOS 8

VeeR 9

VeeR 10

EC1

EDGE_CONN_SFP

SFP_LINK

SFP_MD_0

GND

SFP_MDC

SFP_MDIO

GND

+V3.3A

VI N1

VI N2

11 FB1 3

FB2 1

PG1 4

PG2 13

SW1 6

SW2 12

COMP/FSET

MODE/S YNC

EN1

EN2

GND 2

GND 9

TPS62441WRQRR

+V3.3A

6.3V

10uF

6.3V

10uF

GND

470nHL1

470nH

8.06k

R21

GND

10pF

C13

30.0k

R11

47.5k

R16

15.0k

R20

20.0k

R10

VCC_1.0V

GND

VCC_2.5V

6.3V

10uF

C14

6.3V

10uF

C15

PHY1_GPIO_0

SFP_LINK

SGMII_SFP_RX_D_N

SGMII_SFP_TX_D_N

SGMII_SFP_RX_D_P

SGMII_SFP_TX_D_P

GND

R23

R19

0R22

1.00k

R18

PHY1_GPIO_1

0R26 SFP_RESET_N

Figure 4-4. Schematic : SFP Interface and Power

Schematic, Board Layout, and Bill of Materials www.ti.com

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4.3 Bill of Materials

Table 4-1. Bill of Materials

Designator Qty Part Number Description Footprint

C1, C13 2 GJM0335C1E100JB01D CAP, CERM, 10 pF, 25 V, +/- 5%,

C0G/NP0, 0201

201

C2, C3, C4, C6, C7, C9, C10,

C11, C12, C26, C27, C30, C31

13 GRM033C71C104KE14D CAP, CERM, 0.1 uF, 16 V, +/- 10%,

X5R, 0201

201

C5, C8, C14, C15 4 GRM155R60J106ME11 CAP, CERM, 10 uF, 6.3 V, +/- 20%,

X5R, 0402

402

C16 1 GJM0335C0J330JB01D CAP, CERM, 33 pF, 6.3 V,+/- 5%,

C0G/NP0, 0201

201

C22, C23, C24 3 GRM033R61A105ME15D CAP, CERM, 1 uF, 10 V,+/- 20%,

X5R, 0201

201

C25, C28, C32, C34 4 GRM033C71A104KE14D CAP, CERM, 0.1 uF, 10 V,+/- 10%,

X7S, 0201

201

C33, C35 2 GRM0335C1E8R2BA01D CAP, CERM, 8.2 pF, 25 V,+/- 1.2%,

C0G/NP0, 0201

201

C37, C45 2 C1206C102KGRACAUTO CAP, CERM, 1000 pF, 2000 V, +/-

10%, X7R, AEC-Q200 Grade 1,

1206

L1, L2 2 DFE252012PD-R47M Inductor, Shielded, 470 nH, 4.7 A,

0.021 ohm, SMD

1008

R1, R2, R5, R9 4 RC0201FR-0775RL RES, 75.0, 1%, 0.05 W, 0201 201

R3 1 RC0201FR-0710KL RES, 10.0 k, 1%, 0.05 W, 0201 201

R4, R6 2 CRCW02012K20FKED RES, 2.20 k, 1%, 0.05 W, 0201 201

R8, R14, R15, R17 4 CRCW02012K49FKED RES, 2.49 k, 1%, 0.05 W, 0201 201

R10 1 RC0201FR-7D20KL RES, 20.0 k, 1%, 0.05 W, 0201 201

R11 1 RC0201FR-0730KL RES, 30.0 k, 1%, 0.05 W, 0201 201

R12 1 RC0201FR-075K76L RES, 5.76 k, 1%, 0.05 W, 0201 201

R13 1 CRCW020110K0FKED RES, 10.0 k, 1%, 0.05 W, 0201 201

R16 1 RC0201FR-0747K5L RES, 47.5 k, 1%, 0.05 W, 0201 201

R18, R24, R25 3 RC0201FR-071KL RES, 1.00 k, 1%, 0.05 W, 0201 201

R19, R23 2 CRCW02010000Z0ED RES, 0, 5%, 0.05 W, 0201 201

R20 1 RC0201FR-0715KL RES, 15.0 k, 1%, 0.05 W, 0201 201

R21 1 RC0201FR-078K06L RES, 8.06 k, 1%, 0.05 W, 0201 201

T1 1 749020111A 2MM DOUBLE ROW FEMALE IDC

ASSEMB

SME24

U1 1 DP83867ERGZR Extended Temperature Gigabit

Ethernet PHY with SGMII,

RGZ0048B (VQFN-48)

RGZ0048B

U2 1 TPS62441WRQRR 2.7-V to 6-V Adjustable-Frequency

Dual Step-Down Converter in QFN

package

VQFN-HR14

Y1 1 830081609 25 MHz ±10ppm Crystal 8pF 200

Ohms 4-SMD, No Lead

SMT_CRYSTAL_1MM

6_1MM2

Z1 1 SFP-RJ45 X0330 SFP RJ45 Housing

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DP83867 SFP Application Interface Card 7

5 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

DATE REVISION NOTES

July 2023 * Initial Release

Revision History www.ti.com

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STANDARD TERMS FOR EVALUATION MODULES

1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or

documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance

with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.

1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility

evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not

finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For

clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions

set forth herein but rather shall be subject to the applicable terms that accompany such Software

1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,

or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production

system.

2Limited Warranty and Related Remedies/Disclaimers:

2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License

Agreement.

2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM

to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by

neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have

been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications

or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control

techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.

User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)

business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.

2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit

User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty

period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or

replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be

warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day

warranty period.

WARNING

Evaluation Kits are intended solely for use by technically qualified,

professional electronics experts who are familiar with the dangers

and application risks associated with handling electrical mechanical

components, systems, and subsystems.

User shall operate the Evaluation Kit within TI’s recommended

guidelines and any applicable legal or environmental requirements

as well as reasonable and customary safeguards. Failure to set up

and/or operate the Evaluation Kit within TI’s recommended

guidelines may result in personal injury or death or property

damage. Proper set up entails following TI’s instructions for

electrical ratings of interface circuits such as input, output and

electrical loads.

NOTE:

EXPOSURE TO ELECTROSTATIC DISCHARGE (ESD) MAY CAUSE DEGREDATION OR FAILURE OF THE EVALUATION

KIT; TI RECOMMENDS STORAGE OF THE EVALUATION KIT IN A PROTECTIVE ESD BAG.

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3Regulatory Notices:

3.1 United States

3.1.1 Notice applicable to EVMs not FCC-Approved:

FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software

associated with the kit to determine whether to incorporate such items in a finished product and software developers to write

software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or

otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition

that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.

Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must

operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.

3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:

CAUTION

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not

cause harmful interference, and (2) this device must accept any interference received, including interference that may cause

undesired operation.

Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to

operate the equipment.

FCC Interference Statement for Class A EVM devices

NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of

the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is

operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not

installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.

Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to

correct the interference at his own expense.

FCC Interference Statement for Class B EVM devices

NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of

the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential

installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance

with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference

will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which

can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more

of the following measures:

•Reorient or relocate the receiving antenna.

•Increase the separation between the equipment and receiver.

•Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

•Consult the dealer or an experienced radio/TV technician for help.

3.2 Canada

3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247

Concerning EVMs Including Radio Transmitters:

This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:

(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may

cause undesired operation of the device.

Concernant les EVMs avec appareils radio:

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation

est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit

accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Concerning EVMs Including Detachable Antennas:

Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)

gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type

and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for

successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types

listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.

Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited

for use with this device.

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