Telit Wireless Solutions SE868SY-D Guía

SE868SY-D

HW Design Guide

1VV0301705 Rev.5 –2021-12-15

Telit Technical Documentation

SE868SY-D Hardware Design Guide

1VV0301705 Rev. 5 Page 2of 44 2021-12-15

Not Subject to NDA

APPLICABILITY TABLE

PRODUCTS

SE868SY-D

 
 SE868SY-D Hardware Design Guide 
 
 1VV0301705 Rev. 5 Page 3of 44 2021-12-15 
 
Not Subject to NDA 
CONTENTS 
APPLICABILITY TABLE 2 
CONTENTS 3 
1. INTRODUCTION 6 
 Scope 6 
 Audience 6 
 Contact Information, Support 6 
 Symbol Conventions 7 
2. GENERAL PRODUCT DESCRIPTION 8 
 Overview 8 
 Product Variants and Supported Satellite Systems 8 
 Target Market 8 
 Block Diagram 9 
 Main Features 9 
 Mechanical Specifications 10 
2.6.1. Dimensions 10 
2.6.2. Weight 10 
 Temperature Range 10 
 Magnetic Field Immunity 10 
3. PINS ALLOCATION 11 
 Pin-Out 11 
 LGA Pads Layout 13 
 Absolute Maximum Ratings 14 
4. POWER SUPPLY 15 
 Power Supply Requirements 15 
 Power Consumption 15 
 General Design Rules 16 
4.3.1. Electrical Design Guidelines 16 
4.3.2. Power Supply PCB Layout Guidelines 17 
5. DIGITAL SECTION 19 

 
 SE868SY-D Hardware Design Guide 
 
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 Logic Levels 19 
 Communication Ports 19 
5.2.1. Communication Interfaces to the Host MCU (HIF) 19 
5.2.2. Host Interface Selection 20 
 Digital I/O 21 
5.3.1. nRESET 21 
5.3.2. LNA Enable 21 
5.3.3. 1PPS 21 
5.3.4. System ON 21 
6. PRODUCT PERFORMANCE 22 
 Horizontal Position Accuracy 22 
 Time to First Fix 22 
 Sensitivity 22 
7. RF SECTION 24 
 GNSS RF Signal Pin-Out 24 
 RF Front End Design 24 
7.2.1. Reference Design for Passive Antenna 24 
7.2.2. Reference Design for Active Antenna 25 
7.2.3. Guidelines of PCB Line for GNSS Antenna 25 
 GNSS Antenna Requirements 26 
7.3.1. GNSS Antenna Specification 26 
7.3.2. GNSS Antenna –Installation Guidelines 26 
7.3.3. Powering the External LNA (Active Antenna) 27 
8. MECHANICAL DESIGN 28 
 Drawing 28 
9. APPLICATION PCB DESIGN 29 
 Recommended Footprint for the Application 29 
 PCB Pad Design 30 
 Stencil 32 
 Solder Paste 32 
 Solder Reflow 32 

 
 SE868SY-D Hardware Design Guide 
 
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10. PACKAGING 34 
 Reel 34 
 Tray 35 
11. CONFORMITY ASSESSMENT ISSUES 37 
 EU RED Declaration of Conformity 37 
 UKCA Declaration of Conformity 37 
12. PRODUCT AND SAFETY INFORMATION 38 
 Copyrights and Other Notices 38 
12.1.1. Copyrights 38 
12.1.2. Computer Software Copyrights 38 
 Usage and Disclosure Restrictions 39 
12.2.1. License Agreements 39 
12.2.2. Copyrighted Materials 39 
12.2.3. High Risk Materials 39 
12.2.4. Trademarks 40 
12.2.5. Third Party Rights 40 
12.2.6. Waiver of Liability 40 
 Safety Recommendations 41 
13. GLOSSARY 42 
14. DOCUMENT HISTORY 43 
 
 

SE868SY-D Hardware Design Guide

1VV0301705 Rev. 5 Page 6of 44 2021-12-15

Not Subject to NDA

1. INTRODUCTION

Scope

This document introduces the SE868SY-D module and presents possible and

recommended hardware solutions for the development of a product based on this

module. All the features and solutions described in this document are applicable to all

the variants listed in the applicability table.

This document cannot include every possible hardware solution or product. Where the

suggested hardware configurations are not required, the information provided should be

used as a guide and starting point for the proper product development with the Telit

module.

Audience

This document is intended for Telit customers, especially system integrators, about to

implement their applications using our SE868SY-D modules.

Contact Information, Support

For general contact, technical support services, technical questions and report

documentation errors contact Telit Technical Support at:

•

•

•

•

Alternatively, use:

https://www.telit.com/contact-us

For detailed information about where you can buy the Telit modules or for

recommendations on accessories and components visit:

https://www.telit.com

Our aim is to make this guide as helpful as possible. Keep us informed of your comments

and suggestions for improvements.

Telit appreciates the user feedback on our information.

SE868SY-D Hardware Design Guide

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Symbol Conventions

Danger: This information MUST be followed, or catastrophic

equipment failure or personal injury may occur.

Warning: Alerts the user on important steps about the module

integration.

Note/Tip: Provides advice and suggestions that may be useful when

integrating the module.

Electro-static Discharge: Notifies the user to take proper grounding

precautions before handling the product.

Table 1: Symbol Conventions

All dates are in ISO 8601 format, i.e. YYYY-MM-DD.

SE868SY-D Hardware Design Guide

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2. GENERAL PRODUCT DESCRIPTION

Overview

The SE868SY-D module, the latest addition to the xE868 family, is a multi-frequency and

multi-constellation GNSS receiver.

The SE868SY-D product uses the two GNSS bands L1 and L5 to achieve sub-meter

accuracy and reduce the multipath effects that are common in urban canyons.

The SE868SY-D operates at 1.8 V, minimizing power consumption even below L1-only

products and making it ideal for battery powered and wearable device applications.

Product Variants and Supported Satellite Systems

The SE868SY-D is available in two different ordering part numbers:

•Standard

•Low-power (requiring an external 0.8 V voltage supply on pin27)

Table 2, below lists the supported satellite systems, for both variants.

Product

Constellations

SE868SY-D

GPS (L1C/A; L5)

GLONASS (L1OF)

Galileo (E1B/C; E5a)

BeiDou (B1I; B1C; B2A)

QZSS (L1C/A, L1S1, L1C/B)

QZSS (L5)

NavIC (L5)

Note 1: Planning

Table 2: Product Variants and Supported Satellite Systems

Target Market

SE868SY-D, with its improved accuracy and ultra-low power consumption, can ideally be

applied to all positioning verticals such as:

•Telemetry

•Fleet managements

•Insurance telematics / Dashcams

•Asset/personal tracking

•Sport equipment

SE868SY-D Hardware Design Guide

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•E-mobility

•Drones

Block Diagram

Figure 1: SE868SY-D Block Diagram

Main Features

Function

Features

GNSS

Multi-constellation and Multi-bands

Low power consumption

Geofence (in progress)

Real Time Clock

Interfaces

Main UART

SPI 1 / I2C

1PPS signal

LNA_EN

SYS_ON (only in low power P/N)

Single Antenna pin

External Sensors support1

External Flash support 1

Note 1: Planning

Table 3: Functional Features

SE868SY-D Hardware Design Guide

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Mechanical Specifications

2.6.1. Dimensions

The overall dimensions of SE868SY-D are:

•Length: 11 mm

•Width: 11 mm

•Thickness: 2.8 mm

2.6.2. Weight

The nominal weight of the module is 1gram.

Temperature Range

Mode

Temperature

Notes

Operating Temperature Range

–40°C - +85°C

Storage and non-operating

Temperature Range

–40°C - +85°C

Table 4: Temperature Range

Magnetic Field Immunity

Since the SE868SY-D uses an embedded MRAM as an NVM (Non-Volatile Memory) for its

program code and data storage, the customer should consider the environment magnetic

field strength for good retention performance as shown in Table 5.

Item

Min.

Typ.

Max.

Unit

Notes

10-year data

retention

100

In Deep Sleep or

Shutdown at 25° C

In Deep Sleep or

Shutdown at 55° C

In Deep Sleep or

Shutdown at 105° C

Active Read/Write

In Exec or Idle

Table 5: Magnetic Field Immunity

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