TechNexion TEK3-BSW Manual de usuario

TEK3-BSW BOX PC PRODUCT MANUAL

(TEK3-BSW)

VER. 1.00

April 15, 2019

TEK3-BSW HARDWARE MANUAL –VER 1.00 APR 15 2019

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REVISION HISTORY

Revision

Date

Originator

Notes

1.00

April 15, 2019

TechNexion

First public release

TEK3-BSW HARDWARE MANUAL –VER 1.00 APR 15 2019 
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TABLE OF CONTENTS 
 
Introduction ...............................................................................................................................................5 
1. General Care and Maintenance .........................................................................................................5 
TEK3-BSW Product Overview ..................................................................................................................6 
1. Functional Block Diagram ..................................................................................................................6 
2. Dimensions.........................................................................................................................................7 
3. External Connectors...........................................................................................................................8 
4. Internal Board Connectors .................................................................................................................9 
4.1. Galvanic Isolated (TEK3-xxxxx-Rxx-Lxxx-xxx-xxxx-XG21-xxxx-xxxx)........................................9 
4.2. Non-Galvanic Isolated (TEK3-xxxxx-Rxx-Lxxx-xxx-xxxx-XS21-xxxx-xxxx)...............................10 
4.3. Board View Without the Power, I/O Expansion and SO-DIMM Modules ..................................11 
External Connectors................................................................................................................................12 
1. USB Host Connectors ......................................................................................................................12 
2. HDMI (High Definition Multi-Media Interface) Connector.................................................................12 
3. miniDP (Mini DisplayPort) Connector...............................................................................................12 
4. USB OTG (Type-C) Connector ........................................................................................................13 
5. Gigabit Ethernet Interface (LAN1/LAN2)..........................................................................................13 
6. Audio Connectors.............................................................................................................................14 
7. Power Input Connector.....................................................................................................................14 
8. PWR Button......................................................................................................................................14 
9. RST Button.......................................................................................................................................14 
10. Micro-SIM Connector......................................................................................................................14 
11. MicroSD Connector........................................................................................................................15 
12. LED Light Indicators.......................................................................................................................15 
13. Antenna Holes................................................................................................................................15 
14. Galvanic Isolated Connectors (TEK3-xxxxx-Rxx-Lxxx-xxx-xxxx-XG21-xxxx-xxxx) (optional).......16 
14.1. Galvanic Isolated Digital I/O Connectors (GPIO1/GPIO2) (optional)......................................17 
14.2. Galvanic Isolated Serial Port (RS-XXX) (optional) ..................................................................18 
15. Non-Galvanic Isolated Connectors (TEK3-xxxxx-Rxx-Lxxx-xxx-xxxx-XS21-xxxx-xxxx) (optional)19 
15.1. Non-Galvanic Isolated Digital I/O Connectors (GPIO1/GPIO2) (optional) ..............................20 
15.2. Non-Galvanic Isolated Serial Port (RS-XXX) (optional)...........................................................21 
Internal Connectors and Expansion Options ..........................................................................................22 
1. CMOS Jumper..................................................................................................................................22 
2. RTC Battery Connector....................................................................................................................23 
3. SO-DIMM DDR3L Slot......................................................................................................................23 
4. M.2 KEY-E Slot.................................................................................................................................23 
5. M.2 KEY-B Slot.................................................................................................................................23 

TEK3-BSW HARDWARE MANUAL –VER 1.00 APR 15 2019 
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BIOS Setup .............................................................................................................................................24 
1. Entering and Exiting BIOS................................................................................................................24 
2. BIOS Setup Screens Overview ........................................................................................................24 
2.1. Main ...........................................................................................................................................25 
2.2. Chipset.......................................................................................................................................26 
2.3. Advanced...................................................................................................................................27 
2.4. Boot............................................................................................................................................30 
2.5. Security......................................................................................................................................31 
2.6. Save & Exit ................................................................................................................................32 
Mounting..................................................................................................................................................33 
1. Surface Mounting .............................................................................................................................33 
2. DIN Mounting....................................................................................................................................33 
Ordering Information...............................................................................................................................34 
1. Custom Part Number Rule ...............................................................................................................34 
2. Standard Package Contents ............................................................................................................35 
Important Notice......................................................................................................................................36 
Disclaimer ...............................................................................................................................................37 
 

TEK3-BSW HARDWARE MANUAL –VER 1.00 APR 15 2019

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1. Introduction

1.1. General Care and Maintenance

Your device is a product of superior design and craftsmanship and should be treated with care.

The following suggestions will help you.

•Keep the device dry. Precipitation, humidity, and all types of liquids or moisture can contain

minerals that will corrode electronic circuits. If your device does get wet, allow it to dry completely.

•Do not use or store the device in dusty or dirty areas. Its parts and electronic components can be

damaged.

•Do not store the device in hot areas. High temperatures can shorten the life of electronic devices,

damage batteries, and warp or melt certain plastics.

•Do not store the device in cold areas. When the device returns to its normal temperature,

moisture can form inside the device and damage electronic circuit boards.

•Do not open the device while power is on. Otherwise electrical shock may result.

•Do not drop, knock, or shake the device. Rough handling can break internal circuit boards and

fine mechanics.

•Do not use harsh chemicals, cleaning solvents, or strong detergents to clean the device.

•Do not paint the device. Paint can clog the parts and prevent proper operation.

•Unauthorized modifications or attachments could damage the device and may violate regulations

governing radio devices.

These suggestions apply equally to your device, battery, charger, or any enhancement. If any device is

not working properly, take it to the nearest authorized service facility for service.

Regulatory information

Disposal of Waste Equipment by Users in Private Household in the European Union

This symbol on the product or on its packaging indicates that this product must not be

disposed of with your other household waste. Instead, it is your responsibility to dispose

of your waste equipment by handing it over to a designated collection point for the

recycling of waste electrical and electronic equipment. The separate collection and

recycling of your waste equipment at the time of disposal will help to conserve natural

resources and ensure that it is recycled in a manner that protects human health and the

environment. For more information about where you can drop off your waste equipment

for recycling, please contact your local city office, your household waste disposal service or the shop

where you purchased the product.

We hereby declare that the product is in compliance with the essential requirements and

other relevant provisions of European Directive 1999/5/EC (radio equipment and

telecommunications terminal equipment Directive).

TEK3-BSW HARDWARE MANUAL –VER 1.00 APR 15 2019

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2. TEK3-BSW Product Overview

2.1. Functional Block Diagram

TEK3-BSW HARDWARE MANUAL –VER 1.00 APR 15 2019

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2.2. Dimensions

The following figure shows the TEK3-BSW dimensions (unit: mm):

TEK3-BSW HARDWARE MANUAL –VER 1.00 APR 15 2019

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2.3. External Connectors

The TEK3-BSW has a number of external connectors.

Front view:

1 3 4 5 6 7 8 9

10 11 12 13 14

Rear view:

15 16 17 18 19 20 21 22

23 24 25 26

External Connectors:

No.

Description

No.

Description

USB Host connector

RS-XXX (Serial Port) connector (optional)

USB Host connector

Power button

HDMI connector

Reset button

miniDP connector

Micro-SIM cardslot

USB OTG (Type-C) connector

MicroSD cardslot

LAN2 RJ45 connector

LED Light 1 indicator

3.5mm jack Line out

LED Light 2 indicator

3.5mm jack Line in

LED Light 3 indicator

3.5mm jack Mic in

LED Light 4 indicator

Power Input connector

Antenna hole

LAN1 RJ45 connector

Antenna hole

GPIO1 connector (optional)

Antenna hole

GPIO2 connector (optional)

Antenna hole

TEK3-BSW HARDWARE MANUAL –VER 1.00 APR 15 2019

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2.4. Internal Board Connectors

The TEK3-BSW has several connectors, switches and internal expansion options.

2.4.1. Galvanic Isolated (TEK3-xxxxx-Rxx-Lxxx-xxx-xxxx-XG21-xxxx-xxxx)

Rear view (opened device) with the galvanic isolated I/0 Expansion and Power Expansion modules:

A B C

I/O Expansion Module Power Expansion

E Module

No.

Description

No.

Description

CMOS jumper

SW1 DIP switch

RTC Battery connector

SW3 Terminator Resistor DIP switch

SO-DIMM DDR3L slot

NOTE: Items marked with * are available on the galvanic isolated I/O Expansion module

(TXB-I2-GS2-GG8) (optional).

TEK3-BSW HARDWARE MANUAL –VER 1.00 APR 15 2019

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2.4.2. Non-Galvanic Isolated (TEK3-xxxxx-Rxx-Lxxx-xxx-xxxx-XS21-xxxx-xxxx)

Rear view (opened device) with the non-galvanic isolated I/0 Expansion and Power Expansion modules:

A B C

I/O Expansion Module Power Expansion

Module

No.

Description

No.

Description

CMOS jumper

SO-DIMM DDR3L slot

RTC Battery connector

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