ST STEVAL-IHM011V1 Manual de usuario

July 2007 Rev 2 1/27

UM0428

User manual

IGBT Power module evaluation kit - Semitop2 power board

Introduction

The Semitop2 evaluation board STEVAL-IHM011V1 is a complete platform to evaluate

STMicroelectronics power module devices (Semitop 2). Based on a cost effective, flexible

and open design, it is an evaluation platform compatible with the latest STMicroelectronics

microcontroller based solution. It includes the STG3P2M10N60B IGBT Power Module up to

10 amps, 600 voltage (see Note: 1). The STEVAL-IHM011V1 features a motor control

connector (MC-Connector) and hardware features for developing motor control applications

including hardware protection features such as current and thermal protection.

Figure 1. STEVAL-IHM011V1

Features

■34-pin dedicated motor control connector

■5-pin Hall sensor/encoder input

■Tachometer sensor input

■Support for 5 V or 3.3 V microcontroller

■Three configurations for current detection:

– 1 shunt resistor

– 3 shunt resistors or

– 3 external ICS (Insulated Current Sensor)

■Current amplification network

■BEMF detecting network

■Hardware current protection

■Hardware thermal protection (using on board temperature sensor)

■Resistive brake network

Note: 1 The kit has been designed and tested to work with European mains so maximum 380 VDC.

www.st.com

Contents UM0428

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Contents

1 System architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

2 Safety and operating instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.2 Reference design board intended use . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.3 Reference design board installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.4 Electronic connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.5 Reference design board operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

3 STG3P2M10N60B power module characteristics . . . . . . . . . . . . . . . . . . 6

3.1 General features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

4 Power board electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7

5 Board architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

5.1 MC Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

5.2 Mains connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

5.3 ICS connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

6 Board schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

6.1 Hardware protection features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

6.2 Extra features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

7 Motor control demonstration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

7.1 Environmental considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

7.2 Hardware requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

7.3 Power board setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

7.3.1 Configuring AC input range and shunt resistors configuration . . . . . . . . 16

7.3.2 Jumpers settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

7.4 Microcontroller voltage setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

7.5 Sensor voltage setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

7.5.1 Board connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

7.5.2 Changing the current hardware protection level . . . . . . . . . . . . . . . . . . 22

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8 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

System architecture UM0428

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1 System architecture

The generic motor control system can be schematized as the arrangement of four blocks

(see Figure 2):

●Control block

●Power block

●Motor

●Power supply

Figure 2. Motor control system architecture

The system proposed for the IGBT power module eval kit is composed of one control board

STEVAL-IHM010V1, one power board STEVAL-IHM011V1, one motor and the power

supply.

The control board STEVAL-IHM010V1 is a Microcontroller (ST7MC) based board that

provides the driving signals related to the motor selected and the driving strategies.

Driving signals are constituted of 6 PWM signals in the range of 0-5 V (see Note 2) paired in

High side/low side pairs of one signal for each leg. In the system proposed three legs are

present (three-phase inverter).

The Power Board STEVAL-IHM011V1 is based on a power module (STG3P2M10N60B)

that converts the control signal in the power signals to drive the motor. The connection

between the control board and the power board is performed through a dedicated 32-pin

connector called “motor control connector” (see Section 5.1: MC Connector).

The IGBT power module eval kit is able to drive the following kinds of motors:

●AC induction motor, sensored

●Brushless permanent magnet motor (trapezoidal driven), sensored or sensorless

●Brushless permanent magnet motor (sinusoidal driven), sensored

The power board is supplied by a high voltage AC power supply 220 V (or 110 V) with the

capability to generate current up to 10 amps.

2 The power board can accept control signals in the range of 0-3.3 V if the jumpers are

properly configured.

Control

Block

Power

Block

Power

Supply Moto

UM0428 Safety and operating instructions

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2 Safety and operating instructions

2.1 General

During assembly and operation, the IGBT power module eval kit poses several inherent

hazards, including bare wires, moving or rotating parts, and hot surfaces. There is danger of

serious personal injury and damage to property, if it is improperly used or installed

incorrectly.

All operations involving transportation, installation and use, as well as maintenance should

be carried out by skilled technical personnel (national accident prevention rules must be

observed). For the purposes of these basic safety instructions, "skilled technical personnel"

are suitably qualified people who are familiar with the installation, use, and maintenance of

power electronic systems.

2.2 Reference design board intended use

The IGBT power module eval kit boards are components designed for demonstration

purposes only, and shall not be used for electrical installation or machinery. The technical

data as well as information concerning the power supply conditions shall be taken from the

documentation and strictly observed.

2.3 Reference design board installation

The installation and cooling of the reference design boards shall be in accordance with the

specifications and the targeted application.

●The motor drive converters shall be protected against excessive strain. In particular, no

components are to be bent, or isolating distances altered during the course of

transportation or handling.

●No contact shall be made with other electronic components and contacts.

●The boards contain electrostatically sensitive components that are prone to damage

through improper use. Electrical components must not be mechanically damaged or

destroyed (to avoid potential health risks).

2.4 Electronic connection

Applicable national accident prevention rules must be followed when working on the main

power supply with a motor drive. The electrical installation shall be completed in accordance

with the appropriate requirements (e.g., cross-sectional areas of conductors, fusing, PE

connections).

2.5 Reference design board operation

A system architecture which supplies power to the IGBT power module eval kit boards shall

be equipped with additional control and protective devices in accordance with the applicable

safety requirements (e.g., compliance with technical equipment and accident prevention

rules).

STG3P2M10N60B power module characteristics UM0428

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Warning: Do not touch the design boards after disconnection from the

voltage supply, as several parts and power terminals which

contain possibly energized capacitors need to be allowed to

discharge.

3 STG3P2M10N60B power module characteristics

The STG3P2M10N60B is a 1-phase bridge rectifier plus a 3-phase inverter IGBT all

included inside a SEMITOP®2 module.

Figure 3. Power module

●VCES = 600 V

●IC= 10 A at 80 °

●VCE(sat)(max) < 2.5 V at IC=7 A TS=25 °C

3.1 General features

●N-channel very fast PowerMESH™ IGBT

●Lower on-voltage drop VCE(sat)

●Lower CRES / CIES ratio (no cross-conduction susceptibility)

●Very soft ultra fast recovery antiparallel diode

●High frequency operation up to 70 KHz

●New generation products with tighter parameter distribution

●Compact design

●Semitop®2 is a trademark of Semikron

UM0428 Power board electrical characteristics

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4 Power board electrical characteristics

Stresses above the limit shown in Table 2 may cause permanent damage to the device. This

is a stress rating only and functional operation of the device under these conditions is not

implied. Exposure to maximum rating conditions for extended periods may affect device

reliability. 35 V DC Bias Current measurement can be useful to check the working status of

the board. If the measured value is considerably greater than typical value, it means that

some damage has occurred in the board.

3 Before performing the test, the power board must be set up as described in Section 7.3:

Power board setup.

Table 1. Absolute maximum ratings

Symbol Parameter Value Unit

VCES Collector-emitter voltage (VGS = 0) 600 V

IC(1)

1. Calculated value

Collector current (continuous) at Ts= 25 °C 19 A

IC(1) Collector current (continuous) at Ts= 80 °C 10 A

VGE Gate-emitter voltage ±20 V

ICM (2)

2. Pulse width limited by max. junction temperature

TP<1 ms; Ts=25 °C 38 A

ICM TP<1 ms; Ts=80 °C 20 A

IFDiode RMS forward current at Ts= 25 °C 19 A

PTOT Total dissipation at Ts= 25 °C 56 W

VISO

Insulation withstand voltage AC

(t=1 min/sec; Ts=25 °C) 2500/3000 V

Tstg Storage temperature – 40 to 125 °C

TjOperating junction temperature – 40 to 150 °C

Table 2. Control board electrical characteristics

Power board electrical characteristics

STEVAL-IHM011V1

Unit

Min Max

AC Input Voltage J6 without voltage doubler (220 Vac configuration) 24 260 V

with voltage doubler (110 Vac configuration) 12 135 V

DC Input Voltage – J6 35 370 V

DC Bus current 10 A

15 V Auxiliary supply range J8-J9 14 15 V

35 V to J6 Bias current (typical) 50 50 mA

Board architecture UM0428

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5 Board architecture

The STEVAL-IHM011V1 can be schematized as in Figure 4.

Figure 4. Power board architecture

The power board is developed around the IGBT power module that contains the inverter

bridge constituted of six IGBT power switches and the AC rectifier bridge (see Figure 3).

The board has been designed to operate with a 5 V or 3.3 V microcontroller so the power

supply stage provides 15 V, 5 V, and 3.3 V voltage reference respectively for the driver and

for the control board and a configuration can be selected by the jumpers.

4Table 3 indicates the maximum current sourced by the power supply pins of the MC

connector (28 and 25).

The board can be configured to work with three different configurations for current sensing:

●1 Shunt resistor,

●3 Shunt resistors or

●3 Insulated Current Sensor ICS

The amplification network for current sensing is present and configurable for 1 or 3 signals.

In the one-shunt configuration the amplification is positive and the levels of the amplified

signal are compatible with the ST7MC control board STEVAL-IHM010V1 (range 0 V - 5 V).

Table 3. Maximum values of current sourced by internal voltage regulators

Voltage level Max current Unit

+ 5 V 750 mA

+ 3.3 V 900 mA

UM0428 Board architecture

9/27

In the three-shunt configuration, the amplification is positive and an offset is added to keep

the negative values of the current in the range of ADC also. The levels of the amplified

signals are compatible with 3.3 V microcontrollers.

5 To use the ICS, the operational amplifiers U1 network must be modified according to sensor

characteristics. For example using the LTSR 6-NP having Vo=2.5 V + 0.625*I/6 A, the

following steps are required:

– remove R1, R32, R52

– short circuit R21, R22, R44, R45, R65, R66

– replace R4, R28, R54, with 330 Ω

– replace R15, R35, R55 with 680 Ω

The BEMF conditioning network can be configured to use internal or external comparators.

For the ST7MC control board STEVAL-IHM010V1 internal comparators should be used.

The board is featured with a conditioning network for the following kinds of sensors:

●Hall sensors (three inputs H1, H2, H3)

●Encoder (one sensor with three inputs A+, B+, Z+)

●Tachometer sensor (one sensor)

Figure 5 shows the power board layout and the relative connectors.

Figure 5. Power board layout

5.1 MC Connector

The 34-pin MC connector has been designed as the standard to connect the control board

to the power board. Following the configuration of the MC connector, it is possible to design

a different control board or a power board preserving the compatibility between the two

Board architecture UM0428

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systems. For instance it is possible for any user to redesign the control board keeping the

compatibility with the power board if the standard MC connector configuration is used.

Figure 6. MC Connector pin out

Table 4. Motor control connector

Pin N. Description Pin on ST7MC

1 Emergency stop MCES

2 Ground VSS

3 High side PWM phase A MCO0

4 Ground VSS

5 Low side PWM phase A MCO1

6 Ground VSS

7 High side PWM phase B MCO2

8 Ground VSS

9 Low side PWM phase B MCO3

10 Ground VSS

11 High side PWM phase C MCO4

12 Ground VSS

13 Low side PWM phase C MCO5

14 BUS voltage AIN1

15 Phase A current

GNDFault (Shut_Down L6386)

PWM_1H

PWM_1L

PWM_2L

PWM_2H

PWM_3H

PWM_3L

NTC bypass Relay

GND

Current PhaseA

Current PhaseB

Current PhaseC

GND

Dissipative Brake PWM

Bus voltage

Heatsink temperature

GND

PFC PWM

PFC Sync

27 28

29 30

31 32

33 34

Encoder A

Encoder B Encoder Index

3V3

GND

Dedicated

DC[n]

DC[n+1]

DC[n+2]

GPI

GP PWM

GP capture

GP PWM

Dedicated

GP Capture

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