Sony DP-IF5000 Manual de usuario

– 1 –

SERVICE MANUAL

DP-IF5000

MICROFILM

DIGITAL SURROUND PROCESSOR

SPECIFICATIONS

Modulation System Frequency modulation

Carrier wave frequency Right channel 2.8 MHz

Left channel 2.3 MHz

Transmission distance Approx. 10 m

Frequency response 20 – 20,000 Hz

Distortion rate 1% or less (1 kHz)

Audio inputs Optical input

(square-type) ×1

Analog input (pin jack

right/left) ×1

Power requirements DC 9 V (from the

supplied AC power

adapter)

Dimensions (w/h/d) Approx. 85 ×190 ×180

Mass Approx. 1.0 kg

(1000 g)

Design and specifications are subject to

change without notice.

•DP-IF5000 is the component model block one in

MDR-DS5000.

COMPONENT MODEL NAME FOR MDR-DS5000

DIGITAL SURROUND PROCESSOR DP-IF5000

CORDLESS STEREO HEADPHONES MDR-IF5000

•Manufactured under license from Dolby Laboratories Licensing

Corporation.

DOLBY, the double-D symbol a, “PRO LOGIC”,

“Dolby Digital (AC-3)”, and “VIRTUAL DOLBY DIGITAL” are

trademarks of Dolby Laboratories Licensing Corporation.

Notes on Chip Component Replacement

•Never reuse a disconnected chip component.

•Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

Ver 1.1 1999. 02

US Model

Canadian Model

AEP Model

UK Model

E Model

– 2 –

TABLE OF CONTENTS

1. GENERAL

Listening to the Sound of a Connected Component ............... 3

2. DISASSEMBLY

2-1. Cover Assy .......................................................................... 5

2-2. Panel Assy, Front................................................................. 5

2-3. Panel Assy, Sub ................................................................... 6

2-4. TX Board ............................................................................ 6

3. SERVICE MODE

3-1. General ................................................................................ 7

3-2. Setting the Test Mode.......................................................... 7

3-3. Releasing the Test Mode ..................................................... 7

3-4. Test Mode ............................................................................ 7

4. ELECTRICAL ADJUSTMENTS................................... 8

5. DIAGRAMS

5-1. Block Diagram –Processor Section–...................................9

5-2. Block Diagram –Transmitter Section–.............................. 11

5-3. Printed Wiring Board

–Processor, Transmitter Section– ...................................... 14

5-4. Schematic Diagram –Processor Section– ......................... 17

5-5. Schematic Diagram –Transmitter Section– ...................... 20

5-6. Printed Wiring Board –LED Section– .............................. 22

5-7. Schematic Diagram –LED Section– ................................. 23

5-8. Printed Wiring Board –Amplifier Section–....................... 25

5-9. Schematic Diagram –Amplifier Section– ......................... 26

5-10. IC Pin Descriptions ........................................................... 29

6. EXPLODEDVIEW........................................................... 34

7. ELECTRICAL PARTS LIST......................................... 35

– 3 –

SECTION 1

GENERAL This section is extracted

from instruction manual.

– 4 –

– 5 –

SECTION 2

DISASSEMBLY

2-1. COVER ASSY

• The equipment can be removed using the following procedure.

Note : Follow the disassembly procedure in the numerical order given.

Set Cover assy Panel assy, front Panel assy, sub

TX board

2-2. PANEL ASSY, FRONT

cover assy

PTT 2.6X5

PTT 2.6X

PTT 2.6X5

lug plate

CN103

!º

panel assy, front

CN901

P 3X6

CN102

claws

PTT 2.6X5

– 6 –

2-3. PANEL ASSY, SUB

2-4.TX BOARD

LED board

panel assy, su

P 2.6X6

TX board

PTT 2.6X5

P 3X6

PTT 2.6X5

– 7 –

SECTION 3

SERVICE MODE

3-1. GENERAL

This set has the test mode of the built-in microprocessor which

allows various check items required repairing.

3-2. SETTINGTHETEST MODE

Press the POWER key and the EFFECT key at the same time and

turn on the power. (Insert the DC plug.)

3-3. RELEASINGTHETEST MODE

Press the POWER key to turn off the power. (Remove the DC plug.)

3-4.TEST MODE

1. LED check

LEDs go on in sequence *1)

All LEDs on

All LEDs off

DEMO key

Go to Key check

*1) In test mode

2. Key check

DEMO key

Go to Audio check

Press each key and its corresponding

LED goes on *2)

*2) Corresponding LEDs

POWER key : POWER LED

INPUT key : ANALOG LED

EFFECT key : MUSIC LED

OUTPUT key : VIRTUAL LED

3. Audio check

DEMO key

Go to IF test tone

ANALOG, HR and HL LEDs on *4) *6)

POWER, DIGITAL,

L and R LEDs on *3)

HL and HR LEDs off *5)

*3) Digital input check : Do not use this in repair.

*4) Analog input check :Other than MUTE check, do not use this

in repair.

*5) Mute mode : Use this in electrical adjustment (see page 8).

*6)

LCR

LS RS

HR LED

HL LED

4. IF test tone

POWER and MUSIC LEDs on

OUTPUT key

DEMO key

End of Test mode

1 kHz, –10 dBv

1 kHz, –30 dBv

100 Hz, –30 dBv

10 kHz, –30 dBv

1 kHz, FS

L LED on

C LED on

R LED on

RS LED on

LS LED on

– 8 –

TP L

TP R

TP L

TP R

SECTION 4

ELECTRICAL ADJUSTMENTS

Notes:

1. These adjustments are performed in the order that they are

described.

2. Adjustment and measurement are performed for each channel

unless otherwise specified.

3. Adjustment is made for the right channel first and then the left

channel.

4. The power voltage is supplied with 9V.

Oscillation Frequency Adjustment

Setting:

–

LED board

TP03 or TP04 (L-ch)

TP05 or TP06 (R-ch)

digital frequency

counter

Adjustment method:

• Perform this adjustment without signal.

1. Connect TP L (L-ch) and TP R (R-ch) to ground on the LED

board (to set the mute state), or use the test mode to set the mute

state (see page 7).

2. Connect a digital frequency counter to TP03 or TP04 for L-ch

and TP05 or TP06 for R-ch on the LED board.

3. Adjust L51 (L-ch) and L1 (R-ch) on the TX board so that the

reading on the digital frequency counter is each within 2.3 MHz

(L-ch) and 2.8 MHz (R-ch).

Specified value:

L-ch L51 2.298 to 2.302 MHz

R-ch L1 2.798 to 2.802 MHz

RF Level Adjustment

Setting:

digital voltmeter

–

LED board

TP03 or TP04 (L-ch)

TP05 or TP06 (R-ch)

Adjustment method:

• Perform this adjustment without signal.

1. Connect TP L (L-ch) and TP R (R-ch) to ground on the LED

board (to set the mute state), or use the test mode to set the mute

state (see page 7).

2. Connect a digital voltmeter to TP03 or TP04 for L-ch and TP05

or TP06 for R-ch on the LED board.

3. Adjust RV51 (L-ch) and RV1 (R-ch) on the TX board so that

the reading on the digital voltmeter is 480 mV.

Specified value:

L-ch RV51 477.5 to 482.5 mV

R-ch RV1 477.5 to 482.5 mV

Adjustment Location:

– TX board (side B) –

TP05

TP06

TP03

TP04

TP05

TP06

TP03

TP04

– LED board (conductor side) –

RV51 RF LEVEL

ADJUSTMENT

OSCILLATION

FREQUENCY

ADJUSTMENT

L51

RV1

– TX board (side A) –

– 9 – – 10 – – 11 –

DP-IF5000

5-1. BLOCK DIAGRAM — PROCESSOR SECTION —

– 12 –

SECTION 5

DIAGRAMS

5-2. BLOCK DIAGRAM — TRANSMITTER SECTION —

61 80

SPFRK SDI0

SDI1

SCKR

SCKT

WSR

WST

MISO/SDA BUSY

SCK/SCL

SDB

DIGITAL FRONT LR

SBC SDO0

VCCA

VCCD

REAR LR

BCK 64fs

L/R 1fs

SCKB

SCKA

WSB

WSA

B+

(+5V)

SCKIN MCK 256fs

GPIO0

B+

(+5V)

NAND

IC303

AC-3/PROLOGIC

SURROUND DECODER

IC301

LOGIC 3D

PROCESSOR

IC302

NAND

IC304

SO1

SCK

RESET

70 XT1

VCCA

SCK1

CLOCK 12M

56 47

•

17 B+

(+5V)

VCCS 40

•

B+

(+5V)

VCCQ

•

B+

(+5V)

B+

(+5V)

VCCP 30

HREQ 43

CS 42

RESET 36

GPIO3 73

GPIO2 74

GPIO1 75

GPIO0 76

EXTAL 27

B+

(+5V)

P20(SI1)

57 P01

37 P21(SO1)

58 P22(SCK1)

P12

49 P11

P64

SI1

S01

SCK1

RESET

SSZ11

P65 32

P66 33

P67 34

P17 54

P10 47

P24(BUSY) 61

P40 10

P41 11

P42 12

P43 13

P44 14

P50 18

P51 19

P52 20

P27 64

P26

P16

P15

P57

RESET

POWER

SELECT

MODE

EFFECT

DEMO

LEDEN EN

LAT

RES

SCK

MUTE

POWER A

POWER B

RESET

SIN O2

LEDLAT

LEDRES

SCK0

SO0

BLOCK

SW1-5

DISPLAY

LED DRIVE

IC206

14 8

RES

SCK

SIN

LAT O2

DISPLAY

LED DRIVE

IC205

3EN

CLK10

RST

BCKIN

LRCK

LR DATA

O8 5

TRANSMITTER

SECTION

TRANSMITTER

SECTION

DISPLAY

LED DRIVE

D201-208

DISPLAY

LED

D209-214,216

12 13

1 2

8 41

42 52

539

INVERTER

IC203(1/2)

10 6

CMOS LOGIC

IC201

CLOCK

X201

12.288MHz

INVERTER

IC203(2/2) B+

(+5V)

TRANSMITTER

SECTION

8319 SDA

D OUT

B+

(+3.3V)

•

VDD

B+

(+3.3V)

DIGITAL

AUDIO

INTERFACE

(1/2)

DECIMATION

FILTER

DELTA

SIGMA

MODULATOR

ANALOG

FRONT END

ANALOG

FRONT END

–

V IN L

V IN R

A/D CONVERTER

IC102 (1/2)

–

LINE AMP

IC101

ATT SW

Q101

ATT SW

Q102

B+

(+9V)

SW101

ATT

0dB

–6dB

ANALOG L

ANALOG R

LINE INPUT

J101

–1

–2

OUT

VCC

OPTICAL

RECEIVER

MODULE

IC305

DIGITAL IN B+

(+5V)

DIGITAL

: DIGITAL

Signal path

PROGRAM,

SYSTEM

CONTROL

IC105

: ANALOG

PROCESSOR

SECTION

1DIGITAL

AUDIO

INTERFACE

(2/2)

–

LR DATA

PROCESSOR

SECTION 2

LRCK

BCK IN

CLK10

RST

INTERPOLATION

FILTER DELTA SIGMA

MODULATION

CLK/OSC

MANAGER

RESET

BIAS

LPF

BUFFER

LPF

BUFFER

V OUT L

V COM

V OUT R

BINAURAL L

BINAURAL R

D/A CONVERTER

IC102 (2/2)3

–

MUTE

Q31

MUTE

Q32

MUTE

Q901

MUTE

Q902

MUTING

Q33,34

PROCESSOR

SECTION 3

MUTE

POWER A

POWER B

RESET

BINAURAL R

B+ (SW+5V)

BINAURAL L

RV901

PHONES

LEVEL

HEADPHONES

AMP

IC901

J901

PHONES

+9V

REG

IC805

B+

(+9V)

LF801

B+

(SW+9V)

B+

(SW+5V)

B+

(+5V)

+9V

REG

IC804

SW+9V

REG

Q803

RESET

IC204 +5V

REG

IC801

+5V

REG

IC802

+3.3V

REG

IC803

B+

(+3.3V)

J801

DC IN 9V

AFC

IC1

AUDIO AMP

IC103

L51

FREQUENCY

(L-CH)

RV51

RF LEVEL

(L-CH)

2.3MHz OSC

COIL

FREQUENCY

(R-CH)

2.8MHz OSC

COIL

OSC

Q51

OSC

BUFFER

Q52 LED

DRIVE

Q301,351

LED

DRIVE

Q302,352

RV1

RF LEVEL

(R-CH)

BUFFER

REG

SWITCH

Q35, 36

B+

(+9V)

B+

(+9V)

INFRARED

EMITTER

D301-304

INFRARED

EMITTER

D305-308

D51

DIN

• Signal path

: DIGITAL

: ANALOG

: RF

-1

-2

– 13 – – 14 – – 15 – – 16 –

DP-IF5000

5-3. PRINTEDWIRING BOARD — PROCESSOR,TRANSMITTER SECTION —

TP L

TP R

( ) ( )

2345678910111213141516171819202122

Note:

•X: parts extracted from the component side.

•®: Through hole.

•b: Pattern from the side which enables seeing.

(The other layer’s patterns are not indicated.)

Caution:

Pattern face side: Parts onthe pattern face side seenfrom the

(Side B) pattern face are indicated.

Parts face side: Parts on the par ts faceside seen from the

(Side A) parts face are indicated.

D1 G-3

D51 F-3

D101 H-9

D102 H-9

IC1 F-4

IC101 F-9

IC102 F-6

IC103 E-8

IC105 B-3

IC201 D-2

IC202 D-3

IC204 E-4

IC301 C-7

IC302 C-5

IC303 D-6

IC304 E-6

(IC305) C-12

(IC801) H-14

(IC802) I-7

(IC803) C-12

(IC804) I-14

(IC805) H-17

Q1 G-3

Q2 H-2

Q31 F-3

Q32 G-3

Q33 F-5

Q34 F-4

Q35 G-4

Q36 G-5

Q51 F-3

Q52 F-2

Q101 F-9

Q102 G-9

Q803 H-8

• Semiconductor

Location

Ref. No. Location

( ) : SIDE B

(Page 25)

(Page 22)

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