Sony Ericsson K330 Manual de usuario
Working Instruction, Electrical
1219-0637 Rev 2
Working Instruction, Electrical
Applicable for K330
CONTENTS
1Read this first!...................................................................................................2
2Lead-free soldering...........................................................................................3
3BGA equipment reflow profiles........................................................................5
3.1 General.................................................................................................. 5
3.2 Temperature Measurements ................................................................. 5
3.3 Reflow Profiles ...................................................................................... 6
4Replacement of components...........................................................................7
4.1 Shielding Cover BB ............................................................................... 8
4.2 D12: TVS Diode 24V 50pF.................................................................... 9
4.3 D71: TVS Diode 12V 38pF................................................................... 9
4.4 D101: Protection DIODE ....................................................................... 9
4.5 J1: LCD ZIF Connector ....................................................................... 10
4.6 J2: SIM Connector............................................................................... 10
4.7 J4: Microphone.................................................................................... 10
4.8 J6: Battery Connector.......................................................................... 11
4.9 J7: Board to Board Connector (Keypad PCB)..................................... 11
4.10 U100: Illumination Pump ..................................................................... 11
4.11 U601: Audio Amplifier.......................................................................... 12
4.12 U606: FM Module................................................................................ 12
4.13 U706: Voltage Level Shifter................................................................. 12
4.14 U8: Charge IC ..................................................................................... 13
4.15 U9: IC Charging................................................................................... 13
4.16 Z1002: Camera Socket ....................................................................... 13
4.17 Z901: Antenna Connector ................................................................... 14
4.18 Z902: RF Connector............................................................................ 14
5Revision history ..............................................................................................15
Company Internal ©Sony Ericsson Mobile Communications AB
Working Instruction, Electrical
1219-0637 Rev 2 2(15)
1 Read this first!
zBefore you start replacing any components, make sure you have read and fully understood
the contents of section 2 and 3!
zAlso make sure you have access to the mechanical Working Instruction and the equipment
listed on the first page of section 4!
Company Internal ©Sony Ericsson Mobile Communications AB
Working Instruction, Electrical
1219-0637 Rev 2 3(15)
2 Lead-free soldering
THIS PRODUCT IS MANUFACTURED WITH LEAD-
FREE SOLDER AND LEAD-FREE COMPONENTS!
During electrical repair, it is critical to make sure that no
lead is introduced. This symbol indicates that the product
is lead- free.
All lead-free PBAs will be marked with this symbol.
A lead-free work area must be set up completely
separated from work areas that are used to make lead
repairs. The lead-free work area must also be clearly
labeled with the lead free symbol as shown in the
adjacent picture. The items on this desk must remain
lead-free. They must be adequately labeled to make their
lead-free status clearly and easily recognized.
Company Internal ©Sony Ericsson Mobile Communications AB
Working Instruction, Electrical
1219-0637 Rev 2 4(15)
Lead-free soldering continued
LFS (lead-free solder paste) characteristics:
zHigh melting point (typically 220°C)
zLow wet ability
zHigh surface tension
zDifficult to spread
zRecommended tip temperature = 370°C
WHEN SERVICING PBAS THAT HAVE BEEN
MANUFACTURED WITH LFS (LEAD-FREE SOLDER
PASTE), LFS MUST BE USED! IF NOT, THERE IS A
HIGH RISK OF UNRELIABLE SOLDERING
JOINTS!
Lead-free solder joints are more difficult to inspect
because they do not have shiny surfaces like leaded
solder joints. Also, lead-free solder does not flow as well
as leaded solder, so some of the solder pad areas may
remain exposed.
Company Internal ©Sony Ericsson Mobile Communications AB
Working Instruction, Electrical
1219-0637 Rev 2 5(15)
3 BGA equipment reflow profiles
3.1 General
This document contains reflow profile recommendations for mobile phones and similar products.
They are just general recommendations and considerations have to be taken for every single product.
The solder paste is secondary but could also affect the parameters.
In this document one alloy is specified:
SnAgCu (Lead free) melting point 217°C
3.2 Temperature Measurements
At least four probes should be used.
They should be placed on components with the highest and lowest thermal mass.
The probes shall be located in the beginning, in the middle and at the end of the board/panel.
It is recommended that the probes are soldered on the board, but glue and capton tape can be used.
At least one probe shall be placed in the air or on top of a component.
These values are strongly depending on the BGA replacement equipment.
Nozzle type will be chosen after the outer size of the actual component.
Make sure the nozzle does not affect any nearby placed components.
THESE VALUES ARE RECOMMENDATIONS AND MAY HAVE TO BE CHANGED DEPENDING
ON THE TYPE OF EQUIPMENT!
THE MAXIMUM TEMPERATURE FOR ANY COMPONENT MUST NOT EXCEED 250°C!
Company Internal ©Sony Ericsson Mobile Communications AB
Working Instruction, Electrical
1219-0637 Rev 2 6(15)
3.3 Reflow Profiles
Sn/Ag/Cu (lead-free)
Ramp rate < 4°C/sec
Ramp rate cooling zone < 6°C/sec
Time above liquidus 60-150 sec
Minimum temperature 235°C
Maximum temperature 245°C or 260°C for 10 sec.
(the higher temperature in case the
board has extremely high ΔT)
Bottom heat temperature 125°C-150°C
Total time Approx. 4-7 min
Company Internal ©Sony Ericsson Mobile Communications AB
Working Instruction, Electrical
1219-0637 Rev 2 7(15)
4 Replacement of components
EQUIPMENT
zDentist hook
zESD-gloves (cotton gloves)
zESD-wristband
zSoldering tool
zHot air soldering station
zBGA replacement equipment
zPair of tweezers
zSolder cleaning wiper (tin wick)
zSolder paste lead-free (SN 96% Ag 3.5% Cu 0.5%)
zFlux, RMA no-clean flux
zCutting pliers
zShield fence pliers NTZ 112 537
CAUTION
zKeep all contact surfaces clean of dirt and hand-grease!
MECHANICAL INSTRUCTIONS
For all the following part replacements, disassemble and assemble the phone as described in
Working Instruction 3/00021-1/FEA 209 544/X.
Company Internal ©Sony Ericsson Mobile Communications AB
Working Instruction, Electrical
1219-0637 Rev 2 8(15)
4.1 Shielding Cover BB
BE CAREFUL NOT TO DAMAGE ANY COMPONENTS
SURROUNDING THE SHIELDING FRAME!
Use minus screwdrivers to raise the corner of shielding
cover.
Continue with the same procedure on all other corners to
remove the Shielding Cover
USE A NEW SHIELDING COVER!
Press the shielding cover down to snap all hooks onto
shielding frame until you hear a ‘Click’ sound.
Company Internal ©Sony Ericsson Mobile Communications AB
Working Instruction, Electrical
1219-0637 Rev 2 9(15)
4.2 D12: TVS Diode 24V 50pF
REMOVE THE LOUD SPEAKER GASKET,SYSTEM
CONNECTOR AND SYSTEM CONNECTOR GASKET.
Replace the Protection Diode with a soldering iron or hot
air soldering equipment.
NOTE THE POLARITY!
Replace a new Loud Speaker Gasket. Mount the System
Connector Gasket and System Connector.
4.3 D71: TVS Diode 12V 38pF
REMOVE THE LOUD SPEAKER GASKET,SYSTEM
CONNECTOR AND SYSTEM CONNECTOR GASKET.
Replace the Protection Diode with a soldering iron or hot
air soldering equipment.
NOTE THE POLARITY!
Replace a new Loud Speaker Gasket. Mount the System
Connector Gasket and System Connector.
4.4 D101: Protection DIODE
REMOVE THE SHIELD CAN LID.
Replace the Protection Diode with a soldering iron or hot
air soldering equipment.
NOTE THE POLARITY!
Replace a new Shield Can Lid
Company Internal ©Sony Ericsson Mobile Communications AB
Working Instruction, Electrical
1219-0637 Rev 2 10(15)
4.5 J1: LCD ZIF Connector
Remove the ZIF Connector with hot air soldering
equipment.
Replace a new Connector with a soldering iron. Bottom
heat is required.
4.6 J2: SIM Connector
Remove the SIM Connector with hot air soldering
equipment.
Replace a new Connector with a soldering iron.
4.7 J4: Microphone
Replace the Microphone with hot air soldering equipment.
Protect the new Microphone with heat resisting tape.
Company Internal ©Sony Ericsson Mobile Communications AB
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