
Technical Manual MIVI 9612
Réf. 254-31/0 3
TABLE OF CONTENT
1. GENERAL PRESENTATION .......................................................................................................5
1.1.
T
HE SENSOR
...............................................................................................................................5
1.2.
T
HE PROCESSOR
.........................................................................................................................5
1.3.
C
HECKING THE EQUIPMENT AT THE RECEIPT
..................................................................................6
1.4.
C
HECKING THE EQUIPMENT WHEN PLACED AT THE PROCESS
..........................................................6
1.5.
P
ERIODIC CHECKING
....................................................................................................................6
1.5.1. Offset adjustment in air.......................................................................................................6
1.5.2. Modification of the previous calibration................................................................................7
1.6.
D
IRECTIVES AND
S
TANDARDS
......................................................................................................7
1.6.1. Certification ATEX...............................................................................................................7
1.6.2. Installation in hazardous area .............................................................................................7
1.6.3. European Pressure Equipment Directive.............................................................................8
1.6.4. EMC and low voltage directive............................................................................................8
2. VISCOSITY SENSOR...................................................................................................................9
2.1.
V
ARIOUS MODELS
........................................................................................................................9
2.2.
S
ENSOR INSTALLATION
................................................................................................................9
2.2.1. Elbow mounting ................................................................................................................10
2.2.2. Plane side mounting..........................................................................................................10
2.2.3. Pot mounting, for small flow rates, or pilot plant ................................................................10
2.2.4. Special mountings.............................................................................................................10
2.2.5. Replacement cap..............................................................................................................10
2.3.
P
RACTICAL ADVICES
..................................................................................................................11
2.4.
C
HECKING
................................................................................................................................11
2.5.
S
ENSOR WIRING
........................................................................................................................11
2.6.
M
ODELS AND DIMENSIONS
.........................................................................................................13
2.7.
T
IGHTNESS
...............................................................................................................................14
3. TRANSDUCER’S MECHANICAL CHARACTERISTICS............................................................15
3.1.
H
OUSING
’
S MECHANICAL CHARACTERISTICS
................................................................................15
3.2.
T
RANSDUCER
’
S ELECTRONIC BOARD WIRING
...............................................................................15
4. PROCESSOR TECHNICAL CHARACTERISTICS.....................................................................16
4.1.
M
ECHANICAL CHARACTERISTICS
.................................................................................................16
4.2.
D
ISPLAY
...................................................................................................................................16
4.3.
K
EYBOARD
................................................................................................................................16
4.4.
B
ATTERY
..................................................................................................................................16
4.5.
C
ONSUMPTION
..........................................................................................................................17
4.6.
P
OWER SUPPLY WIRING
.............................................................................................................17
4.7.
C
ONNECTION BLOCKS
................................................................................................................17
4.8.
A
NALOG
I
NPUTS
........................................................................................................................18
4.9.
A
NALOG INPUTS CONNECTION
(
DENSIMETERS
)............................................................................18
4.10.
R
ELAY OUTPUTS
......................................................................................................................19
4.11.
A
NALOG OUTPUTS
...................................................................................................................19
4.12.
O
UTPUTS WIRING SCHEME
.......................................................................................................20
4.13.
G
ENERAL INFORMATION
...........................................................................................................20
4.14.
W
ASTES HANDLING
..................................................................................................................20
5. MOUNTING THE PROCESSOR - INSTALLATION....................................................................21