Seco UQseven uQ7-962 Manual de usuario

μQ7-962

μQseven®Rel. 2.0 Compliant

Module with NXP i.MX6 Processor

μQ7-962

Unauthorised use, duplication, modification or disclosure of the information to a third-party by any means without prior consent of SECO S.r.l. is prohibited.

Every effort has been made to ensure the accuracy of this manual. However, SECO S.r.l. accepts no responsibility for any inaccuracies, errors or omissions herein.

SECO S.r.l. reserves the right to change precise specifications without prior notice to supply the best product possible.

For further information on this module or other SECO products, but also to get the required assistance for any and possible issues, please contact us using the

dedicated web form available at http://www.seco.com (registration required).

Our team is ready to assist you.

Revision

Date

Note

Rif

1.0

29th January 2013

First Release

1.1

8th May 2013

Introduction and Technical features revised

Block Diagram updated

Power consumption added

Qseven®golden finger pinout updated

1.2

8th October 2013

GPIO pins on golden finger connector updated

2.0

9th November 2013

New manual release

2.1

5th May 2014

LPC bus referrals removed

MFG_NC1 and MFG_NC2 pin names corrected on paragraph 3.2.1.15

2.2

10th July 2014

Added I2C table in par. 3.2.1.14

2.3

28th August 2014

GPI/O table descriptor added in par. 3.2.1.10

Heatspreader and heatsink description updated in par. 4.1

2.4

29th May 2015

Qseven®connector s pins 125, 127 description corrected

2.5

29th October 2015

UART0_RTS# and UART0_CTS# signals removed from Qseven®connectors pins 172,

178. Paragraph 3.2.3.2 updated consequently

3.0

26th January 2016

Product name change

3.1

23rd August 2016

Manufacturing signals paragraph corrected

REVISION HISTORY

μQ7-962

INDEX

INTRODUCTION.......................................................................................................................................................................... 4Chapter 1.

1.1 Warranty........................................................................................................................................................................................................................................ 5

1.2 Information and assistance............................................................................................................................................................................................................. 6

1.3 RMA number request..................................................................................................................................................................................................................... 6

1.4 Safety............................................................................................................................................................................................................................................ 7

1.5 Electrostatic Discharges.................................................................................................................................................................................................................7

1.6 RoHS compliance.......................................................................................................................................................................................................................... 7

1.7 Terminology and definitions ............................................................................................................................................................................................................8

1.8 Reference specifications ..............................................................................................................................................................................................................10

OVERVIEW ............................................................................................................................................................................... 12Chapter 2.

2.1 Introduction.................................................................................................................................................................................................................................. 13

2.2 Technical Specifications...............................................................................................................................................................................................................14

2.3 Electrical Specifications................................................................................................................................................................................................................15

2.3.1 Power Consumption ............................................................................................................................................................................................................15

2.3.2 Power Rails meanings.......................................................................................................................................................................................................... 15

2.4Mechanical Specifications............................................................................................................................................................................................................16

2.5 Supported Operating Systems .....................................................................................................................................................................................................16

2.6 Block Diagram .............................................................................................................................................................................................................................17

CONNECTORS......................................................................................................................................................................... 18Chapter 3.

3.1 Introduction.................................................................................................................................................................................................................................. 19

3.2 Connectors description................................................................................................................................................................................................................20

3.2.1 Qseven®Connector.............................................................................................................................................................................................................20

Appendices.............................................................................................................................................................................. 38Chapter 4.

4.1 Thermal Design............................................................................................................................................................................................................................39

μQ7-962

Chapter 1.

Warranty

Information and assistance

RMA number request

Safety

Electrostatic Discharges

RoHS compliance

Terminology and definitions

Reference specifications

μQ7-962

1.1Warranty

This product is subject to the Italian Law Decree 24/2002, acting European Directive 1999/44/CE on matters of sale and warranties to consumers.

The warranty on this product lasts for 1 year.

Under the warranty period, the Supplier guarantees the buyer assistance and service for repairing, replacing or credit of the item, at the Supplier’s own discretion.

Shipping costs that apply to non-conforming items or items that need replacement are to be paid by the customer.

Items cannot be returned unless previously authorised by the supplier.

The authorisation is released after completing the specific form available on the web-site http://www.seco.com/en/prerma (RMA Online). The RMA authorisation

number must be put both on the packaging and on the documents shipped with the items, which must include all the accessories in their original packaging, with

no signs of damage to, or tampering with, any returned item.

The error analysis form identifying the fault type must be completed by the customer and has must accompany the returned item.

If any of the above mentioned requirements for RMA is not satisfied, the item will be shipped back and the customer will have to pay any and all shipping costs.

Following a technical analysis, the supplier will verify if all the requirements, for which a warranty service applies, are met. If the warranty cannot be applied, the

Supplier will calculate the minimum cost of this initial analysis on the item and the repair costs. Costs for replaced components will be calculated separately.

Warning!

All changes or modifications to the equipment not explicitly approved by SECO S.r.l. could impair the equipment’s functionality and

could void the warranty

μQ7-962

1.2Information and assistance

What do I have to do if the product is faulty?

SECO S.r.l. offers the following services:

SECO website: visit http://www.seco.com to receive the latest information on the product. In most of the cases it is possible to find useful information to

solve the problem.

SECO Sales Representative: the Sales Rep can help to determine the exact cause of the problem and search for the best solution.

SECO Help-Desk: contact SECO Technical Assistance. A technician is at disposal to understand the exact origin of the problem and suggest the correct

solution. E-mail: technical.se[email protected]

Fax (+39) 0575 340434

Repair center: it is possible to send the faulty product to the SECO Repair Centre. In this case, follow this procedure:

oReturned items must be accompanied by a RMA Number. Items sent without the RMA number will be not accepted.

oReturned items must be shipped in an appropriate package. SECO is not responsible for damages caused by accidental drop, improper usage, or

customer neglect.

Note: Please have the following information before asking for technical assistance:

-Name and serial number of the product;

-Description of Customer’s peripheral connections;

-Description of Customer’s software (operating system, version, application software, etc.);

-A complete description of the problem;

-The exact words of every kind of error message encountered.

1.3RMA number request

To request a RMA number, please visit SECO’s web-site. On the home page, please select “RMA Online”and follow the procedure described.

A RMA Number will be sent within 1 working day (only for on-line RMA requests).

μQ7-962

Whenever handling a μ

Q7-962 module, ground yourself through an anti-static wrist strap. Placement of the board on an anti-static

surface is also highly recommended.

1.4Safety

The μQ7-962 module uses only extremely-low voltages.

While handling the board, please use extreme caution to avoid any kind of risk or damages to electronic components.

1.5 Electrostatic Discharges

The μQ7-962 module, like any other electronic product, is an electrostatic sensitive device: high voltages caused by static electricity could damage some or all the

devices and/or components on-board.

1.6 RoHS compliance

The μQ7-962 module is designed using RoHS compliant components and is manufactured on a lead-free production line. It is therefore fully RoHS compliant.

Always switch the power off, and unplug the power supply unit, before handling the board and/or connecting cables or other boards.

Avoid using metallic components - like paper clips, screws and similar - near the board when connected to a power supply, to avoid

short circuits due to unwanted contacts with other board components.

If the board has become wet, never connect it to any external power supply unit or battery.

Check carefully that all cables are correctly connected and that they are not damaged.

μQ7-962

1.7 Terminology and definitions

AC’97 Audio Codec’97, a standard for audio hardware codecs developed by Intel®in 1997

ACPI Advanced Configuration and Power Interface, an open industrial standard for the board’s devices configuration and power management.

API Application Program Interface, a set of commands and functions that can be used by programmers for writing software for specific Operating

Systems

CAN Bus Controller Area network, a protocol designed for in-vehicle communication

CEC Consumer Electronics Control, an HDMI feature which allows controlling more devices connected together by using only one remote control.

CPLD Complex Programmable Logic Device, a type of programmable logical device with complexity lower than that of FPGAs

CSI2 MIPI Camera Serial Interface, 2nd generation standard regulating communication between a peripheral device (camera) and a host processor

DDC Display Data Channel, a kind of I2C interface for digital communication between displays and graphics processing units (GPU)

DDR Double Data Rate, a typology of memory devices which transfer data both on the rising and on the falling edge of the clock.

DDR3 DDR, 3rd generation

DVI Digital Visual interface, a type of display video interface

FFC/FPC Flexible Flat Cable / Flat Panel Cable

FPGA Field-programmable gate array, a device designed to be fully programmed by customers in order to implement different functionalities.

GBE Gigabit Ethernet

Gbps Gigabits per second

GND Ground

GPI/O General purpose Input/Output

HD Audio High Definition Audio, most recent standard for hardware codecs developed by Intel®in 2004 for higher audio quality

HDMI High Definition Multimedia Interface, a digital audio and video interface

I2C Bus Inter-Integrated Circuit Bus, a simple serial bus consisting only of data and clock line, with multi-master capability

JTAG Joint Test Action Group, common name of IEEE1149.1 standard for testing printed circuit boards and integrated circuits through the Debug port.

LVDS Low Voltage Differential Signalling, a standard for transferring data at very high speed using inexpensive twisted pair copper cables, usually used

for video applications

Mbps Megabits per second

MIPI Mobile Industry Processor Interface alliance

MMC/eMMC MultiMedia Card / embedded MMC, a type of memory card, having the same interface as the SD card. The eMMC is the embedded version of

the MMC. They are devices that incorporate the flash memories on a single BGA chip.

μQ7-962

N.A. Not Applicable

N.C. Not Connected

OpenCL Open Computing Language, a software library based on C99 programming language, conceived explicitly to realise parallel computing using

Graphics Processing Units (GPU)

OpenGL Open Graphics Library, an Open Source API dedicated to 2D and 3D graphics

OpenVG Open Vector Graphics, an Open Source API dedicated to hardware accelerated 2D vector graphics

OTG On-the-Go, a specification that allows to USB devices to act indifferently as Host or as a Client, depending on the device connected to the port.

PCI-e Peripheral Component Interface Express

PWM Pulse Width Modulation

PWR Power

RGMII Reduced Gigabit Media Independent Interface, a standard interface between the Ethernet Media Access Control (MAC) and the Physical Layer

(PHY) with speed up to 1000Mbps

SATA Serial Advance Technology Attachment, a differential half duplex serial interface for Hard Disks.

SD Secure Digital, a memory card type

SDIO Secure Digital Input/Output, an evolution of the SD standard that allows the use of the same SD interface to drive different Input/Output devices,

like cameras, GPS, Tuners and so on.

SM Bus System Management Bus, a subset of the I2C bus dedicated to communication with devices for system management, like a smart battery and

other power supply-related devices.

SPI Serial Peripheral Interface, a 4-Wire synchronous full-duplex serial interface which is composed of a master and one or more slaves, individually

enabled through a Chip Select line.

TBM To be measured

TMDS Transition-Minimized Differential Signalling, a method for transmitting high speed serial data, normally used on DVI and HDMI interfaces

TTL Transistor-transistor Logic

USB Universal Serial Bus

uSDHC Ultra Secure Digital Host Controller

V_REF Voltage reference Pin

μQ7-962

1.8 Reference specifications

Here below it is a list of applicable industry specifications and reference documents.

Reference

Link

AC’97

http://download.intel.com/support/motherboards/desktop/sb/ac97_r23.pdf

ACPI

http://www.acpi.info

CAN Bus

http://www.bosch-semiconductors.de/en/ubk_semiconductors/safe/ip_modules/can_literature/can_literature.html

CSI

http://www.mipi.org/specifications/camera-interface

DDC

http://www.vesa.org

Gigabit Ethernet

http://standards.ieee.org/about/get/802/802.3.html

HD Audio

http://www.intel.com/content/dam/www/public/us/en/documents/product-specifications/high-definition-audio-specification.pdf

HDMI

http://www.hdmi.org/index.aspx

I2C

http://www.nxp.com/documents/other/UM10204_v5.pdf

JTAG

http://standards.ieee.org/develop/wg/Boundary_Scan_Architecture.html

LVDS

http://www.ti.com/ww/en/analog/interface/lvds.shtml

http://www.ti.com/lit/ml/snla187/snla187.pdf

MIPI

http://www.mipi.org

MMC/eMMC

http://www.jedec.org/committees/jc-649

OpenCL

http://www.khronos.org/opencl

OpenGL

http://www.opengl.org

OpenVG

http://www.khronos.org/openvg

PCI Express

http://www.pcisig.com/specifications/pciexpress

Qseven®Design Guide

http://www.sget.org/uploads/media/Qseven_Design_Guide_2_0.pdf

Qseven®specifications

http://www.sget.org/uploads/media/Qseven-Spec_2.0_SGET.pdf

SATA

https://www.sata-io.org

SD Card Association

https://www.sdcard.org/home

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