COMe-cTL6 – User Guide Rev. 1.7
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2.3.23. Carrier Board Reset (CB_RESET#) ............................................................................................................................................... 33
2.3.24. System Reset (SYS_RESET#) ........................................................................................................................................................ 33
2.3.25. Power Button (PWRBTN#) .............................................................................................................................................................33
2.3.26. Batlow ...................................................................................................................................................................................................33
2.3.27. LID Switch (LID#) ...............................................................................................................................................................................33
2.3.28. Sleep Button (SLEEP#) ....................................................................................................................................................................33
2.3.29. External SPI/GSPI Support .............................................................................................................................................................34
2.3.30. Speaker Out (SPKR)...........................................................................................................................................................................34
2.3.31. Watchdog Timeout (WDT)...............................................................................................................................................................34
2.3.32. General Purpose IOs ......................................................................................................................................................................... 35
2.3.33. External Fan support........................................................................................................................................................................ 35
2.3.34. UART Serial Ports .............................................................................................................................................................................. 35
2.3.35. Hardware Monitor (HWM).............................................................................................................................................................. 35
2.3.36. Trusted Platform Module (TPM) ..................................................................................................................................................36
2.3.37. Embedded Controller (CPLD)......................................................................................................................................................... 36
2.3.38. SPI BIOS Memory ...............................................................................................................................................................................36
2.4. Electrical Specification .......................................................................................................................................................................... 37
2.4.1. Power Supply Specifications ............................................................................................................................................................ 37
2.4.2. Power Management ...........................................................................................................................................................................38
2.4.3. Power Supply Control Settings .......................................................................................................................................................38
2.4.4. Power Supply Modes..........................................................................................................................................................................39
2.4.5. Single Supply Mode.............................................................................................................................................................................40
2.5. Thermal Management ............................................................................................................................................................................41
2.5.1. Heatspreader and Active or Passive Cooling Solutions............................................................................................................41
2.5.2. Active or Passive Cooling Solutions................................................................................................................................................41
2.5.3. Operating with Kontron Heatspreader Plate (HSP) Assembly...............................................................................................41
2.5.4. Operating without Kontron Heatspreader Plate (HSP) Assembly........................................................................................41
2.5.5. Temperature Sensors.........................................................................................................................................................................42
2.5.6. Onboard Fan Connector.....................................................................................................................................................................43
2.6. Environmental Specification................................................................................................................................................................44
2.7. Compliance ................................................................................................................................................................................................44
2.7.1. MTBF .........................................................................................................................................................................................................45
2.8. Mechanical Specification......................................................................................................................................................................47
2.8.1. Dimensions .............................................................................................................................................................................................47
2.8.2. Height.......................................................................................................................................................................................................48
2.8.3. Heatspreader Dimension ..................................................................................................................................................................48
3/ Features and Interfaces..................................................................................................................................................................49
3.1. Fast I2C ........................................................................................................................................................................................................49
3.2. GPIO..............................................................................................................................................................................................................49
3.3. Kontron Security Solution.....................................................................................................................................................................49
3.4. LPC................................................................................................................................................................................................................49
3.5. Real Time Clock (RTC) ............................................................................................................................................................................50
3.6. Serial Peripheral Interface (SPI)..........................................................................................................................................................50
3.6.1. SPI Boot....................................................................................................................................................................................................50
3.7. Trusted Platform Module (TPM 2.0) ..................................................................................................................................................51
3.8. UART .............................................................................................................................................................................................................51
3.9. Watchdog Timer (WTD) Dual Stage ...................................................................................................................................................51
3.9.1. WDT Signal.............................................................................................................................................................................................. 52
4/ System Resources............................................................................................................................................................................. 53
