Samsung Inkjet SCX-1150F Instrucciones de funcionamiento
Repair Manual
Repair Manual
1. Block Diagram
2. Connection Diagram
3. Circuit Description
4. Schematic Diagrams
CONTENTS
INKJET PRINTER(MFP)
SCX-1150F
1
1-1
Samsung Electronics
BLOCK DIAGRAM
Repair Manual
1. Block Diagram
AC
( 110~240
(64Mbit)
V)
SMPS
( 30V, 3. 3V)
Jupi t er 3
UART 3
I/OPORT
INT. CNTR
USB
FLASH
Thunder bolt
MOTOR CCD Module
SCANSTEPPER
SCAN MOTOR
(UNI -POLAR STEP)
COLOR
MONO
CA RT RI DG E
RESET
USB
PC
10MHz
48MH z
P1284 CONN
SCANNER
BU F FE
600/ / 600
Tx/ Rx
SPEA KER
SDRAM
AFE
BACK UP
(Super cap 1F)
ADF MODULE
ADF
RTC
Cl o ck
SDRA M
MODEM
Spi t f i r e
/REQ /ACK ADC
DOC. POS SENSOR
DOC. DET SENSOR
OPE
POWER +5V
+11.75V
+30V
+3.3V
LIUMAIN
PRINT HEAD(2PEN)
600DPI DOUBLE
HEIGHT
ENCORDER
SENSOR
LINE FEED
CARRIAGE
RETURN MOTOR
COVER OPEN SENSOR
PAPER
EXIT
SENSOR
IMAGE
PROCESSOR
OA-980
IEEE 1284
TIMERS
REAL TIME CLOCK
ARM7TDMI
MEM. SNTR
Head Control I/F
SCAN SNTR
DERASTERIZER
MODEM CLOCK
28.224MHz
MAIN CLOCK
ADF STEPPER
MOTOR DRIVER
KEY PANNEL
TELEPHONE
LINE
MODEM & EXT_PHONE
SEPERATING PART
EXTERNAL
LINE
RING
DETECTION
PART
EXTERNAL
PHONE
DETECTION
PART
TRANSFORMER
(64Mbit)
(8Mbit)
(33.6Kbps)
2
2-1
Samsung Electronics
CONNECTION DIAGRAM
Repair Manual
2. Connection Diagram
Refer to the Schematic diagram(See page 4-2)
3
3-1
Samsung Electronics
CIRCUIT DESCRIPTION
Repair Manual
3. Circuit Description
3-1. GENERAL DESCRIPTION
Main circuit consists of mainly consists of CPU and the controller part with various types of built-in I/O device driver(built-in
RISC Processor Core:ARM7TDMI), system memory part, OA980 controlling input of image received from media and con-
version, CF(COMPACT storage card) interface part. The following nomenclatures by section is the same as those listed in
the circuit diagram.
3-2. MEMORY MAP
The entire Addressing area provided by MAIN CONTROLLER(S3C46MOX(Jupiter3)) is 256MBytes from 0x00000000 to
0x10000000, and the Max. Address Range for each External Chip Select is 32M Byte or Half word from 0x000000 to
0x01FFFFFF and embodied with Big-Endian Bus interface. MEMORY area is divided into EXTERNAL ROM and RAM
areas(See (Figure 1)), and the areas actually used are 8M/8M BYTES SDRAM and 1M BYTES ROM(FLASH MEMORY).
0x0FFF_FFFF
GCS 7 Area
0x0E00_0000
0x0DFF_FFFF
GCS6 Area - DRAM(8MB)
0x0C00_0000
0x0BFF_FFFF
Reserved
0x0A00_0000
0x09FF_FFFF
GCS 4 Area - OA980 PO CS
0x0800_0000
0x07FF_FFFF
GCS 3 Area - EXTENDED GPIO
0x0600_0000
0x05FF_FFFF
GCS 2 Area - MODEM
0x0400_0000
0x03FF_FFFF
GCS 1 Area - OA980
0x0200_0000
0x01FF_FFFF
Special Registers
0x01C0_0000
0x000F_FFFF
Program Area(1MB
used)
0x0000_0000
USER MEMORY(3MB Start ~ )
0xC300000
PIXEL TO LINE BUFFER(30KB)
0xC2CBC20
Chunk Buffer(8KByte)
0xC2C9C20
Re ad P rin t B uff e r ( 32 B yt e)
0xC2C9C00
Swath Buffer(300KByte)
0xC27EC00
Scan Buffer(810KB)
0xC1B4400
RGB Buffer(30KB)
0xC1ACC00
ECM Buffer(64KB)
0xC19CC00
RCP PC FAX Buffer(15KB)
0xC199000
JPEG DECODE BUFFER(64KB)
0xC099000
MDM Out Buffer(20KB)
0xC094000
MDM In Buffer(28KB)
0 xC0 8D 000
JPEG INPUT Buffer(220KB)
0xC056000
System AREA(344K)
0xC000000
OASIS Rom Code : 256KB
(Sector 15 ~ Sector 18)
J3 ROM Code :704KB
(Sector 4 ~ Sector 14)
Backup Data(Sector 3:32KB)
Not Used(Sector 1,2: 16 KB)
Boot Rom Code(Sector 0 : 16KB)
Flash memory(1MB)
SDRAM(8MB)
<Figure 1. S3C46MOX(Jupiter3) MEMORY MAP>
◊MAIN PBA
3-2
CIRCUIT DESCRIPTION
Samsung Electronics
Repair Manual
3-3.DETAILED DESCRIPTION
3-3-1 BLOCK DIAGRAM and MAIN CONTROLLER description
3-3-1-1 General description
MAIN CONTROLLER(S3C46MOX(Jupiter3),U15) consists of this system consists of CPU(ARM7TDMI RISC PROCES-
SOR), 8K BYTES CACHE, DATA and ADDRESS BUS, PLL deriding input frequency and CLOCK CONTROL part,
SERIAL COMMUNICATION part supporting UART, PRINT HEAD control part, PARALLEL PORT INTERFACE part,
USB INTERFACE part, External DMA part for receiving data from external COLOR IMAGE PROCESSOR(OA-
980,U21), MEMORY and EXTERNAL BANK control part, SYNCHRONOUS SERIAL INTERFACE control part for inter-
facing Thunderbolt, and LF/CR Motor drive control and general purpose I/O control parts.(See Figure 2 )
3-3-2 S3C46MOX(Jupiter3) FUNCTION DESCRIPTION
3-3-2-1 SYSTEM CLOCK
There are two ways of Clock input method. One is the method to make Master Clock(MCLK) at the internal PLLby con-
necting X-tal and Capacitor to the outside, and another method is to use MCLK(When inputting 40MHz) directly, which
supplies maximum 40MHz Clock to the EXTCLK terminal(PIN65). The range of frequency being input in case of using
X-tal is limited to 4MHz~10MHz. This system uses SSCG(FS781) with a 10MHZ X-tal outside to make MCLK, and sup-
plies Clock to the XIN terminal(PIN67) ofASIC by expanding Spectrum with bandwidth about 1.5% in comparison with
the basic frequency by using this IC. Inside theASIC, the PLL makes 66MHz MCLK signal, which is the basic operation
frequency of the System. Also, this PLL makes 48MHz, the operation frequency of USB Controller.
3-3-2-2 DATA and ADDRESS BUS CONTROL
1. /RD & /WR
/RD & /WR SIGNAL are synchronized with the inside MCLK(66MHZ) and becomes active to Low.
These signal are Strobe Signal used to Read or Write data when each Chip Select becomes active connected to
/RD,/WR PIN of RAM, ROM, OA-980.
2. CHIP SELECT (/ROMCS, /IP_CS,/MED_CS,/SCS0,/SCS1)
- /ROMCS : FLASH MEMORY(U7) CHIP SELECT (LOW ACTIVE)
- /IP_CS : OA-980(U21) CHIP SELECT
(LOW ACTIVE)
- /SCS1 : SDRAM(OPTION)(U12) CHIP SELECT (LOW ACTIVE)
In case each Chip Select is low, it may Read or Write data.
3. D0 ~ D15
- 16BIT DATA BUS
4. A0 ~ A24
- ADDRESS BUS (A23 ~ A24 RESERVED)
3-3
Samsung Electronics
CIRCUIT DESCRIPTION
Repair Manual
<Figure 2. Block Diagram of Main Part>
AC
( 110~240
(64Mbit)
V)
SMPS
( 30V, 3. 3V)
Jupi t er 3
UART 3
I/OPORT
INT. CNTR
USB
FLASH
Thunder bol t
MOTOR
CCD Module
SCA N STEPPER
SCAN MOTOR
(UNI -POLAR STEP)
COLOR
MON O
CARTRI DGE
RESET
USB
PC
10M Hz
48MH z
P1284 CONN
SCANN ER
BU F FE
600/ / 600
Tx/ Rx
SPE A K ER
SDRAM
AFE
BACK UP
(Super cap 1F)
ADF MODU LE
ADF
RTC
Cl o ck
SDRA M
MODEM
Spi t f i r e
/REQ /ACK ADC
DOC. POS SENSOR
DOC. DET SENSOR
OPE
POWER
+5V
+11.75V
+30V
+3.3V
LIUMAIN
PRINT HEAD(2PEN)
600DPI DOUBLE
HEIGHT
ENCORDER
SENSOR
LINE FEED
CARRIAGE
RETURN MOTOR
COVER OPEN SENSOR
PAPER
EXIT
SENSOR
IMAGE
PROCESSOR
OA-980
IEEE 1284
TIMERS
REAL TIME CLOCK
ARM7TDMI
MEM. SNTR
Head Control I/F
SCAN SNTR
DERASTERIZER
MODEM CLOCK
28.224MHz
MAIN CLOCK
ADF STEPPER
MOTOR DRIVER
KEY PANNEL
TELEPHONE
LINE
MODEM & EXT_PHONE
SEPERATING PART
EXTERNAL
LINE
RING
DETECTION
PART
EXTERNAL
PHONE
DETECTION
PART
TRANSFORMER
(64Mbit)
(8Mbit)
(33.6Kbps)
3-4
CIRCUIT DESCRIPTION
Samsung Electronics
Repair Manual
<Figure 3. Flash Memory Read Timing>
<Figure 4. Flash Memory Write Timing>
EXTCLK
nGCSx
nGCSx
ADDR
tRWD
tRAD
Tacs
tRCD
nWE
DATA
nBEx
Tacc Toch
Tcah
Tocs
tRCD
tRWD
tRDD
tRAD
tRDH
’1’
EXTCLK
nGCSx
nGCSx
ADDR
tRWD
tRAD
Tacs
tRCD
nWE
DATA
nBEx
Tacc Toch
Toch
Tcah
Tocs
tRWBED
Tcos
tRDD
tRWBED
tRCD
tRWD
tRDD
tRAD
3-5
Samsung Electronics
CIRCUIT DESCRIPTION
Repair Manual
<Figure 5. SDRAM Read Timing>
SCLK
SCKE
ADDR/BA
AP/A10
nGCSx
nSRAS
nSCAS
nBEx
nWE
DATA
’1’tSAD
tSAD
tSCSD
tSRD
Trp Trcd tSCD
tSBED
Tcl
tSWD
tSDS
tSDH
3-6
CIRCUIT DESCRIPTION
Samsung Electronics
Repair Manual
<Figure 6. SDRAM Write Timing>
SCLK
’1’
SCKE
ADDR/BA
AP/A10
nGCSx
nSRAS
nSCAS
nBEx
nWE
DATA
tSAD
tSAD
tSCSD
tSRD
Trp Trcd
tSWD
tSDD
tSDD
tSBED
tSCD
3-7
Samsung Electronics
CIRCUIT DESCRIPTION
Repair Manual
<Figure 7. SDRAM Write Timing>
SCLK
SCKE
ADDR/BA
AP/A10
nGCSx
nSRAS
nSCAS
nBEx
nWE
DATA
tSAD
’1’
’1’
’HZ’
tSAD
tSCSD
tSRD tSRD
tSCD
tSWD
tSCSD
tSAD
Trp Trc
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