Renesas ISL81802EVAL2Z Manual de usuario

ISL81802EVAL2Z

Evaluation Board

R16UH0003EU0100 Rev.1.00 Page 1 of 25

Aug.24.20

User Manual

The ISL81802EVAL2Z dual-output evaluation board (shown in Figure 4) features the ISL81802, an 80V high

voltage dual synchronous buck controller that offers external soft-start, independent enable functions, and

integrates UV/OV/OC/OT protection. A programmable switching frequency ranging from 100kHz to 1MHz helps to

optimize inductor size while the strong gate driver delivers up to 10A for each output.

Key Features

• Wide input range: 18V to 80V for 12V output, 6V to 80V for 5V output

• High light-load efficiency in pulse skipping DEM operation

• Programmable soft-start

• Optional DEM/PWM operation

• Optional CC/HICCUP OCP protection

• Supports pre-bias output with soft-start

• PGOOD indicator

• OVP, OTP, and UVP protection

• Back biased from output to improve efficiency

Specifications

The ISL81802EVAL2Z dual-output evaluation board is designed for high current applications. The current rating

of the ISL81802EVAL2Z is limited by the FETs and inductor selected. The ISL81802EVAL2Z electrical ratings are

shown in Ta ble 1.

Ordering Information

Related Literature

For a full list of related documents, visit our website:

•ISL81802 device page

Table 1. ISL81802EVAL2Z Electrical Ratings

Parameter Rating

Input Voltage 18V to 80V (6V to 80V for 5V output)

Switching Frequency 200kHz

Output Voltage 1 12V

Output Current 1 10A

Output Voltage 2 5V

Output Current 2 10A

OCP Set Point Minimum 12.6A each output at ambient room temperature

Part Number Description

ISL81802EVAL2Z High Voltage Dual Buck Controller Evaluation Board

ISL81802EVAL2Z

R16UH0003EU0100 Rev.1.00 Page 2 of 25

Aug.24.20

Figure 1. ISL81802EVAL2Z Block Diagram

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ISL81802EVAL2Z 1. Functional Description

R16UH0003EU0100 Rev.1.00 Page 3 of 25

Aug.24.20

1. Functional Description

The ISL81802EVAL2Z is the same test board used by Renesas application engineers and IC designers to

evaluate the performance of the ISL81802 TQFN IC. The board provides an easy and complete evaluation of all

the IC and board functions.

As shown in Figure 3, the 6V to 80V VIN is supplied to J1 (+) and J2 (-). The regulated 12V output is on J4 (+) and

J5 (-), while the regulated 5V output is on J17 (+) and J16 (-). They both can supply up to 10A to the load. Due to

the high power efficiency, the evaluation board can run at 20A in total continuously without airflow at ambient

room temperature conditions.

Test points TP1 through TP25 provide easy access to the IC pin and external signal injection terminals.

As shown in Tabl e 2 , connector J6 provides a selection of either Forced PWM mode (shorting Pin 1 and Pin 2) or

DEM mode (shorting Pin 2 and Pin 3). Connector J7 provides a selection of either constant current limit (shorting

Pin 1 and Pin 2) or HICCUP OCP (shorting Pin 2 and Pin 3). Connector J3 provides an option to disable the

converter by shorting its Pin 1 and Pin 2.

1.1 Recommended Testing Equipment

The following materials are recommended for testing:

• 0V to 80V power supply with at least 30A source current capability

• Electronic loads capable of sinking current up to 30A

• Digital Multimeters (DMMs)

• 100MHz quad-trace oscilloscope

1.2 Operating Range

The input voltage range is from 18V to 80V for the 12V output, while the input voltage range is from 6V to 80V for

the 5V output. If the output voltage is set to a lower value, the minimum VIN can be reset to a lower value by

changing the ratio of R1and R5. The minimum EN threshold that VIN can be set to is 4.5V.

The rated load current for each output is 10A with the OCP point set at a minimum 12A at ambient room

temperature conditions. The operating temperature range of this board is -40°C to +85°C.

Note: Airflow is needed for higher ambient temperature conditions.

ISL81802EVAL2Z 1. Functional Description

R16UH0003EU0100 Rev.1.00 Page 4 of 25

Aug.24.20

1.3 Quick Test Guide

1. Jumper J6 provides the option to select PWM or DEM. Jumper J7 provides the option to select a constant

current limit or HICCUP. See Table 2 for the operating options. Ensure that the circuit is correctly connected to

the supply and electronic loads before applying any power. See Figure 3 for the proper setup.

2. Turn on the power supply.

3. Adjust the input voltage (VIN) within the specified range and observe the output voltage. The output voltage

variation should be within 3%.

4. Adjust the load current within the specified range and observe the output voltage. The output voltage variation

should be within 3%.

5. Use an oscilloscope to observe output voltage ripple and phase node ringing. For accurate measurement, see

Figure 2 for the proper test setup.

Table 2. Operating Options

Jumper Position Function

3 EN-GND Disable output

EN Floating Enable output

6Pin1-2 PWM

Pin 2-3 DEM

7 Pin 1-2 Constant current limit

Pin 2-3 HICCUP

Figure 2. Proper Probe Setup to Measure Output Ripple and Phase Node Ringing

Figure 3. Proper Test Setup

Output Capacitor

or MOSFET

LOAD

ISL81802EVAL2Z 2. PCB Layout Guidelines

R16UH0003EU0100 Rev.1.00 Page 5 of 25

Aug.24.20

2. PCB Layout Guidelines

Careful attention to Printed Circuit Board (PCB) layout requirements is necessary for the successful

implementation of an ISL81802 based DC/DC converter. The ISL81802 switches at a high frequency; therefore,

the switching times are short. At these switching frequencies, even the shortest trace has significant impedance

and the peak gate drive current rises significantly in an extremely short time. The transition speed of the current

from one device to another causes voltage spikes across the interconnecting impedances and parasitic circuit

elements. These voltage spikes can degrade efficiency, generate EMI, and increase device voltage stress and

ringing. Careful component selection and proper PCB layout minimize the magnitude of these voltage spikes.

Three sets of components are critical when using the ISL81802 DC/DC converter:

• Controller

• Switching power components

• Small-signal components

The switching power components are the most critical to the layout because they switch a large amount of energy,

which tends to generate a large amount of noise. The critical small-signal components are those connected to

sensitive nodes or those supplying critical bias currents. A multilayer PCB is recommended.

Complete the following steps to optimize the PCB layout:

1. Place the input capacitors, FETs, inductor, and output capacitor first. Isolate these power components on

dedicated areas of the board with their ground terminals adjacent to one another. Place the input and output

high-frequency decoupling ceramic capacitors very close to the MOSFETs.

2. If signal components and the IC are placed separately from the power train, Renesas recommends using full

ground planes in the internal layers with shared SGND and PGND to simplify the layout design. Otherwise,

use separate ground planes for the power ground and the small signal ground. Connect the SGND and PGND

together close to the IC. Note: DO NOT connect them together anywhere else.

3. Keep the loop formed by the input capacitor, the top FET, and the bottom FET as small as possible.

4. Ensure the current paths from the input capacitor to the FETs, the power inductor, and the output capacitor are

as short as possible with maximum allowable trace widths.

5. Place the PWM controller IC close to the lower FETs. The low-side FETs gate drive connections should be

short and wide. Place the IC over a quiet ground area. Avoid switching ground loop currents in this area.

6. Place the VDD bypass capacitor very close to the VDD pin of the IC and connect its ground end to the PGND

pin. Connect the PGND pin to the ground plane by a via.

Note: DO NOT connect the PGND pin directly to the SGND EPAD.

7. Place the gate drive components (BOOT diodes and BOOT capacitors) together near the controller IC.

8. Place the output capacitors as close to the load as possible. Use short, wide copper regions to connect output

capacitors to load to avoid inductance and resistances.

9. Use copper filled polygons or wide, short traces to connect the junction of the upper FET, lower FET, and output

inductor. Keep the PHASE nodes connection to the IC short. Note: DO NOT unnecessarily oversize the copper

islands for the PHASE nodes. Because the phase nodes are subjected to very high dv/dt voltages, the stray

capacitor formed between these islands and the surrounding circuitry tends to couple switching noise.

10. Route all high-speed switching nodes away from the control circuitry.

11. Create a separate small analog ground plane near the IC. Connect the SGND pin to this plane. Connect all

small signal grounding paths including feedback resistors, current monitoring resistors and capacitors,

soft-starting capacitors, loop compensation capacitors and resistors, and EN pull-down resistors to this SGND

plane.

12. Use a pair of traces with minimum loop for the input or output current sensing connection.

13. Ensure the feedback connection to the output capacitor is short and direct.

ISL81802EVAL2Z 2. PCB Layout Guidelines

R16UH0003EU0100 Rev.1.00 Page 6 of 25

Aug.24.20

2.1 ISL81802EVAL2Z Evaluation Board

Figure 4. ISL81802EVAL2Z Evaluation Board, Top View

Figure 5. ISL81802EVAL2Z Evaluation Board, Bottom View

ISL81802EVAL2Z 2. PCB Layout Guidelines

R16UH0003EU0100 Rev.1.00 Page 7 of 25

Aug.24.20

2.2 ISL81802EVAL2Z Circuit Schematic

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ISL81802EVAL2Z 2. PCB Layout Guidelines

R16UH0003EU0100 Rev.1.00 Page 8 of 25

Aug.24.20

2.3 Bill of Materials

Qty Reference Designator Description Manufacturer Manufacturer Part

1 PWB-PCB, ISL81802EVAL1Z, REVB, ROHS Multilayer

PCB Technology

ISL81802EVAL1ZREVBPCB

2 C1, C2 CAP, RADIAL, 12.5x26.5, 220μF, 100V,

20%, ALUM.ELEC., 5mm, ROHS

United Chemi-Con EKZN101ELL221MK25S

8 C3, C4, C5, C6, C42, C43,

C44, C45

CAP-AEC-Q200, SMD, 1210, 4.7μF, 100V,

10%, X7S, ROHS

TDK CGA6M3X7S2A475K200AB

3 C7, C12, C51 CAP, SMD, 0603, 1000pF, 50V, 10%, X7R,

ROHS

TDK C1608X7R1H102K080AE

3 C8, C41, C53 CAP, SMD, 0603, 0.1µF, 100V, 10%, X7R,

ROHS

Vishay GRJ188R72A104KE11D

4 C9, C22, C47, C50 CAP, SMD, 0603, 0.047µF, 25V, 10%, X7R,

ROHS

TDK CGJ3E2X7R1E473K080AA

1 C11 CAP, SMD, 0603, 10µF, 16V, X5R, 10%,

ROHS

Murata GRM188R61C106KAALJ

2 C15, C49 CAP, SMD, 0603, 220pF, 50V, 10%, X7R,

ROHS

Murata GRM188R71H221KA01D

2 C16, C39 CAP, SMD, 0603, 0.47µF, 25V, 10%, X7R,

ROHS

Murata GRM188R71E474KA12D

2 C17, C48 CAP, SMD, 0603, 0.022µF, 25V, X7R, ROHS TDK CGJ3E2X7R1E223K080AA

8 C18, C19, C20, C23, C34,

C35, C36, C37

CAP, SMD, 1210, 22µF, 25V, X7R, ROHS Murata GRM32ER71E226KE15L

2 C21, C38 CAP-OSCON, SMD, 10mm, 1000μF, 16V,

20%, 12mΩ, ROHS

Panasonic 16SVPF1000M

2 C24, C26 CAP, SMD, 0805, 10µF, 16V, 10%, X7S,

ROHS

Murata GRM21BC71C106KE11L

5 C27, C29, C30, C31, C32 CAP, SMD, 0603, 0.01µF, 100V, 5%, X7R,

ROHS

Kemet C0603C103J1RACTU

1 C28 CAP, SMD, 0603, 820pF, 50V, 10%, X7R,

ROHS

Kemet C0603C821K5RACTU

0 C13, C14, C25, C33, C46,

C52, C54, C55

CAP, SMD, 0603, DNP-PLACE

HOLDER, ROHS

3 D1, D3, D4 DIODE-RECTIFIER, SMD, 2P, S0D-123FL,

100V, 1A, ROHS

ON Semiconductor MBR1H100SFT3G

6 J1, J2, J4, J5, J6, J17 HDWARE, TERMINAL, M4 METRIC

SCREW, TH, 4P, SNAP-FIT, ROHS

Keystone 7795

1 J3 CONN-HEADER, 1x2, BRKAWY 1x36,

2.54mm, ROHS

BERG/FCI 68000-236HLF

2 J6, J7 CONN-HEADER, 1x3, BREAKAWY 1x36,

2.54mm, ROHS

BERG/FCI 68000-236HLF

0 J12, J13, J14, J15, J18, J19 2.54mm Headers, DNP-PLACE HOLDER,

ROHS

1 L1 COIL-PWR INDUCTOR, SMD, 6.8μH, 20%,

15A, 4.1mΩ, ROHS

Wurth 74439370068

1 L2 COIL-PWR INDUCTOR, SMD, 4.7μH, 20%,

17A, 3.5mΩ, ROHS

Wurth 74439370047

1 U1 80V DUAL-BUCK PWM CONTROLLER,

32P, TQFN, 5x5, ROHS

Renesas Electronics

America

ISL81802FRTZ

4 Q2, Q3, Q5, Q7 TRANSISTOR-MOS, N-CHANNEL, SMD,

8P, PPK SO-8, 100V, 80A, ROHS

Infineon BSC070N10NS5ATMA1

0 Q1, Q4, Q6, Q8 DO NOT POPULATE OR PURCHASE

ISL81802EVAL2Z 2. PCB Layout Guidelines

R16UH0003EU0100 Rev.1.00 Page 9 of 25

Aug.24.20

1 R1 RES SMD 430kΩ1% 1/4W 1206 Panasonic ERJ-8ENF4303V

3 R2, R5, R43 RES SMD 48.7kΩ1% 1/10W 0603 Yageo RC0603FR-0748K7L

2 R3, R45 RES SMD 20Ω1% 1/10W 0603 Yageo RC0603FR-0720RL

4 R6, R10, R25, R48 RES SMD 1Ω1% 1/10W 0603 Panasonic ERJ-3RQF1R0V

1 R7 RES SMD 5.1Ω1% 1/10W 0603 Yageo RC0603FR-075R1L

2 R8, R26 RES SMD 40.2kΩ1% 1/10W 0603 Yageo RC0603FR-0740K2L

2 R11, R27 RES SMD 5.1kΩ1% 1/10W 0603 Yageo RC0603FR-075K1L

1 R12 RES SMD 3.48kΩ1% 1/10W 0603 Yageo RC0603FR-073K48L

2 R14, R22 RES SMD 0.004Ω3W 2512 WIDE Susumu KRL6432E-M-R004-F-T1

1 R46 RES SMD 0Ω1% 1/10W 0603 Yageo RC0603JR-070RL

2 R16, R21 RES SMD 3.3Ω1% 1/10W 0603 Yageo RC0603FR-073R3L

4 R18, R30, R32, R38 RES SMD 22kΩ1% 1/10W 0603 Yageo RC0603FR-0722KL

1 R19 RES SMD 169kΩ1% 1/10W 0603 Venkel CR0603-10W-1693FT

1 R20 RES SMD 2.7kΩ1% 1/10W 0603 Yageo RC0603FR-072K7L

1 R23 RES SMD 100kΩ1% 1/10W 0603 Yageo RC0603FR-07100KL

2 R31, R33 RES SMD 39kΩ1% 1/10W 0603 Yageo RC0603FR-0739KL

1 R39 RES SMD 9.31kΩ1% 1/10W 0603 Yageo RC0603FR-079K31L

0 RT2, RT5, R15, R17, R34,

R35, R41, R44, R47, R49,

R50, R51, R52, R53, R54,

R55, R56, R57

RES, SMD, 0603, DNP-PLACE HOLDER,

ROHS

15 TP1, TP2, TP3, TP5, TP7,

TP9, TP10, TP13, TP14,

TP15, TP18, TP22, TP23,

TP24, TP25

CONN-COMPACT TEST PT, VERTICAL,

WHT, ROHS

Keystone 5007

3 J3, J6, J7 CONN-JUMPER, SHORTING, 2PIN,

BLACK, GOLD, ROHS

Sullins SPC02SYAN

4 Four corners SCREW, 4-40x1/4in, PHILLIPS, PANHEAD,

STAINLESS, ROHS

Keystone 2204

4 Four corners STANDOFF, 4-40x3/4in, F/F, HEX,

ALUMINUM, 0.25 OD, ROHS

Keystone 7795

Qty Reference Designator Description Manufacturer Manufacturer Part

ISL81802EVAL2Z 2. PCB Layout Guidelines

R16UH0003EU0100 Rev.1.00 Page 10 of 25

Aug.24.20

2.4 Board Layout

Figure 7. Silkscreen Top

Figure 8. Top Layer

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