Renesas RL78/G13 Manual de usuario

User’s Manual

All information contained in these materials, including products and product specifications,

represents information on the product at the time of publication and is subject to change by

Renesas Electronics Corp. without notice. Please review the latest information published by

Renesas Electronics Corp. through various means, including the Renesas Electronics Corp.

website (http://www.renesas.com).

RL78/G13

User’s Manual: Hardware

Rev.1.00 Sep 2011

16-Bit Single-Chip Microcontrollers

www.renesas.com

Notice

1. All information included in this document is current as of the date this document is issued. Such information, however, is

subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please

confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to

additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website.

2. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights

of third parties by or arising from the use of Renesas Electronics products or technical information described in this document.

No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights

of Renesas Electronics or others.

3. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.

4. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of

semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software,

and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by

you or third parties arising from the use of these circuits, software, or information.

5. When exporting the products or technology described in this document, you should comply with the applicable export control

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Electronics products or the technology described in this document for any purpose relating to military applications or use by

the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and

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6. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics

does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages

incurred by you resulting from errors in or omissions from the information included herein.

7. Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and

“Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as

indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular

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written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for

which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way

liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an

application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written

consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise

expressly specified in a Renesas Electronics data sheets or data books, etc.

“Standard”: Computers; office equipment; communications equipment; test and measurement equipment; audio and visual

equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots.

“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-

crime systems; safety equipment; and medical equipment not specifically designed for life support.

“Specific”: Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or

systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare

intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life.

8. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics,

especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation

characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or

damages arising out of the use of Renesas Electronics products beyond such specified ranges.

9. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have

specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further,

Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to

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Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire

control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because

the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system

manufactured by you.

10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental

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applicable laws and regulations.

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12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this

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(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majority-

owned subsidiaries.

(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.

NOTES FOR CMOS DEVICES

(1) VOLTAGE APPLICATION WAVEFORM AT INPUT PIN: Waveform distortion due to input noise or a

reflected wave may cause malfunction. If the input of the CMOS device stays in the area between VIL

(MAX) and VIH (MIN) due to noise, etc., the device may malfunction. Take care to prevent chattering noise

from entering the device when the input level is fixed, and also in the transition period when the input level

passes through the area between VIL (MAX) and VIH (MIN).

(2) HANDLING OF UNUSED INPUT PINS: Unconnected CMOS device inputs can be cause of malfunction. If

an input pin is unconnected, it is possible that an internal input level may be generated due to noise, etc.,

causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of

CMOS devices must be fixed high or low by using pull-up or pull-down circuitry. Each unused pin should be

connected to VDD or GND via a resistor if there is a possibility that it will be an output pin. All handling

related to unused pins must be judged separately for each device and according to related specifications

governing the device.

(3) PRECAUTION AGAINST ESD: A strong electric field, when exposed to a MOS device, can cause

destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop

generation of static electricity as much as possible, and quickly dissipate it when it has occurred.

Environmental control must be adequate. When it is dry, a humidifier should be used. It is recommended

to avoid using insulators that easily build up static electricity. Semiconductor devices must be stored and

transported in an anti-static container, static shielding bag or conductive material. All test and measurement

tools including work benches and floors should be grounded. The operator should be grounded using a wrist

strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken

for PW boards with mounted semiconductor devices.

(4) STATUS BEFORE INITIALIZATION: Power-on does not necessarily define the initial status of a MOS

device. Immediately after the power source is turned ON, devices with reset functions have not yet been

initialized. Hence, power-on does not guarantee output pin levels, I/O settings or contents of registers. A

device is not initialized until the reset signal is received. A reset operation must be executed immediately

after power-on for devices with reset functions.

(5) POWER ON/OFF SEQUENCE: In the case of a device that uses different power supplies for the internal

operation and external interface, as a rule, switch on the external power supply after switching on the internal

power supply. When switching the power supply off, as a rule, switch off the external power supply and then

the internal power supply. Use of the reverse power on/off sequences may result in the application of an

overvoltage to the internal elements of the device, causing malfunction and degradation of internal elements

due to the passage of an abnormal current. The correct power on/off sequence must be judged separately

for each device and according to related specifications governing the device.

(6) INPUT OF SIGNAL DURING POWER OFF STATE : Do not input signals or an I/O pull-up power supply

while the device is not powered. The current injection that results from input of such a signal or I/O pull-up

power supply may cause malfunction and the abnormal current that passes in the device at this time may

cause degradation of internal elements. Input of signals during the power off state must be judged

separately for each device and according to related specifications governing the device.

How to Use This Manual

Readers This manual is intended for user engineers who wish to understand the functions of the

RL78/G13 and design and develop application systems and programs for these devices.

The target products are as follows.

•20-pin: R5F1006x (x = A, C, D, E)

R5F1016x (x = A, C, D, E)

•24-pin: R5F1007x (x = A, C, D, E)

R5F1017x (x = A, C, D, E)

•25-pin: R5F1008x (x = A, C, D, E)

R5F1018x (x = A, C, D, E)

•30-pin: R5F100Ax (x = A, C, D, E, F, G)

R5F101Ax (x = A, C, D, E, F, G)

•32-pin: R5F100Bx (x = A, C, D, E, F, G)

R5F101Bx (x = A, C, D, E, F, G)

•36-pin: R5F100Cx (x = A, C, D, E, F, G)

R5F101Cx (x = A, C, D, E, F, G)

•40-pin: R5F100Ex (x = A, C, D, E, F, G, H)

R5F101Ex (x = A, C, D, E, F, G, H)

•44-pin: R5F100Fx (x = A, C, D, E, F, G, H, J, K, L)

R5F101Fx (x = A, C, D, E, F, G, H, J, K, L)

•48-pin: R5F100Gx (x = A, C, D, E, F, G, H, J, K, L)

R5F101Gx (x = A, C, D, E, F, G, H, J, K, L)

•52-pin: R5F100Jx (x = C, D, E, F, G, H, J, K, L)

R5F101Jx (x = C, D, E, F, G, H, J, K, L)

•64-pin: R5F100Lx (x = C, D, E, F, G, H, J, K, L)

R5F101Lx (x = C, D, E, F, G, H, J, K, L)

•80-pin: R5F100Mx (x = F, G, H, J, K, L)

R5F101Mx (x = F, G, H, J, K, L)

•100-pin: R5F100Px (x = F, G, H, J, K, L)

R5F101Px (x = F, G, H, J, K, L)

•128-pin: R5F100Sx (x = H, J, K, L)

R5F101Sx (x = H, J, K, L)

Purpose This manual is intended to give users an understanding of the functions described in the

Organization below.

Organization The RL78/G13 manual is separated into two parts: this manual and the instructions edition

(common to the RL78 Microcontroller).

RL78/G13

User’s Manual

(This Manual)

RL78 Microcontroller

User’s Manual

Instructions

•Pin functions

•Internal block functions

•Interrupts

•Other on-chip peripheral functions

•Electrical specifications

•CPU functions

•Instruction set

•Explanation of each instruction

How to Read This Manual It is assumed that the readers of this manual have general knowledge of electrical

engineering, logic circuits, and microcontrollers.

•To gain a general understanding of functions:

→Read this manual in the order of the CONTENTS. The mark “<R>” shows major

revised points. The revised points can be easily searched by copying an “<R>” in the

PDF file and specifying it in the “Find what:” field.

•How to interpret the register format:

→For a bit number enclosed in angle brackets, the bit name is defined as a reserved

word in the assembler, and is defined as an sfr variable using the #pragma sfr

directive in the compiler.

•To know details of the RL78 Microcontroller instructions:

→Refer to the separate document RL78 Microcontroller Instructions User’s Manual

(R01US0015E).

Conventions Data significance: Higher digits on the left and lower digits on the right

Active low representations: ××× (overscore over pin and signal name)

Note: Footnote for item marked with Note in the text

Caution: Information requiring particular attention

Remark: Supplementary information

Numerical representations: Binary

...×××× or ××××B

Decimal

...××××

Hexadecimal

...××××H

Related Documents The related documents indicated in this publication may include preliminary versions.

However, preliminary versions are not marked as such.

Documents Related to Devices

Document Name Document No.

RL78/G13 User’s Manual Hardware This manual

RL78 Microcontroller Instructions User’s Manual R01US0015E

Documents Related to Flash Memory Programming

Document Name Document No.

PG-FP5 Flash Memory Programmer User’s Manual R20UT0008E

Caution The related documents listed above are subject to change without notice. Be sure to use the latest

version of each document when designing.

Other Documents

Document Name Document No.

RENESAS MICROCOMPUTER GENERAL CATALOG R01CS0001E

Semiconductor Device Mount Manual Note

Quality Grades on NEC Semiconductor Devices C11531E

NEC Semiconductor Device Reliability/Quality Control System C10983E

Guide to Prevent Damage for Semiconductor Devices by Electrostatic Discharge (ESD) C11892E

Note See the “Semiconductor Device Mount Manual” website (http://www.renesas.com/prod/package/manual/index.html).

Caution The related documents listed above are subject to change without notice. Be sure to use the latest

version of each document when designing.

All trademarks and registered trademarks are the property of their respective owners.

EEPROM is a trademark of Renesas Electronics Corporation.

Windows, Windows NT and Windows XP are registered trademarks or trademarks of Microsoft Corporation in the

United States and/or other countries.

PC/AT is a trademark of International Business Machines Corporation.

SuperFlash is a registered trademark of Silicon Storage Technology, Inc. in several countries including the United States

and Japan.

Caution: This product uses SuperFlash®technology licensed from Silicon Storage Technology, Inc.

Index-1

CONTENTS

CHAPTER 1 OUTLINE............................................................................................................................... 1

1.1 Features........................................................................................................................................... 1

1.2 Ordering Information...................................................................................................................... 3

1.3 Pin Configuration (Top View) ........................................................................................................ 6

1.3.1 20-pin products................................................................................................................................... 6

1.3.2 24-pin products................................................................................................................................... 7

1.3.3 25-pin products................................................................................................................................... 8

1.3.4 30-pin products................................................................................................................................... 9

1.3.5 32-pin products................................................................................................................................. 10

1.3.6 36-pin products................................................................................................................................. 11

1.3.7 40-pin products................................................................................................................................. 12

1.3.8 44-pin products................................................................................................................................. 13

1.3.9 48-pin products................................................................................................................................. 14

1.3.10 52-pin products............................................................................................................................... 16

1.3.11 64-pin products............................................................................................................................... 17

1.3.12 80-pin products............................................................................................................................... 19

1.3.13 100-pin products............................................................................................................................. 20

1.3.14 128-pin products............................................................................................................................. 22

1.4 Pin Identification........................................................................................................................... 23

1.5 Block Diagram .............................................................................................................................. 24

1.5.1 20-pin products................................................................................................................................. 24

1.5.2 24-pin products................................................................................................................................. 25

1.5.3 25-pin products................................................................................................................................. 26

1.5.4 30-pin products................................................................................................................................. 27

1.5.5 32-pin products................................................................................................................................. 28

1.5.6 36-pin products................................................................................................................................. 29

1.5.7 40-pin products................................................................................................................................. 30

1.5.8 44-pin products................................................................................................................................. 31

1.5.9 48-pin products................................................................................................................................. 32

1.5.10 52-pin products............................................................................................................................... 33

1.5.11 64-pin products............................................................................................................................... 34

1.5.12 80-pin products............................................................................................................................... 35

1.5.13 100-pin products............................................................................................................................. 36

1.5.14 128-pin products............................................................................................................................. 37

1.6 Outline of Functions..................................................................................................................... 38

Index-2

CHAPTER 2 PIN FUNCTIONS ............................................................................................................... 44

2.1 Pin Function List .......................................................................................................................... 44

2.1.1 20-pin products................................................................................................................................. 45

2.1.2 24-pin products................................................................................................................................. 46

2.1.3 25-pin products................................................................................................................................. 47

2.1.4 30-pin products................................................................................................................................. 48

2.1.5 32-pin products................................................................................................................................. 50

2.1.6 36-pin products................................................................................................................................. 52

2.1.7 40-pin products................................................................................................................................. 54

2.1.8 44-pin products................................................................................................................................. 56

2.1.9 48-pin products................................................................................................................................. 58

2.1.10 52-pin products............................................................................................................................... 60

2.1.11 64-pin products............................................................................................................................... 62

2.1.12 80-pin products............................................................................................................................... 64

2.1.13 100-pin products............................................................................................................................. 67

2.1.14 128-pin products............................................................................................................................. 70

2.1.15 Pins for each product (pins other than port pins)............................................................................ 74

2.2 Description of Pin Functions ...................................................................................................... 80

2.2.1 P00 to P07 (port 0) ........................................................................................................................... 80

2.2.2 P10 to P17 (port 1) ........................................................................................................................... 81

2.2.3 P20 to P27 (port 2) ........................................................................................................................... 82

2.2.4 P30 to P37 (port 3) ........................................................................................................................... 82

2.2.5 P40 to P47 (port 4) ........................................................................................................................... 83

2.2.6 P50 to P57 (port 5) ........................................................................................................................... 85

2.2.7 P60 to P67 (port 6) ........................................................................................................................... 85

2.2.8 P70 to P77 (port 7) ........................................................................................................................... 86

2.2.9 P80 to P87 (port 8) ........................................................................................................................... 87

2.2.10 P90 to P97 (port 9) ......................................................................................................................... 87

2.2.11 P100 to P106 (port 10) ................................................................................................................... 87

2.2.12 P110 to P117 (port 11) ................................................................................................................... 88

2.2.13 P120 to P127 (port 12) ................................................................................................................... 88

2.2.14 P130, P137 (port 13) ...................................................................................................................... 89

2.2.15 P140 to P147 (port 14) ................................................................................................................... 89

2.2.16 P150 to P156 (port 15) ................................................................................................................... 91

2.2.17 VDD, EVDD0, EVDD1, VSS, EVSS0, EVSS1 ............................................................................................ 91

2.2.18 RESET ........................................................................................................................................... 91

2.2.19 REGC............................................................................................................................................. 91

2.3 Pin I/O Circuits and Recommended Connection of Unused Pins ........................................... 92

Index-3

CHAPTER 3 CPU ARCHITECTURE ...................................................................................................... 98

3.1 Memory Space .............................................................................................................................. 98

3.1.1 Internal program memory space..................................................................................................... 114

3.1.2 Mirror area...................................................................................................................................... 117

3.1.3 Internal data memory space........................................................................................................... 119

3.1.4 Special function register (SFR) area .............................................................................................. 120

3.1.5 Extended special function register (2nd SFR: 2nd Special Function Register) area ..................... 120

3.1.6 Data memory addressing ............................................................................................................... 121

3.2 Processor Registers................................................................................................................... 131

3.2.1 Control registers ............................................................................................................................. 131

3.2.2 General-purpose registers.............................................................................................................. 133

3.2.3 ES and CS registers....................................................................................................................... 135

3.2.4 Special function registers (SFRs) ................................................................................................... 136

3.2.5 Extended special function registers (2nd SFRs: 2nd Special Function Registers) ......................... 142

3.3 Instruction Address Addressing............................................................................................... 151

3.3.1 Relative addressing........................................................................................................................ 151

3.3.2 Immediate addressing .................................................................................................................... 151

3.3.3 Table indirect addressing ............................................................................................................... 152

3.3.4 Register direct addressing.............................................................................................................. 153

3.4 Addressing for Processing Data Addresses ........................................................................... 154

3.4.1 Implied addressing ......................................................................................................................... 154

3.4.2 Register addressing ....................................................................................................................... 154

3.4.3 Direct addressing ........................................................................................................................... 155

3.4.4 Short direct addressing .................................................................................................................. 156

3.4.5 SFR addressing.............................................................................................................................. 157

3.4.6 Register indirect addressing ........................................................................................................... 158

3.4.7 Based addressing........................................................................................................................... 159

3.4.8 Based indexed addressing ............................................................................................................. 162

3.4.9 Stack addressing............................................................................................................................ 163

CHAPTER 4 PORT FUNCTIONS ......................................................................................................... 164

4.1 Port Functions ............................................................................................................................ 164

4.2 Port Configuration...................................................................................................................... 165

4.2.1 Port 0.............................................................................................................................................. 167

4.2.2 Port 1.............................................................................................................................................. 175

4.2.3 Port 2.............................................................................................................................................. 185

4.2.4 Port 3.............................................................................................................................................. 187

4.2.5 Port 4.............................................................................................................................................. 192

4.2.6 Port 5.............................................................................................................................................. 201

4.2.7 Port 6.............................................................................................................................................. 208

Index-4

4.2.8 Port 7.............................................................................................................................................. 211

4.2.9 Port 8.............................................................................................................................................. 218

4.2.10 Port 9............................................................................................................................................ 222

4.2.11 Port 10.......................................................................................................................................... 227

4.2.12 Port 11.......................................................................................................................................... 231

4.2.13 Port 12.......................................................................................................................................... 234

4.2.14 Port 13.......................................................................................................................................... 239

4.2.15 Port 14.......................................................................................................................................... 241

4.2.16 Port 15.......................................................................................................................................... 249

4.3 Registers Controlling Port Function ........................................................................................ 251

4.4 Port Function Operations .......................................................................................................... 270

4.4.1 Writing to I/O port ........................................................................................................................... 270

4.4.2 Reading from I/O port..................................................................................................................... 270

4.4.3 Operations on I/O port.................................................................................................................... 270

4.4.4 Connecting to external device with different potential (1.8 V, 2.5 V, 3 V) ....................................... 271

4.5 Settings of Port Mode Register, and Output Latch When Using Alternate Function.......... 273

4.6 Cautions When Using Port Function..................................................................................... 279

4.6.1 Cautions on 1-Bit Manipulation Instruction for Port Register n (Pn) ............................................... 279

4.6.2 Cautions on the pin settings on the products other than 128-pin.................................................... 280

CHAPTER 5 CLOCK GENERATOR .................................................................................................... 282

5.1 Functions of Clock Generator................................................................................................... 282

5.2 Configuration of Clock Generator ............................................................................................ 284

5.3 Registers Controlling Clock Generator.................................................................................... 286

5.4 System Clock Oscillator ............................................................................................................ 302

5.4.1 X1 oscillator.................................................................................................................................... 302

5.4.2 XT1 oscillator.................................................................................................................................. 302

5.4.3 High-speed on-chip oscillator ......................................................................................................... 306

5.4.4 Low-speed on-chip oscillator .......................................................................................................... 306

5.5 Clock Generator Operation ....................................................................................................... 307

5.6 Controlling Clock........................................................................................................................ 309

5.6.1 Example of setting high-speed on-chip oscillator ........................................................................... 309

5.6.2 Example of setting X1 oscillation clock........................................................................................... 310

5.6.3 Example of setting XT1 oscillation clock ........................................................................................ 311

5.6.4 CPU clock status transition diagram............................................................................................... 312

5.6.5 Condition before changing CPU clock and processing after changing CPU clock ......................... 318

5.6.6 Time required for switchover of CPU clock and main system clock ............................................... 320

5.6.7 Conditions before clock oscillation is stopped ................................................................................ 321

CHAPTER 6 TIMER ARRAY UNIT...................................................................................................... 322

6.1 Functions of Timer Array Unit................................................................................................... 324

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