Panasonic TY-FB9RT Manual de usuario
1 Safety Precautions 2
1.1. General Guidelines 2
2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 3
3 About lead free solder (PbF) 4
4 Replacement 5
5 Connection 6
6 Circuit Board Layout 7
6.1. HR-Board 7
7 Block and Schematic Diagram 9
©2006 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
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7.1. Schematic Diagram Notes 9
7.2. HR-Board Block Diagram 11
7.3. HR-Board Schematic Diagram 12
8 Replacement Parts List 13
8.1. Replacement Parts List Notes 13
8.2. Electrical Replacement Parts List 14
8.3. Mechanical Replacement Parts List 15
8.4. Parts Location (1) 16
8.5. Parts Location (2) 17
Ir Through Terminal Board
CONTENTS
Page Page
ORDER NO. ITD0607040CE
D10 Canada: B07
1 Safety Precautions
1.1. General Guidelines
1.When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2.After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3.After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.1.1. Leakage Current Cold Check
1.Unplug the AC cord and connect a jumper between the two prongs on the plug.
2.Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on
the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the
chassis, the reading should be between 1MWand 5.2MW.
When the exposed metal does not have a return path to the chassis, the reading must be .
Figure 1
1.1.2. Leakage Current Hot Check (See Figure 1.)
1.Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2.Connect a 1.5kW, 10 watts resistor, in parallel with a 0.15µF capacitors, between each exposed metallic part on the set and a
good earth ground such as a water pipe, as shown in Figure 1.
3.Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.
4.Check each exposed metallic part, and measure the voltage at each point.
5.Reverse the AC plug in the AC outlet and repeat each of the above measurements.
6.The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may
be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outside of the limits
specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to
the customer.
2
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2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4.Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable
conductive material).
7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
3
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3 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
·
Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40°C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
·
Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
·
After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
4
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4 Replacement
5
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5 Connection
6
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6 Circuit Board Layout
6.1. HR-Board
A
1
3
5
2
4
6
CBD
HR-BOARD (FOIL SIDE)
TXNHR10ZZT
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HR-BOARD TXNHR10ZZT TY-FB9RT
HR-BOARD TXNHR10ZZT
Parts Location
HR-BOARD
TP1 C-2
TP2 B-2
TP3 B-2
TP4 B-2
TP
JK3301
JK3302
JK3303
H1
TP1TP2TP3
TP4
HR
1TNPA3982
PbF
ORDER NO.
B1B2
A1A2 A40
A39
B39
B40
7
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A
1
3
5
2
4
6
CBD
HR-BOARD (COMPONENT SIDE)
TXNHR10ZZT
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HR-BOARD TXNHR10ZZT TY-FB9RT
HR-BOARD TXNHR10ZZT
Parts Location
HR-BOARD
IC3301 B-3
Q3301 B-2
Q3302 C-2
Q3303 C-2
Q3304 B-2
Q3305 C-2
Q3306 C-2
Q3307 B-3
Q3308 B-4
IC
TRANSISTOR
JK3301 JK3302 JK3303
C3301
C3302
C3303
C3304
C3305
Q3301
Q3302
C3306
Q3303
C3307 C3308
Q3304
Q3305
Q3306
Q3307
Q3308
H1
D3301 D3302 D3303
R3301
R3302
R3303
R3304
R3305
R3306
R3307
R3308
IC3301
R3309
R3310
R3311
R3312
R3313
R3314
R3315
R3316
R3317
R3318
R3319
R3320
R3321
R3322 R3323
R3324
X3301
TNPA3982 1
HR
PbF
SEE REVERSE FOR ORDER NO.
A2 B1
B2
A39
A40
B39
B40
A1
1
7
8
14
8
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7 Block and Schematic Diagram
7.1. Schematic Diagram Notes
9
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10
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