Panasonic KX-T7665NE Manual de usuario

ORDERNO. KMS0306778C2

Digital ProprietaryTelephone

KX-T7665NE / KX-T7665NE-B

White version

Black version

(for Europe)

Unauthorized copying and distribution isaviolation of law.

IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF),

SOLDERING

If leadfree solderwas usedinthe manufacture of this product the printedcircuit boards will be

markedPbF.

Standardleaded, (Pb), soldercanbe usedas usual on boards without the PbF mark.

Whenthis mark does appearplease readand followthe special instructions describedinthis

manual on the use of PbF and howit might be permissible touse Pbsolderduring service and

repairwork.

1. ABOUT LEAD FREE SOLDER (PbF: Pb free)

Note:

Inthe information below, Pb, the symbol forleadinthe periodic table of elements, will referto

standardsolderorsolderthat contains lead.

We will use PbF solderwhendiscussing the leadfree solderusedinourmanufacturing process

whichis made fromTin, (Sn), Silver, (Ag), and Copper, (Cu).

This model, and others like it, manufacturedusing leadfree solderwill have PbF stampedon

the PCB. Forservice and repairwork we suggest using the same type of solderalthough, with

some precautions, standardPbsoldercanalsobe used.

Caution

-PbF solder has amelting point that is50° ~ 70° F, (30° ~ 40°C)

higher than Pb solder. Please use asoldering iron with

temperature control and adjust itto 700° ± 20° F, (370° ± 10°C). In

case of using high temperature soldering iron, please be careful

not to heat too long.

-PbF solder will tend to splash ifitisheated much higher than its

melting point, approximately1100°F, (600°C).

-Ifyou must use Pb solder on aPCB manufactured using PbF

solder, remove as much of the original PbF solder as possibleand

be sure that anyremaining ismelted prior to applying the Pb

solder.

-When applying PbF solder to doublelayered boards, please check

the component side for excess which mayflow onto the opposite

side (See figure, below).

1.1. SUGGESTEDPbF SOLDER

There are several types of PbF solderavailable commercially. While this product is

manufacturedusing Tin, Silver, and Copper, (Sn+Ag+Cu), you canalsouse Tinand Copper, (Sn+

Cu), orTin, Zinc, and Bismuth, (Sn+Zn+Bi).

Please check the manufacturer’s specific instructions forthe melting points of theirproducts

and anyprecautions forusing theirproduct withothermaterials.

The following leadfree (PbF) solderwire gauges are recommendedforservice of this product:

0.3mm, 0.6mm and 1.0mm.

1.2. HOWTO RECOGNIZE THATPb FREE SOLDERISUSED

PbF is stampedtoshowthat Pbfree solderis used. (See the figure below.)

2. FOR SERVICE TECHNICIANS

ICs and LSIs are vulnerable tostatic electricity.

Whenrepairing, the following precautions will helpprevent recurring malfunctions.

1. Cover the plasticparts boxes with aluminum foil.

2. Ground the soldering irons.

3. Use aconductive mat on the worktable.

4. Donot touch ICor LSI pins with bare fingers.

3. SPECIFICATIONS

Station Loop

Limit: 90 ohms

Calling Method: 2 pairwire

Jacks: Handset Jack, TELJack

Dimensions: Low

Angle:

High

Angle:

213 (D)mm × 177 (W)mm × 107 (H)mm

201 (D)mm × 177 (W)mm × 127 (H)mm

Weight: 0.7 kg

Design and specifications are subject tochange without notice.

4. LOCATION OF CONTROLS

5. CONNECTION

Caution:

The availabilityof D-XDPfunction depends on the software version

of the connected Business Telephone System.

Consultyour dealer for more detailsabout D-XDP.

6. DISASSEMBLY INSTRUCTIONS

1. Remove the Stand.

2. Remove 5 Screws (A).

3. Remove the Cabinet Cover.

4. Remove the Connectorfromthe MainBoard.

5. Remove 2 Screws (A).

6. Remove the MainBoardand the LCD fromthe

Cabinet Body.

7. HOW TO REPLACE A FLAT PACKAGE IC

7.1. PREPARATION

-PbF (: Pb free) Solder

-Soldering Iron

TipTemperature of 700°F ± 20°F (370°C± 10°C)

Note: We recommend a30 to 40 Watt soldering iron. Anexpert

maybe ableto use a60 to 80 Watt iron where someone with less

experience couldoverheat and damage the PCB foil.

-Flux

Recommended Flux: SpecificGravity0.82.

Type RMA(lower residue, non-cleaning type)

Note: See ABOUT LEAD FREE SOLDER (PbF: Pb free) ().

7.2. PROCEDURE

1. Tack the flat pack ICto the PCB bytemporarilysoldering two

diagonallyopposite pins inthe correct positions on the PCB.

Be certaineachpinis locatedoverthe correct padon the PCB.

2. Applyflux to all of the pins on the IC.

3. Being careful to not unsolder the tack points, slide the soldering

iron along the tips of the pins whilefeeding enough solder to the

tipso that itflowsunder the pins as theyare heated.

7.3. REMOVING SOLDERFROMBETWEENPINS

1. Add asmall amount of solder to the bridged pins.

2. With ahot iron, use asweeping motion along the flat part of the

pinto draw the solder from between the adjacent pads.

8. TROUBLESHOOTING GUIDE

8.1. NO OPERATION

Note:

Referto(1)~(4) of WAVEFORM () forwaveform.

8.2. LCD DOES NOTOPERATE

Note:

Referto(5) of WAVEFORM () forwaveform.

8.3. HANDSET DOES NOTWORK

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