Panasonic KX-T7630 Manual de usuario

ORDERNO. KMS0303671C3

Digital ProprietaryTelephone

KX-T7630

(forAustralia)

IMPORTANT INFORMATIONABOUT LEAD FREE, (PbF),

SOLDERING

Ifleadfree solderwas usedinthemanufactureofthisproducttheprintedcircuitboardswill be

markedPbF.

Standard leaded, (Pb), soldercanbeusedas usual on boardswithoutthePbF mark.

Whenthismarkdoes appearplease readand followthespecial instructionsdescribedinthis

manual on theuse ofPbF and howitmightbepermissibletouse Pbsolderduring service and

repairwork.

1. ABOUTLEADFREE SOLDER (PbF:Pbfree)

Note:

Intheinformation below, Pb, thesymbol for leadintheperiodictableofelements, will referto

standard solderor solderthatcontainslead.

Wewill use PbF whendiscussing theleadfree solderusedinour manufacturing process which

ismadefrom Tin, (Sn), Silver, (Ag), and Copper, (Cu).

Thismodel, and otherslike it, manufacturedusing leadfree solderwill have PbF stampedon the

PCB. For service and repairworkwesuggestusing thesametypeofsolderalthough, withsome

precautions, standard Pbsoldercanalsobeused.

Caution

-PbF solderhas amelting pointthat is50° ~70° F, (30° ~40°C)

higherthanPbsolder. Please use asoldering iron with

temperaturecontrol and adjust itto700° ±20° F, (370° ±10°C). In

case ofusing high temperaturesoldering iron, please becareful

nottoheat too long.

-PbF solderwill tend tosplashifitisheatedmuchhigherthanits

melting point, approximately1100°F, (600°C).

-Ifyou must use Pbsolderon aPCB manufacturedusing PbF

solder, removeas muchoftheoriginal PbF solderas possibleand

besurethat anyremaining ismeltedpriortoapplying thePb

solder.

-Whenapplying PbF soldertodoublelayeredboards, please check

thecomponentsideforexcess whichmayflow ontotheopposite

side(See figure, below).

1.1. SUGGESTEDPbF SOLDER

Thereareseveral types ofPbF solderavailablecommercially. Whilethisproductismanufactured

using Tin, Silver, and Copper,

(Sn+Ag+Cu), you canalsouse Tinand Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi).

Please check themanufac

turer’sspecificinstructionsfor themelting pointsoftheirproductsand anyprecautionsfor

using theirproductwithother

materials.

Thefollowing leadfree (PbF)solderwiresizes arerecommendedfor service ofthisproduct:

0.3mm, 0.6mm and 1.0mm.

1.2. HOWTO RECOGNIZETHATPbFREE SOLDERISUSED

PbF isstampedtoshowthatPbfree solderisused. (See thefigurebelow.)

2. FORSERVICE TECHNICIANS

ICsand LSIsarevulnerabletostaticelectricity.

Whenrepairing, thefollowing precautionswill helppreventrecurring malfunctions.

1. Covertheplasticparts boxes withaluminumfoil.

2. Ground thesoldering irons.

3. Use aconductivemat on theworktable.

4. DonottouchICorLSI pinswithbarefingers.

3. SPECIFICATIONS

Station Loop

Limit: 90 ohms

Calling Method: 2pairwire

Jacks: HandsetJack, TELJack, HeadsetJack

Dimensions: Low

Angle:

High

Angle:

265 (D)mm [Operate]×208 (W)mm ×128 (H)mm

212 (D)mm [Operate]×208 (W)mm ×202 (H)mm

213 (D)mm [Base]

Weight: 1.13kg

Design and specificationsaresubjecttochangewithoutnotice.

4. LOCATIONOFCONTROLS

5. CONNECTION

Caution:

ConsultyourdealerformoredetailsaboutXDP.

6. DISASSEMBLYINSTRUCTIONS

1. Remove 9Screws(A).

2. Remove theBottom Cabinet.

3. Remove theP. C. Board from theTop Cabinet.

7. HOWTO REPLACE AFLATPACKAGEIC

7.1. PREPARATION

-PbF (:Pbfree) Solder

-Soldering Iron

TipTemperatureof700°F±20°F(370°C±10°C)

Note:Werecommend a30 to40 Watt soldering iron. Anexpert

maybeabletouse a60 to80 Watt iron wheresomeonewithless

experience couldoverheat and damagethePCB foil.

-Flux

RecommendedFlux:SpecificGravity0.82.

TypeRMA(lowerresidue, non-cleaning type)

Note:See ABOUT LEAD FREE SOLDER (PbF: Pb free) ().

7.2. PROCEDURE

1. Tack theflat pack ICtothePCB bytemporarilysoldering two

diagonallyopposite pinsinthecorrect positionson thePCB.

Becertaineachpinislocatedoverthecorrectpadon thePCB.

2. Applyfluxtoall ofthepinson theIC.

3. Being careful tonotunsolderthetack points, slidethesoldering

iron along thetipsofthepinswhilefeeding enough soldertothe

tipsothat itflowsunderthepinsas theyareheated.

7.3. REMOVING SOLDERFROMBETWEENPINS

1. Add asmall amountofsoldertothebridgedpins.

2. Withahotiron, use asweeping motion along theflat partofthe

pintodraw thesolderfrombetweentheadjacentpads.

8. TROUBLESHOOTING GUIDE

8.1. NO OPERATION

Note:

Referto(1)~(5)ofWAVEFORM () for waveform.

8.2. LCD DOES NOTOPERATION

Note:

Referto(6)ofWAVEFORM () for waveform.

8.3. HANDSETDOES NOTWORK

Receive

Send

Note:

Referto(7)~(8)ofWAVEFORM () for waveform.

8.4. HEADSETDOES NOTWORK

Receive

Send

Note:

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