Panasonic SA-HT840EB Manual de usuario

ORDERNO.MD0502026C2

DVDHome Theater Sound System

SA-HT840EB

Colour

(S).......................Silver Type

General

Power Source:

AC 230-240 V, 50 Hz

Power consumption: 25 W

Dimensions(W×H×D): 430×60×348.3mm

Mass: 2.7kg

Amplifier section

RMS Output Power: DolbyDigital Mode

Total RMS Dolby

Digital

modePower:

800 W

At 1kHz and total harmonicof 10%

Front: 70 W/ Channel (4 )

Center: 260 W/ Channel (4 )

Surround: 70 W/ Channel (4 )

At 100Hz and total harmonicof 10%

Activesubwoofers: 260 W/ Channel (4 )

DIN Output Power: DolbyDigital Mode:

Total DIN DolbyDigital modePower:

515 W

At 1kHz and total harmonicof 1%

Front: 45 W/ Channel (4 )

Center: 165 W/ Channel (4 )

Surround: 50 W/ Channel (4 )

At 100Hz and total harmonicof 1%

Subwoofer: 160 W/ Channel (4 )

FM tuner section

FrequencyRange: 87.5-108.0MHz

(50kHz instep)

Sensitivity: 1.5 V (IHF)

S/N 26dB 1.2 V

AntennaTerminal: 75 (non balance)

AM tuner section (AM/MW)

FrequencyRange: 522-1629kHz (9kHz instep)

AM SensitivityS/N 20dB at

999kHz:

560 V/m

PhoneJack:

Terminal: Stereo3.5mm jack

Disc section

Discs played[8cm or12 cm]:

(1)DVD-RAM (DVD-VR compatible, JPEG formatteddiscs)

(2)DVD-Audio

(3)DVD-Video

(4)DVD-R, DVD-RW(DVD-Videocompatible)

+R, +RW(Videocompatible)

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(5)CD-Audio(CD-DA)

(6)VideoCD

(7)SVCD (Conforming toIEC62107)

(8)CD-R/CD-RW(CD-DA, Video-CD, SVCD, MP3, WMA,

JPEG formatteddiscs)

(9)MP3/WMA

Maximumnumber of recognizableaudioand picture

contentsand groups:

4000 audioand picture

contentsand 400 groups

Compatiblecompression rate:

MP3: between32 kbpsand 320 kbps

WMA: between48 kbpsand 320 kbps

(10)JPEG

Maximumnumber of recognizableaudioand picture

contentsand groups:

4000 audioand picture

contentsand 400 groups

Exif Ver 2.1JPEG Baselinefiles

Picture resolution: between320 x240 and 6144 x

4096 pixels(sub sampling is4:2:2or4:2:0)

(11)HighMATLevel 2(Audioand lmage)

Pick up:

Source of light beam: SemiconductorLaser

Wavelength:

CD: 785nm

DVD: 662nm

Laser power: CLASS 2/ CLASS 3A

Audiooutput (DISC):

Number of channels: 5.1ch(FL, FR, C, SL, SR,

SW)

Audioperformance (measuredat LINE OUTterminal):

Frequencyresponse:

DVD (linear audio): 10 Hz-22 kHz (48 kHz

sampling)

10 Hz-44 kHz (96 kHz

sampling)

DVD-Audio: 10 Hz-88 kHz (192 kHz

sampling)

CD-Audio: 10 Hz-20 kHz

S/N ratio:

CD-Audio: 95 dB

Dynamicrange:

DVD (linear audio): 95 dB

CD-Audio: 93 dB

Total harmonicdistortion:

CD-Audio: 0.005 %

Videosection

Videosystem:

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Signal system: PAL625/50, PAL525/60,

NTSC

Compositevideooutput:

Output level: 1Vp-p(75 )

Terminal: Pinjack (1system)

Scart jack (1system)

S-videooutput:

Y output level: 1Vp-p(75 )

C output level: PAL; 0.3Vp-p(75 )

NTSC; 0.286 Vp-p(75 )

Terminal S terminal (1system)

Scart jack (1system)

Component videooutput (480P/480I):

Y output level: 1Vp-p(75 )

PBoutput level: 0.7Vp-p(75 )

PRoutput level: 0.7Vp-p(75 )

Terminal: Pinjack (Y: green, PB: blue,

PR: red) (1system)

RGB videooutput:

R output level: 0.7Vp-p(75 )

G output level: 0.7Vp-p(75 )

B output level: 0.7Vp-p(75 )

Terminal: Scart jack (1system)

Power consumption instandbymode:

approx0.7W

Note:

1. Specificationsare subject tochangewithout notice.

Mass and dimensionsare approximate.

2. Total harmonicdistortion ismeasuredbythedigital

spectrumanalyzer.

Solder:

Thismodel uses leadfree solder (PbF).

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2005 PanasonicAVCNetworks Singapore Pte. Ltd. All rights

reserved. Unauthorized copying and distribution isaviolation of

law.

1. Use of Active Subwoofer

1.1. Checking Player when Active Subwoofer isnot used

1. Thisunituses the active subwoofer to supplythe power of the

component, and the active subwoofer shouldbe connected to the

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component to check operational conditions of the component.

2. Ifthe active subwoofer isnot availabledue to repairof the unit,

use the following equipment.

Jigproduct number: RFKZ0182 (110V, 127V, 220V, 230V-240V for

overseas domesticuse)

2. Safety Precautions

2.1. GENERALGUIDELINES

1. When servicing, observe the original lead dress. Ifashort circuit

isfound, replace all parts which have been overheated or

damaged bythe short circuit.

2. After servicing, see to itthat all the protective devices such as

insulation barriers, insulation papers shields are properly

installed.

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3. After servicing, carryout the following leakage current checks to

prevent the customer from being exposed to shock hazards.

2.1.1. LEAKAGE CURRENTCOLD CHECK

1. Unplug the AC cord and connect ajumper between the two

prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between the

jumpered AC plug and each exposed metalliccabinet part on the

equipment such as screwheads, connectors, control shafts, etc.

When the exposed metallicpart has areturn path to the chassis,

the reading shouldbe between 1M and 5.2M . / When the

exposed metal does not have areturn path to the chassis, the

reading must be . Figure 1

2.1.2. LEAKAGE CURRENTHOTCHECK (See Figure 1 .)

1. Plug the AC cord directlyinto the AC outlet. Donot use an

isolation transformer for thischeck.

2. Connect a1.5k , 10 watts resistor, inparallel with a0.15 F

capacitors, between each exposed metallicpart on the set and a

good earth ground such as awater pipe, as shownin Figure 1.

3. Use an AC voltmeter, with 1000 ohms/voltor more sensitivity, to

measure the potential across the resistor.

4. Check each exposed metallicpart, and measure the voltage at

each point.

5. Reverse the AC plug inthe AC outlet and repeat each of the above

measurements.

6. The potential at anypoint shouldnot exceed 0.75 volts RMS. A

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leakage current tester (Simpson Model 229 or equivalent) maybe

used to make the hot checks, leakage current must not exceed 1/2

milliamp. Incase ameasurement isoutside of the limits specified,

there isapossibilityof ashock hazard, and the equipment should

be repaired and rechecked before itisreturned to the customer.

3. Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

Some semiconductor(solidstate) devices canbe damagedeasilybystatic electricity. Such

components commonlyare calledElectrostaticallySensitive (ES) Devices. Examples of typical

ES devices are integratedcircuits and some field-effect transistors and semiconductor"chip"

components. The following techniques shouldbe usedtohelpreduce the incidence of

component damage causedbyelectrostatic discharge (ESD).

1. Immediatelybefore handling anysemiconductor component or

semiconductor-equipped assembly, drainoff anyESDon your

bodybytouching aknownearth ground. Alternatively, obtainand

wear acommerciallyavailabledischarging ESDwrist strap, which

shouldbe removed for potential shock reasons prior to applying

power to the unitunder test.

2. After removing an electrical assemblyequipped with ES devices,

place the assemblyon aconductive surface such as aluminum

foil, to prevent electrostaticcharge buildup or exposure of the

assembly.

3. Use onlyagrounded-tipsoldering iron to solder or unsolder ES

devices.

4. Use onlyan anti-staticsolder removal device. Some solder

removal devices not classified as "anti-static(ESDprotected)"

can generate electrical charge sufficient to damage ES devices.

5. Donot use freon-propelled chemicals. These can generate

electrical charges sufficient to damage ES devices.

6. Donot remove areplacement ES device from its protective

package until immediatelybefore you are readyto install it. (Most

replacement ES devices are packaged with leads electrically

shorted together byconductive foam, aluminum foil or

comparableconductive material).

7. Immediatelybefore removing the protective material from the

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leads of areplacement ES device, touch the protective material to

the chassisor circuitassemblyinto which the device will be

installed.

Caution

Besure no power isapplied to the chassisor circuit, and observe

all other safetyprecautions.

8. Minimize bodilymotions when handling unpackaged replacement

ES devices. (Otherwise harmless motion such as the brushing

together of your clothes fabricor the lifting of your foot from a

carpeted floor can generate staticelectricity(ESD)sufficient to

damage an ES device).

4. Before Repair and Adjustment (Using Active

Subwoofer)

Disconnect AC power, discharge PowerSupplyCapacitors C546~C549 through a 10 , 10 W

resistortoground.

DO NOTSHORT-CIRCUITDIRECTLY (witha screwdriverblade, forinstance), as this may

destroysolidstate devices.

Afterrepairs are completed, restore powergraduallyusing a variac, toavoidovercurrent.

Current consumption at AC 230 V, 50 Hz inNO SIGNALmode shouldbe ~ 620 mA.

5. Protection Circuitry

The protection circuitrymayhave operatedif eitherof the following conditions are noticed:

-Nosound isheard when the power isturned on.

-Sound stops during aperformance.

The function of this circuitryis toprevent circuitrydamage if, forexample, the positive and

negative speakerconnection wires are

“shorted”, orif speakersystems withanimpedance less thanthe indicatedratedimpedance of

the amplifierare used.

If this occurs, followthe procedure outlines below:

1. Turn off the power.

2. Determine the cause of the problem and correct it.

3. Turn on the power once againafter one minute.

Note:

Whenthe protection circuitryfunctions, the unit will not operate unless the poweris first turned

off and thenon again.

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6. Precaution of Laser Diode

ON :

Thisproduct utilizers aclass 1laser. Invisiblelaser radiation is

emitted from the optical pick up lens.

When the unitisturned on:

Wavelength :662nm(DVD)/785nm(CD)

Maximum output radiation power from pick up :100 W/VDE

Laser radiation from pick up unitissafetylevel, but be sure the

followings:

1. Donot disassemblethe optical pick up unit, since radiation from

exposed laser diode isdangerous.

2. Donot adjust the variableresistor on the pick up unit. Itwas

alreadyadjusted.

3. Donot look at the focus lens using optical instruments.

4. Recommend not to look at pick up lens for along time.

7. About Lead Free Solder (PbF)

Distinction of PbF PCB: PCBs (manufactured) using leadfree solderwill have a Pbf stampon

the PCB.

Caution:

-Pb free solder has ahigher melting point than standard solder;

Typicallythe melting point is50 -70°F (30 -40°C)higher. Please

use ahigh temperature soldering iron. Incase of the soldering

iron with temperature control, please set itto 700 ± 20°F (370 ±

10°C).

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