Panasonic DVD-XV10E Manual de usuario

ORDERNO.ODSD020319C2

DVDPlayer

DVD-XV10E / DVD-XV10EB / DVD-XV10EG / DVD-XV10EE

Colour

(S).......................Silver Type

SPECIFICATIONS

Specifications

Power supply: AC220-240 V, 50 Hz

Power consumption: 14 W

Dimensions: 430 (W)×300 (D)×52 (H) mm

(excluding protrusions)

Mass: 2.9kg

Signal system: PAL625/50, PAL525/60,

NTSC

Operating temperature range: +5to+35°C

Operating humidityrange: 5 to90 %RH (no

condensation)

Region number: Region No.2

(DVD-XV10E, EB, EG)

Region No.5

(DVD-XV10EE only)

Discs played[8cm or12 cm]:

(1) DVD-Video

DVD-R (DVD-Videocompatible)

(2) CD-Audio(CD-DA)

(3)VideoCD

(4)CD-R/CD-RW(CD-DA, VideoCD formatteddiscs)

(5) MP3

Maximumnumber of tracks and groupsrecognizable:

999 tracks and 99 groups

Compatiblecompression rate:between32 kbpsand

320 kbps

Videooutput:

Output level: 1Vp-p(75 )

Output terminal: Pinjack (1system)/AV

S videooutput:

Y output level: 1Vp-p(75 )

C output level: NTSC; 0.286 Vp-p(75 )

PAL; 0.300 Vp-p(75 )

Output terminal: S terminal (1system)/AV

RGB videooutput:

R output level: 0.7Vp-p(75 )

G output level: 0.7Vp-p(75 )

B output level: 0.7Vp-p(75 )

Output terminal: AV (1system)

Audiooutput:

Output level: 2Vrms (1kHz, 0dB)

Output terminal: Pinjack/AV

Number of terminals:

2CH: 1system

Subwoofer output (0.1ch): 1system

Audioperformance:

(1)Frequencyresponse:

DVD (linear audio): 4Hz-22 kHz (48 kHz

sampling)

4Hz-44 kHz (96 kHz

sampling)

CD audio: 4Hz-20 kHz

(2)S/N ratio:

CD audio: 115 dB

(3)Dynamicrange:

DVD (linear audio): 102 dB

CD audio: 98 dB

(4)Total harmonicdistortion:

CD audio: 0.0025 %

Digital audiooutput:

Optical digital output: Optical terminal

Pickup:

Wavelength: 658 nm/790 nm

Laser power: CLASS 2/CLASS 1

Power consumption instandbymode:

approx. 3W

Note:

Specificationsare subject tochangewithout notice.

Mass and dimensionsare approximate.

Unauthorized copying and distribution isaviolation of law.

1. SAFETY PRECAUTIONS

1.1. GENERALGUIDELINES

1. When servicing, observe the original lead dress. Ifashort circuit

isfound, replace all parts which have been overheated or

damaged bythe short circuit.

2. After servicing, see to itthat all the protective devices such as

insulation barriers, insulation papers shields are properly

installed.

3. After servicing, make the following leakage current checks to

prevent the customer from being exposed to shock hazards.

1.1.1. LEAKAGE CURRENTCOLD CHECK

1. Unplug the AC cord and connect ajumper between the two

prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between the

jumpered AC plug and each exposed metalliccabinet part on the

equipment such as screwheads, connectors, control shafts, etc.

When the exposed metallicpart has areturn path to thechassis,

the reading shouldbe between 1M and 5.2M . / When the

exposed metal does not have areturn path to the chassis, the

reading must be . Figure 1

1.1.2. LEAKAGE CURRENTHOTCHECK (See Figure 1 .)

1. Plug the AC cord directlyinto the AC outlet. Donot use an

isolation transformer for thischeck.

2. Connect a1.5k , 10 watts resistor, inparallel with a0.15 F

capacitors, between each exposed metallicpart on the set and a

good earth ground such as awater pipe, as shownin Figure 1 .

3. Use an AC voltmeter, with 1000 ohms/voltor more sensitivity, to

measure the potential across the resistor.

4. Check each exposed metallicpart, and measure the voltage at

each point.

5. Reverse the AC plug inthe AC outlet and repeat each of the above

measurements.

6. The potential at anypoint shouldnot exceed 0.75 volts RMS. A

leakage current tester (Simpson Model 229 or equivalent) maybe

used to make the hot checks, leakage current mu3st not exceed 1/

2milliamp. Incase ameasurement isoutsideof the limits

specified, there isapossibilityof ashock hazard, and the

equipment shouldbe repaired and rechecked before itisreturned

to the customer.

2. PREVENTION OF ELECTRO STATIC DISCHARGE

(ESD) TO ELECTROSTATICALLY SENSITIVE (ES)

DEVICES

Some semiconductor(solidstate) devices canbe damagedeasilybystatic electricity. Such

components commonlyare calledElectrostaticallySensitive (ES) Devices. Examples of typical

ES devices are integratedcircuits and some field-effect transistorsand semiconductor"chip"

components. The following techniques shouldbe usedtohelpreduce the incidence of

component damage causedbyelectrostatic discharge (ESD).

1. Immediatelybefore handling anysemiconductor component or

semiconductor-equipped assembly, drainoff anyESDon your

bodybytouching aknownearth ground. Alternatively, obtainand

wear acommerciallyavailabledischargingESDwrist strap, which

shouldbe removed for potential shock reasons prior to applying

power to the unitunder test.

2. After removing an electrical assemblyequipped with ES devices,

place the assemblyon aconductive surface such as alminum foil,

to prevent electrostaticcharge buildup or exposure of the

assembly.

3. Use onlyagrounded-tipsoldering iron to solder or unsolder ES

devices.

4. Use onlyan anti-staticsolder removal device. Some solder

removal devices not classified as "anti-static(ESDprotected)"

can generate electrical charge sufficient to damage ES devices.

5. Donot use freon-propelled chemicals. These can generate

electrical charges sufficient to damage ES devices.

6. Donot remove areplacement ES device from its protective

package until immediatelybefore you are readyto install it. (Most

replacement ES devices are packaged with leads electrically

shorted together byconductive foam, alminum foil or

comparableconductive material).

7. Immediatelybefore removing the protective material from the

leads of areplacement ES device, touch the protective material to

the chassisor circuitassemblyinto which the device will be

installed.

Caution

Besure no power isapplied to the chassisor circuit, and observe

all other safetyprecautions.

8. Minimize bodilymotions when handling unpackaged replacement

ES devices. (Otherwise hamless motion such as the brushing

together of your clothes fabricor the lifting of your foot from a

carpeted floor can generate staticelectricity(ESD)sufficient

todamage an ES device).

3. Precaution of Laser Diode

4. General Description

4.1. Operating instructions

5. Disassembling the Casing and Checking P.C.B.s

5.1. DissasemblyProcedure

5.2. Caseing Parts and P.C.B. Positions

5.3. Top Cover

1. Unscrew the screws.

5.4. Tray

1. Insert the screwdriver into the trayopen/close hole.

2. Move screwdriver from the left to the right to open the tray.

3. Remove the traydressing from the traysection.

5.5. Front Panel

1. Remove the connectors

1. Unscrew the screws.

2. Release the tabs.

5.6. Mechanism Unit

1. Unscrew the screws.

2. Remove the connectors.

3. Pull out the mechanism unitvertically.

5.7. Terminal P.C.B.

1. Unscrew the screws.

2. Remove the connectors.

5.8. ModuleP.C.B.

1. Unscrew the screws.

2. Remove the connectors.

3. Press each tab with the nipper to pull out the modulePCB

vertically.

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