Panasonic DVD-S1E Manual de usuario

ORDERNO.CHM0604019CE

DVDPlayer

DVD-S1E / DVD-S1EB / DVD-S1EG

DL4.5Mechanism Series

Color

(S).......................Silver Type

SPECIFICATIONS

Specifications

Power supply: AC230-240 V, 50 Hz

(DVD-S1EB)

AC230 V, 50 Hz

(DVD-S1E/EG)

Power consumption: 10 W

Power consumption instandbymode:

approx. 1W

Dimensions: 360 (W) × 251 (D) × 43 (H) mm

Mass: 1.8kg(approx.)

Signal system: PAL625/50, PAL525/60, NTSC

Operating temperature range: + 5to+ 35 °C

Operating humidityrange: 5to90 %RH (no

condensation)

Discs played[8cm (3” ) or12 cm (5” )]:

(1) DVD (DVD-Video)

(2) DVD-R (DVD-Video, MP3*2,4, JPEG*3,4)

(3) DVD-RW(DVD-Video, MP3*2,4, JPEG*3,4)

(4) +R/+RW(Video)

(5) CD, CD-R / CD-RW(CD-DA, VideoCD, SVCD*1, MP3*2,4,

JPEG*3,4)

(6) DVD-R DL(DVD-Video)

(7) +R DL(Video)

*1 Conforming toIEC62107

*2 MPEG-1Layer 3, MPEG-2Layer 3

*3 Exif Ver2.1JPEG Baselinefiles

Picture resolution: between320 × 240 and 6144 × 4096

pixels(Sub sampling is4:2:2or4:2:0)

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*4 Thetotal combinedmaximumnumber of recognizable

audioand picture contentsand groups: 1000 audioand

picture contentsand 256 groups.

Videooutput:

Output level: 1Vp-p(75 )

Output terminal: Pinjack (1system)/AV

S videooutput:

Y output level: 1Vp-p(75 )

C output level: NTSC: 0.286 Vp-p(75 )

PAL: 0.300 Vp-p(75 )

Output terminal: AV

Component videooutput: [NTSC: 525(480)p/525(480)i,

PAL: 625(576)p/625(576)i]

Y output level: 1Vp-p(75 )

P B output level: 0.7Vp-p(75 )

P R output level: 0.7Vp-p(75 )

Output terminal: Pinjack (Y: green, P B : blue,

P R : red)

Number of terminals: 1system

RGB videooutput:

R output level: 0.7Vp-p(75 )

G output level: 0.7Vp-p(75 )

B output level: 0.7Vp-p(75 )

Output terminal: AV

Videoperformance:

Horizontal resolution: More than500 lines

VideoS/N ratio: More than65dB

Audiooutput:

Output level: 2Vrms (1kHz, 0dB)

Output terminal: Pinjack/AV

Number of terminals:

2channel: 1system

Audioperformance:

(1) Frequencyresponse:

DVD (linear audio): 4Hz-22 kHz (48 kHz sampling)

4Hz-44 kHz (96 kHz sampling)

CD audio: 4Hz-20 kHz

(2) S / N ratio:

CD audio: 115 dB

(3) Dynamicrange:

DVD (linear audio): 92 dB

CD audio: 90 dB

(4) Total harmonic

distortion:

CD audio: 0.003 %

Digital audiooutput:

Coaxial digital output: Pinjack

Pickup

Wavelength: 653 nm/ 790 nm

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Laser power: CLASS 1/ CLASS 3A

Note:

Specificationsare subject tochangewithout notice.

Mass and dimensionsare approximate.

Solder:

Thismodel uses leadfree solder (PbF).

Unauthorized copying and distribution isaviolation of law.

1. SAFETY PRECAUTIONS

1.1. GENERALGUIDELINES

1. When servicing, observe the original lead dress. Ifashort circuit

isfound, replace all parts which have been overheated or

damaged bythe short circuit.

2. After servicing, see to itthat all the protective devices such as

insulation barriers, insulation papers shields are properly

installed.

3. After servicing, make the following leakage current checks to

prevent the customer from being exposed to shock hazards.

1.1.1. LEAKAGE CURRENTCOLD CHECK

1. Unplug the AC cord and connect ajumper between the two

prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between the

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jumpered AC plug and each exposed metalliccabinet part on the

equipment such as screwheads, connectors, control shafts, etc.

When the exposed metallicpart has areturn path to the chassis,

the reading shouldbe between 1M and 5.2M . / When the

exposed metal does not have areturn path to the chassis, the

reading must be . Figure 1

1.1.2. LEAKAGE CURRENTHOTCHECK (See Figure 1 .)

1. Plug the AC cord directlyinto the AC outlet. Donot use an

isolation transformer for thischeck.

2. Connect a1.5k , 10 watts resistor, inparallel with a0.15 F

capacitors, between each exposed metallicpart on the set and a

good earth ground such as awater pipe, as shownin Figure 1.

3. Use an AC voltmeter, with 1000 ohms/voltor more sensitivity, to

measure the potential across the resistor.

4. Check each exposed metallicpart, and measure the voltage at

each point.

5. Reverse the AC plug inthe AC outlet and repeat each of the above

measurements.

6. The potential at anypoint shouldnot exceed 0.75 volts RMS. A

leakage current tester (Simpson Model 229 or equivalent) maybe

used to make the hot checks, leakage current must not exceed 1/2

milliamp. Incase ameasurement isoutside of the limits specified,

there isapossibilityof ashock hazard, and the equipment should

be repaired and rechecked before itisreturned to the customer.

2. PREVENTION OF ELECTRO STATIC DISCHARGE

(ESD) TO ELECTROSTATICALLY SENSITIVE (ES)

DEVICES

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Some semiconductor(solidstate) devices canbe damagedeasilybystatic electricity. Such

components commonlyare calledElectrostaticallySensitive (ES) Devices. Examples of typical

ES devices are integratedcircuits and some field-effect transistorsand semiconductor"chip"

components. The following techniques shouldbe usedtohelpreduce the incidence of

component damage causedbyelectrostatic discharge (ESD).

1. Immediatelybefore handling anysemiconductor component or

semiconductor-equipped assembly, drainoff anyESDon your

bodybytouching aknownearth ground. Alternatively, obtainand

wear acommerciallyavailabledischarging ESDwrist strap, which

shouldbe removed for potential shock reasons prior to applying

power to the unitunder test.

2. After removing an electrical assemblyequipped with ES devices,

place the assemblyon aconductive surface such as alminum foil,

to prevent electrostaticcharge buildup or exposure of the

assembly.

3. Use onlyagrounded-tipsoldering iron to solder or unsolder ES

devices.

4. Use onlyan anti-staticsolder removal device. Some solder

removal devices not classified as "anti-static(ESDprotected)"

can generate electrical charge sufficient to damage ES devices.

5. Donot use freon-propelled chemicals. These can generate

electrical charges sufficient to damage ES devices.

6. Donot remove areplacement ES device from its protective

package until immediatelybefore you are readyto install it. (Most

replacement ES devices are packaged with leads electrically

shorted together byconductive foam, alminum foil or comparable

conductive material).

7. Immediatelybefore removing the protective material from the

leads of areplacement ES device, touch the protective material to

the chassisor circuitassemblyinto which the device will be

installed.

Caution

Besure no power isapplied to the chassisor circuit, and observe

all other safetyprecautions.

8. Minimize bodilymotions when handling unpackaged replacement

ES devices. (Otherwise hamless motion such as the brushing

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together of your clothes fabricor the lifting of your foot from a

carpeted floor can generate staticelectricity(ESD)sufficient

todamage an ES device).

3. PRECAUTION OF LASER DIODE

4. SERVICE CAUTION BASED ON LEGAL

RESTRICTIONS

4.1. General description about Lead Free Solder (PbF)

The leadfree solderhas beenusedinthe mounting process of all electrical components on the

printedcircuit boards usedforthis equipment inconsidering the globallyenvironmental

conservation.

The normal solderis the alloyof tin(Sn) and lead(Pb). Onthe otherhand, the leadfree solderis

the alloymainlyconsists of tin(Sn), silver(Ag) and Copper(Cu), and the melting point of the

leadfree solderis higherapprox.30°C (86°F) more thanthat of the normal solder.

Definition of PCB LeadFree Solderbeing used

Service caution forrepairwork using LeadFree Solder(PbF)

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-The lead free solder has to be used when repairing the equipment

for which the lead free solder isused. (Definition: The letter of

“PbF” isprinted on the PCB using the lead free solder.)

-To put lead free solder, itshouldbe well molten and mixed with the

original lead free solder.

-Remove the remaining lead free solder on the PCB cleanlyfor

soldering of the new IC.

-Since the melting point of the lead free solder ishigher than that of

the normal lead solder, ittakes the longer time to meltthe lead

free solder.

-Use the soldering iron (more than 70W) equipped with the

temperature control after setting the temperature at 350±30°C(662

±86°F).

RecommendedLeadFree Solder(Service Parts Route.)

The following 3 types of leadfree solderare available through the service parts route.

-RFKZ03D01K-----------(0.3mm 100g Reel)

-RFKZ06D01K-----------(0.6mm 100g Reel)

-RFKZ10D01K-----------(1.0mm 100g Reel)

Note

*Ingredient: tin(Sn) 96.5%, silver (Ag) 3.0%, Copper (Cu) 0.5%,

Cobalt(Co) / Germanium (Ge) 0.1to 0.3%

5. PREVENTION OF STATIC ELECTRICITY

DISCHARGE

The laserdiode inthe traverse unit (optical pickup) maybrake downdue tostatic electricityof

clothes orhumanbody. Use due caution toelectrostatic breakdownwhenservicing and

handling the laserdiode.

5.1. Grounding for electrostaticbreakdownprevention

Some devices suchas the DVD playeruse the optical pickup (laserdiode) and the optical

pickup will be damagedbystatic electricityinthe working environment. Proceedservicing

works underthe working environment where grounding works is completed.

5.1.1. Worktablegrounding

1. Put aconductive material (sheet) or iron sheet on the area where

the optical pickup isplaced, and ground the sheet.

5.1.2. Human bodygrounding

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1. Use the anti-staticwrist strap to discharge the staticelectricity

form your body.

5.1.3. Handling of optical pickup

1. To keep the good qualityof the optical pickup maintenance parts

during transportation and before installation, the both ends of the

laser diode are short-circuited. After replacing the parts with new

ones, remove the short circuitaccording to the correct procedure.

(See thisTechnical Guide.)

2. Donot use atester to check the laser diode for the optical pickup.

Failure to do so will damage the laser diode due to the power

supplyinthe tester.

5.2. Handling Precautions for Traverse Unit(Optical Pickup)

1. Donot give aconsiderableshock to the traverse unit(optical

pickup) as ithas an extremelyhigh-precise structure.

2. When replacing the optical pickup, install the flexiblecableand

cut its short land with anipper. See the optical pickup

replacement procedure inthisTechnical Guide. Before replacing

the traverse unit, remove the short pinfor preventing static

electricityand install anew unit. Connect the connector as short

times as possible.

3. The flexiblecablemaybe cut off ifan excessive force isapplied to

it. Use caution when handling the cable.

4. The half-fixed resistor for laser power adjustment cannot be

adjusted. Donot turn the resistor.

6. DISASSEMBLING THE CASING AND CHECKING

P.C.B.S

6.1. DisassemblyProcedure

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6.2. Casing Parts and P.C.B. Positions

6.3. Top Panel

1. Unscrew the screws.

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6.4. Front Panel

1. Release the connector.

2. Release the tabs.

6.5. Front angleand Operation P.C.B. and Power SW P.C.B.

1. Unscrew the screws.

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