Panasonic PAN1326C Guía

PAN1326C Bluetooth

Basic Data Rate and Low Energy Module

Design Guide

Rev. 1.0

Wireless Modules





PAN1326C Bluetooth Module

Design Guide Rev. 1.0 Page 2

Overview

Panasonic’s new PAN1326C is a Host Controlled

Interface (HCI) Bluetooth RF module that brings

Texas Instrument’s seventh generation Bluetooth

core integrated circuit, the CC2564, to an easy-to-

use module format. The PAN1326C is Bluetooth-4.2-

compliant and it offers best-in-class RF performance

with about twice the range of other Bluetooth Low

Energy solutions. Panasonic’s tiny footprint

technology has produced a module of only

85.5 mm². The module is designed to accommodate

PCBs pad pitch of 1.3 mm and as few as two layers

for easy implementation and manufacturing. The

module has been designed to be 100 % pin-

compatible with previous generations of Texas

Instruments-based Bluetooth HCI modules.

Features

•Bluetooth 4.2 Basic Data Rate (BR) and Low

Energy (LE)

•Dimensions 15.6 x 8.7 x 1.9 mm

•Integrated high speed crystal oscillator (26 MHz)

Bluetooth

•Scatternet and piconets simultaneously

•Synchronous Connection Oriented (SCO) links on

the same piconet

•Support for All Voice Air-Coding - Continuously

Variable Slope Delta (CVSD), A-law, µ-law,

modified Subband Coding (mSBC), and

transparent (uncoded)

•Assisted mode for HFP 1.6 Wideband Speech

(WBS) profile or A2DP profile to reduce host

processing and power

•Support of multiple Bluetooth profiles with

enhanced QoS

•Multiple sniff instances tightly coupled to achieve

minimum power consumption

•Independent buffering for Low Energy allows large

numbers of multiple connections without affecting

BR or EDR performance

•Built-in coexistence and prioritization handling for

BR, EDR, and Low Energy

•Capabilities of link layer topology Scatternet - can

act concurrently as peripheral and central

•Network support for up to 10 devices

•Time line optimization algorithms to achieve

maximum channel utilization

Characteristics

•Bluetooth 4.2

•Receiver sensitivity -93 dBm

•Output power 12 dBm

•Power supply 1.7 to 4.8 V

•Power consumption Tx 40 mA

•Power consumption Rx 20 mA

•Sleep mode 135 µA

•Operating temperature range -45 ºC to +85 ºC

PAN1326C Bluetooth Module

Design Guide Rev. 1.0 Page 3

Table of Contents

1About This Document.........................................................................................................................4

1.1 Purpose and Audience ..............................................................................................................4

1.2 Revision History.........................................................................................................................4

1.3Use of Symbols .........................................................................................................................4

1.4 Related Documents ...................................................................................................................4

2PAN1326C............................................................................................................................................5

2.1 PAN1326C Block Diagram ........................................................................................................5

2.2 PAN1326C Placement Recommendations ................................................................................5

3PAN1326C Breakout Board................................................................................................................6

3.1 PAN1326C Breakout Board Component Placement .................................................................6

3.2 PAN1326C Breakout Board Schematic .....................................................................................7

4EM Adapter BoosterPack ...................................................................................................................8

5MSP432 Launchpad ............................................................................................................................9

6Appendix ...........................................................................................................................................10

6.1 Ordering Information................................................................................................................10

6.2 Contact Details ........................................................................................................................10

6.3 Product Information .................................................................................................................10

7Life Support Policy ...........................................................................................................................12

PAN1326C Bluetooth Module

1 About This Document

Design Guide Rev. 1.0 Page 4

1 About This Document

1.1 Purpose and Audience

This Design Guide applies to the Bluetooth development platform PAN1326C Experimenter Kit.

The intention is to enable our customers to easily and fast integrate our module PAN1326C in

their product. This guide describes the Hardware and gives useful hints.

1.2 Revision History

Revision

Date

Modifications/Remarks

1.0

14.11.2017

1st version.

1.3 Use of Symbols

Symbol

Description

Note

Indicates important information for the proper use of the product. Non-observance

can lead to errors.

Attention

Indicates important notes that, if not observed, can put the product’s functionality

at risk.

[chapter number]

[chapter title]

Cross reference

Indicates crossreferences within the document.

Example:

Description of the symbols used in this document 1.3 Use of Symbols.

1.4 Related Documents

Please refer to the Panasonic website for related documents 6.3 Product Information

For further information refer to the Ti WIKI for CC256x CC256x WIKI

PAN1326C Bluetooth Module

2 PAN1326C

Design Guide Rev. 1.0 Page 5

2 PAN1326C

2.1 PAN1326C Block Diagram

2.2 PAN1326C Placement Recommendations

Chip

Antenna

Texas Instruments

CC256x

BT-HCI Chip

UART

GPIOs

Audio PCM/I2C

Reset

32 kHz input

Vcc 3.3 V

LPF

PAN132x

Bluetooth 4.2 Module

Crystal

26 MHz

Top View

8.7

15.6

Restricted Area

No copper any layer

5.00

3.00

Min. 15mm

Dimensions are in mm.

Use a Ground plane in the

area surrounding the

PAN1326C module wherever

possible.

Min. 40mm

If possible place PAN1326C in the

center of mother PCB.

Place PAN1326C at the edge of

mother PCB.

PAN1326C WITH ANTENNA

PLACEMENT

PAN1326C Bluetooth Module

3 PAN1326C Breakout Board

Design Guide Rev. 1.0 Page 6

3 PAN1326C Breakout Board

3.1 PAN1326C Breakout Board Component Placement

PAN1326C Bluetooth Module

3 PAN1326C Breakout Board

Design Guide Rev. 1.0 Page 7

3.2 PAN1326C Breakout Board Schematic

PAN1326C Bluetooth Module

4 EM Adapter BoosterPack

Design Guide Rev. 1.0 Page 8

4 EM Adapter BoosterPack

Note: If you purchase the adapter board directly via Texas Instruments or a related distributor,

the crystal oscillator next to C7 is not equipped. Please be aware, that in this case you are

missing the 32 kHz slow clock and have to solder it on the board.

PAN1326C Bluetooth Module

5 MSP432 Launchpad

Design Guide Rev. 1.0 Page 9

5 MSP432 Launchpad

The installation and tools are described in the Quick Start Guide for the MSP432 Launch Pad

on the TI Wiki page Getting Started Guide for MSP432 + CC2564C

PAN1326C Bluetooth Module

6 Appendix

Design Guide Rev. 1.0 Page 10

6 Appendix

6.1 Ordering Information

Variants and Versions

Order Number

Brand Name

Description

MOQ1

ENW89819AYKF

Experimenter Kit

1x PAN1326C Breakout Board,

1x Texas Instruments MSP430 Launchpad,

1x Texas Instruments Boost/CCEMAdapter

ENW89819AXKF

1326C Breakout Board

1x PAN1326C Breakout Board

6.2 Contact Details

6.2.1 Contact Us

Please contact your local Panasonic Sales office for details on additional product options and

services:

For Panasonic Sales assistance in the EU, visit

https://eu.industrial.panasonic.com/about-us/contact-us

Email: [email protected]onic.com

For Panasonic Sales assistance in North America, visit the Panasonic Sales & Support Tool to

find assistance near you at

https://na.industrial.panasonic.com/distributors

Please visit the Panasonic Wireless Technical Forum to submit a question at

https://forum.na.industrial.panasonic.com

6.3 Product Information

Please refer to the Panasonic Wireless Connectivity website for further information on our

products and related documents:

For complete Panasonic product details in the EU, visit

http://pideu.panasonic.de/products/wireless-modules.html

For complete Panasonic product details in North America, visit

Abbreviation for Minimum Order Quantity (MOQ). The default MOQ for mass production is 1 500 pieces,

fewer only on customer demand. Samples for evaluation can be delivered at any quantity via the distribution

channels.

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