Panasonic KX-TG2323AGB Manual de usuario

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KX-TG2323AGB

KX-TGA231AGB

2.4GHz Digital Cordless Answering

System

Black Version

(for Argentina)

Telephone Equipment

ORDER NO. KM40501578CE

1 ABOUT LEAD FREE SOLDER (PbF: Pb free) 4

1.1. Suggested PbF Solder 4

1.2. How to Recognize that Pb Free Solder is Used 5

2 FOR SERVICE TECHNICIANS 6

3 CAUTION 6

4 BATTERY 7

4.1. Battery Charge 7

4.2. Battery Recharge 7

4.3. Battery Information 7

4.4. Battery Replacement 8

5 LOCATION OF CONTROLS 9

5.1. Base Unit 9

5.2. Handset 10

6 DISPLAY 11

6.1. Base Unit Display 11

7 SETTINGS 12

7.1. Connections 12

7.2. Connecting an Optional Headset 13

7.3. Time and Day 13

7.4. Dialing Mode 14

7.5. Voice Enhancer Technology 14

7.6. Ringer Tone 14

8 OPERATION 15

8.1. Answering System 15

8.2. For Call Waiting Service Users 17

8.3. FLASH Button 18

8.4. Remote Operation from a Touch Tone Phone 18

9 TROUBLESHOOTING 22

10 DISASSEMBLY INSTRUCTIONS 25

10.1. Base Unit 25

10.2. Handset 26

11 TROUBLESHOOTING GUIDE 27

11.1. Check Power 28

11.2. Error Message Table 28

11.3. Check Record 29

11.4. Check Playback 30

11.5. Check Battery Charge 30

11.6. Check Link 31

11.7. Check the RF Part 32

11.8. Check Handset Transmission 36

11.9. Check Handset Reception 36

12 TEST MODE 37

12.1. Test Mode Flow Chart for Base Unit 37

12.2. Test Mode Flow Chart for Handset 40

12.3. X801 (Base Unit), X201 (Handset) Check 44

12.4. Adjust Battery Low Detector Voltage (Handset) 44

12.5. Base Unit Reference Drawing 45

12.6. Handset Reference Drawing 47

12.7. Frequency Table 48

12.8. How to Clear User Setting 49

13 DESCRIPTION 50

13.1. Frequency 50

13.2. FHSS (Frequency Hopping Spread Spectrum) 50

13.3. Signal Flowchart in the Whole System 52

14 EXPLANATION OF LINK DATA COMMUNICATION 53

14.1. Calling 53

14.2. To Terminate Communication 53

14.3. Ringing 53

15 BLOCK DIAGRAM (Base Unit) 54

16 CIRCUIT OPERATION (Base Unit) 55

16.1. DSP (Digital Speech/Signal Processing: IC501) 55

16.2. Flash Memory (IC701) 56

16.3. Power Supply Circuit 56

16.4. Reset Circuit 58

16.5. Locator Mode 59

16.6. Telephone Line Interface 59

16.7. Auto Disconnect Circuit 60

16.8. Parallel Connection Detect Circuit 61

17 BLOCK DIAGRAM (Handset) 62

18 CIRCUIT OPERATION (Handset) 63

18.1. Construction 63

18.2. Power Supply Circuit 64

18.3. Charge Circuit 65

18.4. Ringer and Handset SP-Phone 65

Note:

Because CONTENTS 4 to 9 are the extracts from the Operating Instructions of this model, they are subject to change without

notice. Please refer to the original Operating Instructions for further information.

CONTENTS

Page Page

KX-TG2323AGB / KX-TGA231AGB

18.5. Sending Signal 66

18.6. Reception Signal 66

19 SIGNAL ROUTE 67

20 CPU DATA (Base Unit) 68

20.1. IC501 68

21 CPU DATA (Handset) 69

21.1. IC201 69

22 EXPLANATION OF IC TERMINALS (RF Unit) 70

22.1. IC901 70

23 HOW TO REPLACE A FLAT PACKAGE IC 71

23.1. Preparation 71

23.2. Procedure 71

23.3. Removing Solder from Between Pins 71

24 CABINET AND ELECTRICAL PARTS (Base Unit) 72

25 CABINET AND ELECTRICAL PARTS (Handset) 73

26 ACCESSORIES AND PACKING MATERIALS 74

27 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES

27.1. Base Unit 75

27.2. Handset 75

28 REPLACEMENT PARTS LIST 76

28.1. Base Unit 76

28.2. Handset 78

28.3. Accessories and Packing Materials 80

29 FOR SCHEMATIC DIAGRAM 81

29.1. Base Unit (SCHEMATIC DIAGRAM (Base Unit)) 81

29.2. Handset (SCHEMATIC DIAGRAM (Handset)) 81

30 SCHEMATIC DIAGRAM (Base Unit) 82

30.1. Main 82

30.2. Operation 84

31 SCHEMATIC DIAGRAM (Handset) 86

32 SCHEMATIC DIAGRAM (RF PART) 88

33 CIRCUIT BOARD (BASE UNIT) 89

33.1. Main 89

33.2. Operation 91

34 CIRCUIT BOARD (HANDSET) 93

34.1. Component View 93

34.2. Flow Solder Side View 94

KX-TG2323AGB / KX-TGA231AGB

1 ABOUT LEAD FREE SOLDER (PbF: Pb free)

Note:

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that

contains lead.

We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),

Silver (Ag), and Copper (Cu).

This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair

work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.

Caution

•

• •

• PbF solder has a melting point that is 50°F ~70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with

temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please

be careful not to heat too long.

•

• •

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).

•

• •

• If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible

and be sure that any remaining is melted prior to applying the Pb solder.

•

• •

• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the

opposite side (See the figure below).

1.1. Suggested PbF Solder

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper

(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the

manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other

materials.

The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.

KX-TG2323AGB / KX-TGA231AGB

1.2. How to Recognize that Pb Free Solder is Used

(Example: Handset P.C.B.)

IC901

IC201

IC202

Marked

PbF

(Component View)

Note:

The location of the “PbF”mark is subject to change without notice.

KX-TG2323AGB / KX-TGA231AGB

2 FOR SERVICE TECHNICIANS

ICs and LSIs are vulnerable to static electricity.

When repairing, the following precautions will help prevent recurring malfunctions.

1.Cover plastic parts boxes with aluminum foil.

2.Ground the soldering irons.

3.Use a conductive mat on worktable.

4.Do not grasp IC or LSI pins with bare fingers.

3 CAUTION

Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the

manufacturer.

Dispose of used batteries according to the manufacturer´s Instructions.

KX-TG2323AGB / KX-TGA231AGB

4 BATTERY

4.1. Battery Charge

4.2. Battery Recharge

4.3. Battery Information

KX-TG2323AGB / KX-TGA231AGB

4.4. Battery Replacement

KX-TG2323AGB / KX-TGA231AGB

5 LOCATION OF CONTROLS

5.1. Base Unit

KX-TG2323AGB / KX-TGA231AGB

5.2. Handset

KX-TG2323AGB / KX-TGA231AGB

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