Panasonic KX-TDA0155CE Manual de usuario

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of law.

ORDER NO. KMS1005777CE

2-Channel Cell Station Unit for DECT Portable Station

KX-TDA0155CE

(for Europe, Asia Oceania,

Middle Near East, Russia and Africa)

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KX-TDA0155CE

TABLE OF CONTENTS

PAGE PAGE

1 Safety Precautions -----------------------------------------------3

1.1. For Service Technicians ----------------------------------3

1.2. Caution--------------------------------------------------------3

2Warning--------------------------------------------------------------3

2.1. About Lead Free Solder (PbF: Pb free) --------------3

2.2. Discarding of P. C. Board --------------------------------4

3 Specifications ------------------------------------------------------4

4 Technical Descriptions------------------------------------------5

4.1. Block Diagram ----------------------------------------------5

4.2. Hardware Description -------------------------------------6

5 Installation Instructions-----------------------------------------9

5.1. Connecting the Cell Station to the Hybrid IP-

PBX ------------------------------------------------------------9

5.2. Connectiong the CS ------------------------------------- 11

6 Test Mode---------------------------------------------------------- 12

6.1. Required Equipment------------------------------------- 12

6.2. Initial Setting----------------------------------------------- 12

6.3. Command Reference ----------------------------------- 13

7 Troubleshooting Guide---------------------------------------- 19

7.1. Portable Station (PS) Cannot Register to Cell

Station (CS) or PS Does not Link CS. -------------- 19

8 Disassembly and Assembly Instructions --------------- 21

8.1. Disassembly Instructions------------------------------- 21

9 Measurements and Adjustments -------------------------- 22

9.1. Version Check and CSID Writing--------------------- 22

9.2. Adjustment for Main Part------------------------------- 24

9.3. Measurement and Adjustment for RF Part -------- 26

10 Miscellaneous ---------------------------------------------------- 30

10.1. Terminal guide of ICs, Transistors and Diodes --- 30

10.2. How ToReplace aFlat Package IC -----------------31

10.3. How to Replace the LLP (Leadless Leadframe

Package) IC and IC ground plate----------------32

11 Schematic Diagram--------------------------------------------- 34

11.1. Main Board------------------------------------------------- 34

11.2. Waveform -------------------------------------------------- 38

12 Printed Circuit Board ------------------------------------------ 40

12.1. Component View ----------------------------------------- 40

12.2. Bottom View ----------------------------------------------- 41

13 Appendix Information of Schematic Diagram --------- 42

14 Exploded View and Replacement Parts List ----------- 43

14.1. IC Data------------------------------------------------------ 43

14.2. Cabinet and Electrical Parts Location--------------- 50

14.3. Accessories and Packing Material------------------- 51

14.4. Replacement Parts List--------------------------------- 52

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KX-TDA0155CE

1 Safety Precautions

1.1. For Service Technicians

•Repair service shall be provided in accordance with repair technology information such as service manual so as to pre-

vent fires, injury or electric shock, which can be caused by improper repair work.

1. When repair services are provided, neither the products nor their parts or members shall be remodeled.

2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.

3. FASTON terminals shall be plugged straight in and unplugged straight out.

•ICs and LSIs are vulnerable to static electricity.

When repairing, the following precautions will help prevent recurring malfunctions.

1. Cover plastic parts boxes with aluminum foil.

2. Ground the soldering irons.

3. Use a conductive mat on worktable.

4. Do not grasp IC or LSI pins with bare fingers.

1.2. Caution

When you note the serial number, write down all of the 11 digits.

The serial number may be found on the label affixed to the bottom of the unit.

2Warning

2.1. About Lead Free Solder (PbF: Pb free)

Note:

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-

tains lead.

We will use PbF when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn), Silver,

(Ag), and Copper, (Cu).

This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair

work we suggest using the same type of solder.

Caution

• PbF solder has a melting point that is 50°~ 70°F, ( 30°~ 40°C) higher than Pb solder. Please use a soldering iron with tempera-

ture control and adjust it to 700°± 20°F, ( 370 °± 10°C).

Exercise care while using higher temperature soldering irons.:

Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F, (60 0°C).

• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the

opposite side (See figure, below).

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2.1.1. Suggested PbF Solder

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,

(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac

turer's specific instructions for the melting points of their products and any precautions for using their product with other

materials.

The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.

2.2. Discarding of P. C. Board

When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.

3 Specifications

Item Description

Radio Access Method Multi Carrier TDMA-TDD

Frequency Band 1880 MHz to 1900 MHz*1(*1The number may vary depending on the country /area . In Taiwan,

it is 1880 MHz to 1895 MHz.)

Number of Carriers 10*2 (*2 The number may vary depending on the country /area . In Taiwan, it is 8.)

Carrier Spacing 1728 kHz

Bit Rate 1152 kbps

Carrier Multiplex TDMA, 24 (Tx12, Rx12) slots per frame

Frame Length 10 ms

Modulation Scheme GFSK

Roll-off factor=0.5 50% roll-off in the transmitter

Max Number of PS Conversations 2 pieces

Data Coding for Modulator Differential Coding

Voice CODEC 64 kbps PCM (CCITT G.721)

Transmission Output Peak 250 mW

Operating conditions 0-40°C (32°F-104°F), 20-80% relative air humidity (not condensing)

Operation range Up to 300 m outdoors, Up to 50 m indoors

Dimension Cell Station 164 (L) mm ×133 (W) mm ×40 (D) mm

Weight about 260 g

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4 Technical Descriptions

4.1. Block Diagram

4.1.1. Main Board

KX-TDA0155CE

5.25V

to DLC

Card

T101

Transformer

IC100(Base Band IC/CPU)

Burst Mode

Controller

RF Interface

RF PCM

Echo

Canceller

CPU

GPIO

IC101

Flash ROM

IC102

SRAM

Line i/f

DIPSW

LED

X101

16.384MHz

X100

10.368MHz

to DLC

Card

IC203

DC/DC

IC105

Reset IC

Regulators1.8V

3.2V

1.5V

PAV3.3V

RF2R5V

232C i/f

C339

C340

C341

IC103/FPGA

SYNC GEN

Framer/Deframer

Decoder

IC104/GA

DPT i/f

PCM

I/F

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4.2. Hardware Description

4.2.1. Hardware Description

4.2.1.1. Function Description

KX-TDA0155CE is the Cell Station (CS) for TDA and TDE and NCP series. CS converts voice data from PBX to radio signal and

transmits to Portable Station (PS). Conversely CS converts radio signal from PS to voice data and transmits to PBX.

4.2.1.2. CPU Circuit

The IC100(SC14429) is CPU with BBIC and DSP and is manufactured by Sitel. This CPU has 16 bits data bus and processes

control command from PBX and PS.

Application software is stored in 32Mbit Flash Memory (IC101). This Flash Memory is so called Dual Operation type Flash. It is

possible to write data onto this Flash Memory in active status so that this Flash Memory is used as EEPROM. The FLASH mem-

ory of this Dual Operation type is effective in preventing fatal destruction when remote uploading is failed. If the power failure

occurs during program uploading, the FLASH memory data is lost. However, this type of memory is recoverable.

Furthermore calibration data for RSSI measurement and clock is stored in the Flash Memory, too.

2Mbit SRAM(IC102) is used as the work area. CN101 is the communication port for service purpose. CN101 is connected to the

serial port of the CPU.

SW100 is 6bits DIP switch to set the operating modes of CS, site survey mode, program upload mode and so on.

4.2.1.3. Line Interface

This circuit handles data communication to extension port. CS is connected to extension port by 2 wires.

The power voltage of CS is DC 40V supplied from extension port by 2 wires. The signal for data transmission is transferred via

outside wires. Voice data, control data and superframe synchronisation signal for CS synchronisation is carried on this signal.

The signal from extension port is provided to CN100, and provided to DPITS I/F GA (IC104) via filter and pulse transformer

(T101).

The data received from PBX is inputted to the comparator (pin 36) build in IC104 through Transformer T101.

The threshold voltage of the comparator is determined by R238, R239 and R240, then inputted to pin 35 and 37.

The data to PBX is outputted from pin 38 and 39 of IC104, drives T101 by Transistor Q200 and transmitted.

The signal between DPITS I/F GA (IC104) and FPGA (IC103) is ST-BUS Format digital data which contains data channel, con-

trol and voice channel.

Voice channel contains 2 PCM data. And superframe synchronisation signal is carried by HK bit of control channel.

2 PCM data and superframe synchronisation signal is transferred to FPGA (IC103).

Note:

The GND of CS(KX-TDA0155CE) is not common to the GND of the PBX itself, so care must be taken when using a measuring

device such as an oscilloscope.(Make sure to use the measuring device with its frame ground open.)

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4.2.1.4. FPGA

FPGA (IC103) has the following features.

(1) ST-BUS I/F, BBIC PCM I/F

Extracts voice data from ST-BUS digital data and changes format to BBIC PCM format, then provides it to BBIC(IC100).

(2) Superframe detection, delay compensation

Detects super frame synchronisation signal from HK bit in the ST-BUS digital data and compensates time difference of delay

caused by the different cable length from CSIF card, then provides it to PSYNC pin of BBIC(IC100).

(3) Address decoder, internal registers

Address decoder to generate chip select signal for other ICs and internal registers to set FPGA operation.

4.2.1.5. RF Interface Circuit

Data signals for RF control and RX/TX data is connected between BBIC and RF block.

The modulated signal is provided to 2 antennas via CN901 and CN900.

4.2.1.5.1. BBIC

SC14429 manufactured by Sitel.

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4.2.1.6. Power Supply Circuit

PAV3.3V, RF2.5V, 3.2V, 1.8V, RF1.8V, 1.5V and 5.25V are generated in CS.

5.5V is output of DC/DC Convertor. Other power supplies are made from 5.25V.

PAV3.3V and RF2.5V are the power supply for RF block. 3.2V is the power supply for logic circuit.

1.5V is used as the power supply of FPGA internal core. 1.8V, RF1.8V is the power supply for BBIC.

4.2.1.6.1. Input Filter, Diode Bridge

Input filter for noise rejection and diode bridge for misconnection protection.

4.2.1.6.2. DC/DC Start Up Control Circuit

This circuit controls the DC/DC converter for prompt return from the power interruption start-up.

And when the power supply is low voltage, This circuit controls ON/OFF of the DC/DC converter by DIPSW(SW100)

4.2.1.6.3. DC/DC Converter Circuit

Generate 5.25V from DC40V power supply.

4.2.1.6.4. Power Back Up Circuit

All power supply is backed up by the electric double layer capacitor.

4.2.1.7. Clock Circuit

Two kinds of clock are used in CS.

4.2.1.7.1. BBIC Clock

10.368MHz crystal oscillator is used.

4.2.1.7.2. DPITS I/F GA Clock

16.384MHz crystal oscillator is used. It is used for Reference Clock of DPITS I/F GA.

4.2.1.8. Reset Circuit

It is reset by the signal from Power on Reset or CPU. The reset from Reset IC(IC105) is reset by CPU, and DPITS I/F GA and

FPGA are reset by the port output from CPU.

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KX-TDA0155CE

5 Installation Instructions

5.1. Connecting the Cell Station to the Hybrid IP-PBX

KX-TDA0155 connecting to KX-TDA100/KX-TDA200/KX-TDA600/KX-TDE100/KX-TDE200/KX-TDE600

Note

The illustration of the PBX is based on the KX-TDE200.

Accessories and User-supplied Items for the CS

Accessories (included): Screws x 2, Washers x 2

User-supplied (not included): RJ11 connector

Note

For details about the DHLC/DLC card, refer to the Installation Manual for your PBX.

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KX-TDA0155CE

KX-TDA0155 connecting to KX-NCP500/KX-NCP1000

Note

The illustration of the PBX is based on the KX-NCP500.

Accessories and User-supplied Items for the CS

Accessories (included): Screws x 2, Washers x 2

User-supplied (not included): RJ11 connector

Note

For details about the DHLC/DLC card, refer to the Installation Manual for your PBX.

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