NXP Semiconductors LPC29 Series Manual de usuario

UM10316

LPC29xx User manual

Rev. 3 — 19 October 2010 User manual

Document information

Info Content

Keywords LPC2917/01; LPC2919/01; LPC2926; LPC2927; LPC2929; LPC2921;

LPC2923; LPC2925; LPC2930; LPC2939 User Manual, ARM9, CAN, LIN,

USB

Abstract This document extends the LPC29xx data sheets with additional details to

support both hardware and software development. It focuses on functional

description and typical application use.

User manual Rev. 3 — 19 October 2010 2 of 840

Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: [email protected]

NXP Semiconductors UM10316

LPC29xx User manual

Revision history

Rev Date Description

3 20101019

Modifications: •Editorial updates to CGU, PMU, VIC, USB OTG, and Flash/EEPROM chapters.

•Table 103 “LPC2930 boot configuration” added.

•Part LPC2926 added.

•Editorial updates.

•Description of USBCmdCode register updated.

•Description of CMD bit in Set Device Status register updated.

2 20091116

Modifications: •LIN chapter updated with description and register map of the UART mode.

•Corrected description of NMMEN bit (bit 0) in the RS485CTRL register: 0 = RS-485 mode disabled.

1 = RS-485 mode enabled. Default value: 0.

•LPC2930/39 pin configuration table: pin 29 description corrected; P1[31] changed to P1[30].

•LPC2930/39 pin configuration table: USB_OVRCR1 function added to pin 31.

•Connection of ADC inputs to ADC channels corrected.

•UART function updated: The fractional divider can not be used in auto-baud mode.

•Editorial updates.

1 20090522 Initial LPC29xx user manual edition

User manual Rev. 3 — 19 October 2010 3 of 566

1. Introduction

The LPC29xx combine an 125 MHz ARM968E-S CPU core, Full Speed USB 2.0 OTG

and device, CAN and LIN, up to 56 kB SRAM, up to 768 kB flash memory, external

memory interface, two or three 10-bit ADCs, and multiple serial and parallel interfaces in a

single chip targeted at consumer, industrial, medical, and communication. To optimize

system power consumption, the LPC29xx has a very flexible Clock Generation Unit

(CGU) that provides dynamic clock gating and scaling.

2. About this user manual

This document describes the following parts: LPC2917/01, LPC2919/01, LPC2921,

LPC2923, LPC2925, LPC2926, LPC2927, LPC2929, LPC2930, and LPC2939.

Differences between the various parts as they apply to each block or peripheral are listed

at the beginning of each chapter. For an overview of features see Table 1–2.

3. General features

Remark: See Table 1–2 for feature details for each LPC29xx part.

•ARM968E-S processor running at frequencies of up to 125 MHz maximum.

•Multi-layer AHB system bus at 125 MHz with four separate layers.

•On-chip memory:

–Two Tightly Coupled Memories (TCM), up to 32 kB Instruction (ITCM), up to 32 kB

Data TCM (DTCM).

–Two separate internal Static RAM (SRAM) instances; 32 kB SRAM and 16 kB

SRAM.

–8 kB ETB SRAM.

–Up to 768 kB flash-program memory with 16 kB EEPROM.

•Dual-master, eight-channel GPDMA controlleron the AHB multilayer matrix which can

be used with the SPI interfaces and the UARTs, as well as for memory-to-memory

transfers including the TCM memories.

•External Static Memory Controller (SMC) with eight memory banks; up to 32-bit data

bus; up to 24-bit address bus.

•Serial interfaces:

–USB 2.0 full-speed device/OTG controller with dedicated DMA controller and

on-chip PHY for device and Host (LPC2930/39 only) functions.

–Two-channel CAN controller supporting Full-CAN and extensive message filtering

–Two LIN master controllers with full hardware support for LIN communication.

–Two 550 UARTs with 16-byte Tx and Rx FIFO depths, DMA support, and RS485

support.

UM10316

Chapter 1: LPC29xx Introductory information

Rev. 3 — 19 October 2010 User manual

User manual Rev. 3 — 19 October 2010 4 of 566

NXP Semiconductors UM10316

Chapter 1: LPC29xx Introductory information

–Three full-duplex Q-SPIs with four slave-select lines; 16 bits wide; 8 locations

deep; Tx FIFO and Rx FIFO.

–Two I2C-bus interfaces.

•Other peripherals:

–Up to three ADCs: Two 10-bit ADCs, 8-channels each, with 3.3 V measurement

range and one, 8-channel 10-bit ADC with 5.0 V measurement range provide a

total of up to 24 analog inputs, with conversion times as low as 2.44 μs per

channel. Each channel provides a compare function to minimize interrupts.

–Multiple trigger-start option for all ADCs: timer, PWM, other ADC and external

signal input.

–Four 32-bit timers each containing four capture-and-compare registers linked to

I/Os.

–Four six-channel PWMs (Pulse-Width Modulators) with capture and trap

functionality.

–Two dedicated 32-bit timers to schedule and synchronize PWM and ADC.

–Quadrature encoder interface that can monitor one external quadrature encoder.

–32-bit watchdog with timer change protection, running on safe clock.

•Up to 108 general-purpose I/O pins with programmable pull-up, pull-down, or bus

keeper.

•Vectored Interrupt Controller (VIC) with 16 priority levels.

•Up to 24 level-sensitive external interrupt pins, including CAN and LIN wake-up

features.

•Configurable clock-out pin for driving external system clocks.

•Processor wake-up from power-down via external interrupt pins; CAN or LIN activity.

•Flexible Reset Generator Unit (RGU) able to control resets of individual modules.

•Flexible Clock-Generation Unit (CGU) able to control clock frequency of individual

modules:

–On-chip very low-power ring oscillator; fixed frequency of 0.4 MHz; always on to

provide a Safe_Clock source for system monitoring.

–On-chip crystal oscillator with a recommended operating range from 10 MHz to

25 MHz - max. PLL input 25 MHz.

–On-chip PLL allows CPU operation up to a maximum CPU rate of 125 MHz.

–Generation of up to 11 base clocks.

–Seven fractional dividers.

•Highly configurable system Power Management Unit (PMU):

clock control of individual modules.

allows minimization of system operating power consumption in any configuration.

•Standard ARM test and debug interface with real-time in-circuit emulator.

•Boundary-scan test supported.

•ETM/ETB debug functions with 8 kB of dedicated SRAM also accessible for

application code and data storage.

•Dual power supply:

User manual Rev. 3 — 19 October 2010 5 of 566

NXP Semiconductors UM10316

Chapter 1: LPC29xx Introductory information

–CPU operating voltage: 1.8 V ±5%.

–I/O operating voltage: 2.7 V to 3.6 V; inputs tolerant up to 5.5 V.

•Available in 100-pin,144-pin, and 208-pin LQFP packages.

•−40 °C to 85 °C ambient operating temperature range.

4. Ordering information

Table 1. Ordering information

Type number Package

Name Description Version

LPC2917FBD144/01 LQFP144 plastic low profile quad flat package; 144 leads; body 20 ×20 ×1.4 mm SOT486-1

LPC2919FBD144/01 LQFP144 plastic low profile quad flat package; 144 leads; body 20 ×20 ×1.4 mm SOT486-1

LPC2921FBD100 LQFP100 plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm SOT407-1

LPC2923FBD100 LQFP100 plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm SOT407-1

LPC2925FBD100 LQFP100 plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm SOT407-1

LPC2926FBD144 LQFP144 plastic low profile quad flat package; 144 leads; body 20 ×20 ×1.4 mm SOT486-1

LPC2927FBD144 LQFP144 plastic low profile quad flat package; 144 leads; body 20 ×20 ×1.4 mm SOT486-1

LPC2929FBD144 LQFP144 plastic low profile quad flat package; 144 leads; body 20 ×20 ×1.4 mm SOT486-1

LPC2930FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 x 28 x 1.4 mm SOT459-1

LPC2939FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 x 28 x 1.4 mm SOT459-1

xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx

xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x

xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx

xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx

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NXP Semiconductors UM10316

Chapter 1: LPC29xx Introductory information

4.1 Ordering options

Remark: Note that parts LPC2927 and LPC2929 are not fully pin compatible with parts LPC2917/01 and LPC2919/01 or

LPC2917 and LPC2919. On the LPC2927/29 the MSCSS and timer blocks have a reduced pinout.

4.2 Comparison with LPC2917/19 devices

Table 2. LPC29xx part overview

Part

number Flash SRAM

(incl

ETB)

TCM

(I/D) CAN LIN/

UART Pins UART

RS485 SPI 3V3

ADC 5 V

ADC SMC USB

device USB

host USB

OTG ETM QEI I2C-bus Clkout

LPC2939 768 kB 56 kB 32/32 kB 2 2 208 2 3 2 Yes Yes Yes Yes Yes Yes Yes Yes Yes

LPC2930 - 56 kB 32/32 kB 2 2 208 2 3 2 Yes Yes Yes Yes Yes Yes Yes Yes Yes

LPC2929 768 kB 56 kB 32/32 kB 2 2 144 2 3 2 Yes Yes Yes No Yes Yes Yes Yes Yes

LPC2927 512 kB 56 kB 32/32 kB 2 2 144 2 3 2 Yes Yes Yes No Yes Yes Yes Yes Yes

LPC2926 256 kB 56 kB 32/32 kB 2 2 144 2 3 2 Yes Yes Yes No Yes Yes Yes Yes Yes

LPC2925 512 kB 40 kB 16/16 kB 2 2 100 2 3 2 No No Yes No No Yes Yes Yes Yes

LPC2923 256 kB 24 kB 16/16 kB 2 2 100 2 3 2 No No Yes No No Yes Yes Yes Yes

LPC2921 128 kB 24 kB 16/16 kB 2 2 100 2 3 2 No No Yes No No Yes Yes Yes Yes

LPC2919/01 768 kB 56 kB 16/16 kB 2 2 144 2 3 2 No Yes No No No Yes Yes Yes Yes

LPC2917/01 512 kB 56 kB 16/16 kB 2 2 144 2 3 2 No Yes No No No Yes Yes Yes Yes

Table 3. Feature comparison

Parts GPDMA UART

RS485

mode

I2C QEI CAN LIN USB

OTG/

device

Flash EEPROM SRAM

total ETB

SRAM 5V

ADC

LPC2917/19 no no no no 2 2 no 512/768 kB no 80 kB no no

LPC2917/19/01 yes yes yes yes 2 2 no 512/768 kB yes 88 kB 8 kB no

LPC2927/29 yes yes yes yes 2 2 yes 512/768 kB yes 120 kB 8 kB yes

User manual Rev. 3 — 19 October 2010 7 of 566

NXP Semiconductors UM10316

Chapter 1: LPC29xx Introductory information

4.3 LPC29xx USB options

Table 4. LPC29xx USB options

Part On-chip controller Ports On-chip PHY

Device Host OTG

LPC2917/01 - - - - -

LPC2919/01 - - - - -

LPC2921 Full-speed - - 1 Device

LPC2923 Full-speed - - 1 Device

LPC2925 Full-speed - - 1 Device

LPC2926 Full-speed - Full-speed 1 Device

LPC2927 Full-speed - Full-speed 1 Device

LPC2929 Full-speed - Full-speed 1 Device

LPC2930 Full-speed Full-speed Full-speed 2 Device, host

LPC2939 Full-speed Full-speed Full-speed 2 Device, host

User manual Rev. 3 — 19 October 2010 8 of 566

NXP Semiconductors UM10316

Chapter 1: LPC29xx Introductory information

5. Block diagram

Grey-shaded blocks represent peripherals with connections to the GPDMA.

Fig 1. LPC2917/19/01 block diagram

002aad959

ARM968E-S

DTCM

16 kB

ITCM

16 kB

TEST/DEBUG

INTERFACE

slave

EXTERNAL STATIC

MEMORY CONTROLLER

GPDMA CONTROLLER

GPDMA REGISTERS

EMBEDDED FLASH

512/768 kB 16 kB

EEPROM

EMBEDDED SRAM 32 kB

SYSTEM CONTROL

TIMER0/1 MTMR

CAN0/1

GLOBAL

ACCEPTANCE

FILTER

LIN0/1

PWM0/1/2/3

3.3 V ADC1/2 EVENT ROUTER

EMBEDDED SRAM 16 kB

GENERAL PURPOSE I/O

PORTS 0/1/2/3

TIMER 0/1/2/3

SPI0/1/2

RS485 UART0/1

WDT

master

slave

AHB TO APB

BRIDGE

AHB TO DTL

BRIDGE

VECTORED

INTERRUPT

CONTROLLER

AHB TO DTL

BRIDGE

AHB TO APB

BRIDGE

QUADRATURE

ENCODER

CHIP FEATURE ID

AHB TO APB

BRIDGE

I2C0/1

AHB TO APB

BRIDGE

CLOCK

GENERATION

UNIT CGU0/1

POWER

MANAGEMENT

UNIT

RESET

GENERATION

UNIT

LPC2917/01

LPC2919/01

JTAG

interface

8 kB SRAM

slave

1 ×master

2 × slave

AHB

MULTI

LAYER

MATRIX

User manual Rev. 3 — 19 October 2010 9 of 566

NXP Semiconductors UM10316

Chapter 1: LPC29xx Introductory information

Grey-shaded blocks represent peripherals with connections to the GPDMA.

Fig 2. LPC2921/23/25 block diagram

EMBEDDED FLASH

512/256/128 kB

002aae224

ARM968E-S

DTCM

16 kB

ITCM

16 kB

TEST/DEBUG

INTERFACE

slave

master

1 master

2 slaves

master GPDMA CONTROLLER

GPDMA REGISTERS

16 kB

EEPROM

EMBEDDED SRAM 16 kB

(LPC2925 only)

SYSTEM CONTROL

TIMER0/1 MTMR

CAN0/1

GLOBAL

ACCEPTANCE

FILTER

PWM0/1/2/3

3.3 V ADC1/2 EVENT ROUTER

EMBEDDED SRAM 16 kB

GENERAL PURPOSE I/O

PORTS 0/1/5

TIMER 0/1/2/3

SPI0/1/2

RS-485 UART0/1

WDT

AHB TO APB

BRIDGE

AHB TO DTL

BRIDGE

VECTORED

INTERRUPT

CONTROLLER master

slave USB DEVICE

CONTROLLER

slave

AHB TO DTL

BRIDGE

AHB TO APB

BRIDGE

QUADRATURE

ENCODER

CHIP FEATURE ID

AHB TO APB

BRIDGE

I2C0/1

UART/LIN0/1

AHB TO APB

BRIDGE

AHB

MULTI-

LAYER

MATRIX

LPC2921/2923/2925

JTAG

interface

8 kB SRAM

general subsystem

power, clock, and

reset subsystem

MSC subsystem

networking subsystem

peripheral subsystem

CLOCK

GENERATION

UNIT

POWER

MANAGEMENT

UNIT

RESET

GENERATION

UNIT

User manual Rev. 3 — 19 October 2010 10 of 566

NXP Semiconductors UM10316

Chapter 1: LPC29xx Introductory information

Grey-shaded blocks represent peripherals with connections to the GPDMA.

Fig 3. LPC2926/27/29 block diagram

002aae143

ARM968E-S

DTCM

32 kB

ITCM

32 kB

TEST/DEBUG

INTERFACE

slave

master

1 master

2 slaves

master

EXTERNAL STATIC

MEMORY CONTROLLER

GPDMA CONTROLLER

GPDMA REGISTERS

EMBEDDED FLASH

512/768 kB 16 kB

EEPROM

EMBEDDED SRAM 32 kB

SYSTEM CONTROL

TIMER0/1 MTMR

CAN0/1

GLOBAL

ACCEPTANCE

FILTER

UART/LIN0/1

PWM0/1/2/3

3.3 V ADC1/2 EVENT ROUTER

EMBEDDED SRAM 16 kB

GENERAL PURPOSE I/O

PORTS 0/1/2/3/5

TIMER 0/1/2/3

SPI0/1/2

RS485 UART0/1

WDT

AHB TO APB

BRIDGE

AHB TO DTL

BRIDGE

VECTORED

INTERRUPT

CONTROLLER master

slave USB OTG/DEVICE

CONTROLLER

slave

AHB TO DTL

BRIDGE

AHB TO APB

BRIDGE

5 V ADC0

QUADRATURE

ENCODER

CHIP FEATURE ID

AHB TO APB

BRIDGE

I2C0/1

AHB TO APB

BRIDGE

CLOCK

GENERATION

UNIT

POWER

MANAGEMENT

UNIT

RESET

GENERATION

UNIT

AHB

MULTI-

LAYER

MATRIX

LPC2926/27/2929

JTAG

interface

8 kB SRAM

general subsystem

power. clock, and

reset subsystem

MSC subsystem

networking subsystem

peripheral subsystem

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