Lepa AquaChanger 240 Manual de usuario
AquaChanger 240
AMD RYZEN
READY!
AM4
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CONTENT
Limited Warranty
Specification
Part list
Intel Installation
AMD Installation
AquaChanger 240
Please read this limited warranty carefully. Warranty is subject to void under following
criteria:
1. The serial number label or warranty seal is defaced, modified, or removed.
2. Taking apart of the product and/or modificaon of any component or cable without
LEPA’s wrien authorizaon.
3. Ignoring connector’s faulty-inseron-prevenon design by aaching a connector to a
device under incorrect orientaon.
4. Damage caused by natural phenomena or uncontrollable forces, such as lightning,
flooding, fire, earthquake, or misuse, abuse, negligence, accident, wear and tear,
mishandling, misapplicaon.
This LEPA Technology Corporaon product is warranted to be free from defects in material and
workmanship for a period of two (2) years from the date of purchase. LEPA Technology
Corporaon agrees to repair or replace the product, at its own opon and at no charge, if,
during the warranty period, it is returned to nearest LEPA Technology Corporaon
subsidiary/agent with all shipping charges prepaid and if inspecon reveals that the product is
defecve. Please present the proof of purchase for requesng RMA. Charges for removing or
installing the product are excluded under the terms of this warranty agreement. This warranty
shall not apply to any product, which has been subject to connecon to a faulty power source,
alteraon, negligence, or accident, or to any product, which has been installed other than in
accordance with these instrucons. In no event shall LEPA Technology Corporaon, or its
subsidiaries, or agents be liable for damages for a breach of warranty in an amount exceeding
the purchase price of this product.
If you are uncertain whether or not your LEPA liquid cooler is defecve, please contact your
dealer/reseller for support!
Web Site: hp://www.lepatek.com
E-mail: sales@lepatek.com
LEPA Technology Corporaon
13F-15, No 888, Jin-Guo Rd., Taoyuan City(330), Taiwan.
Tel.+886-3-3580584 FAX. +886-3-3580694
©2018 LEPA Technology Corporaon. All rights reserved. Specificaons are subject to change
without prior noce. Actual product and accessories may differ from illustraons. Omissions
and prinng errors excepted. Content of delivery might differ in different countries or areas.
Some trademarks may be claimed as the property of others. Reproducon in any manner
without the wrien permission of LEPA is strictly forbidden.
Limited Warranty
Limited Warranty
1
Weight (w/o fan)
Material
Bearing
MTBF
Motor Speed
Rated Voltage
Rated Current
Dimension
Material
Material
Length
Dimension
Speed
Rated Voltage
Rated Current
Air Flow
Stac Pressure
Noise Level
Connector
Compability
Intel® LGA 775/1150/1151/1155/1156/1366/2011/2011-3/2066
AMD® AM2/AM2+/AM3/AM3+/AM4/FM1/FM2/FM2+
120 x 120 x 25 mm
500 ~ 2300 rpm ±10%
12V
0.38 A
22.5 ~ 103.6 CFM
38.2 ~ 176.0 m3/h
0.2 ~4.5 mm- H2O
14 ~35 dBA
4 pin PWM
2 years
Copper
Ceramic Bearing
50,000 hrs
2700rpm ±10%
12V
0.3A
274 x 120 x 27 mm
Aluminum
Rubber
300 mm
730 g
Pump
Cold Plate
Radiator
Tube
Warranty
Bracket
Fan
Model LPWAC240-HF
Specification
Specification 2
*Some MB put the capacitors around the boarder of CPU bracket, please carefully install the
cooler on can avoid the mechanical interference.
A Cooler x 1 B Fan x 2
C Back Plate x 1 D Posion Screw × 4
F Stand-off × 4 G Case Screw × 8 H Fan Screw × 8
E Insulang pad x 1
Part list
Part list
3
I Intel LGA 2011/2066
Screw x 4
J Spring Screw × 4 K Washer x 4
L Intel Bracket × 2 N Bracket Screw × 4
O Thermal Grease × 1 P PWM Y cable x 1
M AMD Bracket × 2
Q Molex Adaptor x 1
4
Part list
Intel Installation
AquaChanger 240
Step 1
Intel
EN
Aach the fan and the radiator to the case.
DE
Befesgen Sie Lüer und Radiator am Gehäuse.
FR
Fixer le venlateur et le radiateur sur le boîer.
ES
Instale el venlador y el radiador en la caja.
IT
Installare la ventola e il radiatore al case.
ID
Pasang fan dan radiator ke dalam casing.
RU
Закрепите вентилятор и радиатор на корпусе.
PL
Zamontuj wentylator i radiator na obudowie
komputerowej.
TW
請安裝風扇與散熱排於機殼上。
CN
请将风扇与水冷排安装在机箱上。
KR
Fan와 radiator를 케이스에 장착 합니다.
JP
FanScrewを使用してファンをラジエーターに設置、CaseScrewを使用してラジエーターをケースに取り
付けます。
H G
Intel Installation
http://www.lepatek.com 6
Intel Installation
7
LGA 775/1150/1151/1155/1156/1366
Step 2
EN
Insert the posion screws into the proper
holes on the back plate. Then use the
washers to fix the posion screws.
《 If your CPU plaorm is Intel
LGA 2011/2066, please skip to step 3-2》
DE
Drehen Sie die Montageschrauben in die
zu Ihrem Sockel passende Bohrung in der
Backplate wie abgebildet an. 《Wenn Sie
einen LGA 2011/2011-3/2066-Sockel
verwenden, gehen Sie bie zu Schri 3-2 über 》
FR
Insérez les vis de posion dans les trous correspondant à votre socket du CPU sur la plaque arrière. Puis fixez-les
avec les rondelles. 《 S’il s’agit d’un processeur Intel LGA 2011/2066, passez à l'étape 3-2 》
ES
Inserte los tornillos de montaje en el agujero correspondiente en la placa trasera como se ve en la imagen abajo.
《 Si su plataforma de CPU es Intel LGA 2011/2066, por favor vaya directamente al paso 3-2》
IT
Inserire le vi di montaggio nel foro appropriato nella piastra posteriore come mostrato nella figura soo.
《 Se la piaaforma CPU è Intel LGA 2011/2066, si prega di passare al punto 3-2 》
ID
Masukkan sekrup ke dalam lubang yang tepat pada back plate. Kemudian gunakan washers/ring untuk
mengencangkan sekrup. 《 Jika Plaorm CPU Anda Intel LGA 2011/2066, lanjutkan ke langkah 3-2 》
RU
Установите винты для крепежной пластины в соответствующие отверстия для вашего процессора.
Установите промежуточные стойки на винты.《 Если ваша CPU платформа является Intel
LGA2011/2011-3/2066, пожалуйста, перейдите к шагу номер 3-2 》
PL
Włóż śruby pozycjonujące do odpowiednich otworów na płycie tylnej. Następnie użyj podkładek w celu
zamocowania śrub pozycjonujących.《Plaormy Intel LGA2011/2066: Proszę przejść do punktu 3-2 》
TW
在背板上依系統CPU腳位所標示的孔位插入定位螺絲並套上墊圈固定。
《如果您的主機板是Intel LGA2011/2066，請直接跳至步驟3-2》
CN
在背板上根据系统CPU脚位所标示的孔位插入定位螺丝并套上垫圈固定。
《如果您的主板是Intel LGA2011/2066，请直接跳至步骤3-2》
KR
브라켓 구멍에 알맞은 나사를 삽입 한 후 와셔를 사용하여 나사를 고정하세요. 《CPU 플랫폼이
Intel LGA2011/2066 인경우,Step3-2로 가세요》
JP
ポジションスクリューをバックプレートの適切なネジ穴に挿入し、ワッシャーを使用してポジションス
クリューを固定して下さい。《IntelLGA2011/2066をお使いの方はステップ3-2に進んでください》
LGA1366
LGA775
LGA 115X
K
C
D
1
2
Intel
EN
Install the back plate on the back of motherboard; place the stand-off
on the motherboard to fix the back plate.
DE
Platzieren Sie die Backplate auf der Rückseite des Mainboards und
schrauben Sie sie mit den Abstandshaltern fest.
FR
Installer la plaque arrière sous la carte-mère; placer le support-vis sur
la carte mère pour fixer la plaque arrière.
ES
Instale la placa trasera en la parte trasera de la placa base y coloque los
separadores en la placa base para fijar la placa.
IT
Installare la piastra posteriore nella parte posteriore della scheda madre
e posizionare i distanziatori sulla scheda madre per fissare la piastra.
ID
Pasang back plate pada bagian belakang motherboard, tempatkan stand off pada motherboard untuk
mengencangkan back plate.
RU
Установите крепёжную пластину к обратной стороне на материнской плате и закрепите винты на
материнской плате.
PL
Umieść płytę mocującą (backplate) pod płytą główną i wkręć za pomocą
nakrętek mocujących.
TW
將背板置入主機板背面；將黑色套桶套入定位螺絲以固定背板。
CN
将背板放置在主板下面，将黑色套筒套入定位螺丝用以固定背板。
JP
PositionScrewを差し込んだBackPlateをマザーボードの裏側から配置、
Stand-offを使用してBackPlateを固定します。
KR
Back plate를 motherboard 뒷면에 설치 한 다음에 절연체를 motherboard에 놓습니다.
Step 3-1 LGA 775/1150/1151/1155/1156/1366
F
C
D
http://www.lepatek.com 8
CD
F
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