JVC KD-G815 Manual de usuario

SERVICEMANUAL

2005/3

CD RECEIVER

MA17020053

KD-G815

TABLEOFCONTENTS

1PRECAUTIONS.. . . . . . .. . .. . . . .. . . . . . . . . .. . .. .. . . . .. . .. . . . .. .. . . . . . . .. . .. .. .. . .. . .. .. . 1-3

2SPECIFICSERVICEINSTRUCTIONS.. . . . .. .. . . . . . . .. . . . .. . .. . . . .. . . . .. . .. .. . . . . . . .. .. . . . . 1-6

3DISASSEMBLY. . . . .. . . . .. . .. .. . . . . . . .. . . . .. . . . .. . . . .. . .. . . . .. . . . .. . . . .. . .. .. . .. . .. .. . 1-7

4ADJUSTMENT. .. . .. . . . .. .. . . . . . . .. . . . .. .. . .. . .. .. . . . .. . . . . . . .. .. . . . .. . .. . . .. . .. .. . . . 1-28

5TROUBLESHOOTING. . .. . .. . . . .. .. . . . . . . .. . . . .. . . . .. . .. . . . . . .. . . . . . . .. . . . . . . .. .. . .. . .1-29

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1-2(No.MA170)

SPECIFICATION

Designandspecifications aresubject tochangewithout notice.

AUDIOAMPLIFIERSECTION

MaximumPower OutputFront50Wperchannel

Rear50Wperchannel

ContinuousPower Output(RMS)Front19 Wperchannelinto4 ,40Hzto20000Hzatnomore

than0.8%total harmonicdistortion.

Rear19Wperchannelinto4 ,40Hzto20000Hzatnomore

than0.8%total harmonicdistortion.

LoadImpedance4 (4 to8 allowance)

Equalizer Control RangeLow±12dB(60Hz, 80Hz, 100Hz, 120Hz)

Mid±12dB

High±12dB(8kHz,10 kHz, 12kHz, 15kHz)

FrequencyResponse40Hzto20000Hz

Signal-to-NoiseRatio70 dB

Line-Out Level/Impedance5.0V/20k load(full scale)

Output Impedance1k

Subwoofer-Out Level/Impedance2.0V/20k load(full scale)

Other terminalsCDchanger, SUBWOOFER

TUNER SECTION

FrequencyRangeFM87.5MHzto108.0MHz

AM531kHzto1602 kHz

FMTunerUsableSensitivity11.3dBf (1.0 kV/75 )

50dBQuietingSensitivity16.3dBf(1.8 kV/75 )

AlternateChannel Selectivity(400kHz)65dB

Frequency Response40Hzto15 000Hz

Stereo Separation35dB

CaptureRatio1.5dB

AMTunerSensitivity20 kV

Selectivity35dB

CDPLAYERSECTION

TypeCompact discplayer

Signal DetectionSystemNon-contact opticalpickup(semiconductorlaser)

Number of Channels2channels(stereo)

FrequencyResponse5Hzto20000 Hz

DynamicRange96dB

Signal-to-NoiseRatio98 dB

WowandFlutterLessthanmeasurablelimit

MP3DecodingFormatMPEG1/2AudioLayer3

Max.Bit Rate: 320kbps

WMA(WindowsMediaAudio)DecodingFormatMax. Bit Rate: 192kbps

GENERAL

Power RequirementOperatingVoltageDC14.4V(11Vto16Vallowance)

GroundingSystemNegative ground

AllowableOperatingTemperature0pCto+40pC

Dimensions(W IH ID)InstallationSize (approx.)182mm I52mm I159 mm

Panel Size (approx.)188 mm I58mm I12mm

Mass(approx.)1.5kg (excluding accessories)

(No.MA170)1-3

SECTION1

PRECAUTIONS

1.1SafetyPrecautions

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1-4(No.MA170)

1.2Preventingstaticelectricity

Electrostaticdischarge(ESD),whichoccurswhenstaticelectricitystoredinthebody,fabric, etc.isdischarged, can destroythe laser

diodeinthetraverseunit (opticalpickup). Takecaretoprevent thiswhen performing repairs.

1.2.1Groundingtopreventdamageby staticelectricity

Staticelectricityinthe workareacandestroytheoptical pickup (laser diode)indevicessuchasCDplayers.

Becarefultouseproper grounding inthe areawhererepairsarebeingperformed.

(1)Ground theworkbench

Ground theworkbenchbylayingconductivematerial(suchasaconductivesheet) oran iron plateoverit beforeplacingthe

traverseunit (opticalpickup)on it.

(2)Ground yourself

Use an anti-staticwriststraptoreleaseany staticelectricitybuiltup inyourbody.

(3)Handlingtheopticalpickup

Inordertomaintainqualityduring transport andbeforeinstallation,bothsidesofthelaserdiodeonthereplacementoptical

pickupareshorted. After replacement,returntheshortedpartstotheir original condition.

(Refer tothetext.)

Donotuseatestertochecktheconditionof thelaserdiodeintheopticalpickup. The tester'sinternalpower sourcecan easily

destroythelaserdiode.

1.3Handlingthetraverseunit (optical pickup)

(1)Donot subjectthetraverseunit (opticalpickup) tostrongshocks, asitisasensitive, complexunit.

(2)Cutoff theshortedpart of theflexiblecableusingnippers, etc.afterreplacingtheopticalpickup.Forspecificdetails,refertothe

replacementprocedureinthetext.Removetheanti-staticpinwhenreplacingthe traverseunit. Becareful nottotaketoolong a

timewhen attachingit totheconnector.

(3)Handletheflexiblecablecarefullyasitmaybreakwhen subjected tostrong force.

(4)It isnot possibletoadjust the semi-fixedresistorthat adjuststhelaserpower. Donotturnit.

1.4Attentionwhentraverseunit isdecomposed

*Pleasereferto"Disassemblymethod"inthetext fortheCDpickupunit.

Applysoldertotheshortlandbeforetheflexiblewireisdisconnectedfromthe connector ontheCDpickupunit.

(If theflexiblewireisdisconnectedwithout applyingsolder, the CDpickupmaybedestroyedbystaticelectricity.)

Intheassembly, besuretoremove solderfromtheshort landafter connecting the flexiblewire.

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(No.MA170)1-5

1.5Importantforlaserproducts

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1-6(No.MA170)

SECTION2

SPECIFICSERVICEINSTRUCTIONS

Thisservicemanual doesnotdescribeSPECIFICSERVICEINSTRUCTIONS.

(No.MA170)1-7

SECTION3

DISASSEMBLY

3.1Mainbodysection

3.1.1Removingthefront panel assembly

(SeeFig.1)

(1)Push the detach buttoninthelowerrightpartofthefront

panel assembly.

(2)Take outthefrontpanelassembly.

Fig.1

3.1.2Removingtheheatsink

(SeeFig.2)

(1)Fromthe left sideofthemainbody,removethetwoscrews

Aand three screws Battaching theheat sink.

(2)Take outtheheatsink.

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1-8(No.MA170)

3.1.3Removingthetopchassisassembly

(SeeFigs.3to6)

Prior toperformingthe followingprocedures, removetheheat

sink.

Reference:

Removethefrontpanelassemblyasrequired.(Refer to"3.1.1

Removingthefrontpanelassembly")

(1)Fromthebottomsideofthemainbody,removethetwo

screws Cattachingthetop chassisassemblytothebottom

chassisassembly. (SeeFig.3)

(2)Fromthebothand rearsidesofthemainbody, remove the

fourscrews Dattachingthe topchassisassemblytothe

bottomchassisassembly. (SeeFigs.4to6)

(3)Liftthetopchassisassemblyinthedirectionofthearrow,

anddisconnecttheconnector CN501 onthemechanism

controlboardfromtheconnector CN101 onthemain

board. (SeeFigs.5and6)

(4)Takeoutthetopchassisassemblyfromthebottomchassis

assembly.

Fig.3

Fig.4

Fig.5

Fig.6

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(No.MA170)1-9

3.1.4Removingthefront chassis

(SeeFigs.7and 8)

Priortoperformingthefollowing procedure,removethefront

panelassembly,heat sinkandtopchassisassembly.

(1)Fromthebothsidesofthetopchassisassembly,remove

thetwoscrews Eattachingthefrontchassis.(See Figs.7

and8)

(2)Take outthefrontchassis.

Fig.7

Fig.8

3.1.5Removingthemechanismcontrol board

(SeeFig.9)

Prior toperformingthefollowing procedures, removethefront

panelassembly,heat sink andtopchassisassembly.

Reference:

Removethefrontchassisasrequired.(Referto"3.1.4Remov-

ingthe front chassis")

(1)Disconnectthecardwirefromtheconnector CN601 onthe

mechanismcontrolboard.

(2)Removethefivescrews Fattachingthe mechanismcontrol

board.

(3)Release the claw a,andtake outthemechanismcontrol

board.

Reference:

Afterattachingthe mechanismcontrolboard,attachittothe

claw aandpasstheslot bof it intothebossofthe CDmech-

anismassembly.

Fig.9

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1-10(No.MA170)

3.1.6RemovingtheCDmechanismassembly

(SeeFig.10)

Prior toperformingthefollowingprocedures, remove thefront

panel assembly, heat sink andtopchassisassembly.

Reference:

Removethefrontchassisandmechanismcontrol boardasre-

quired.(Referto"3.1.4Removingthefrontchassis"and"3.1.5

Removingthemechanismcontrol board")

(1)Fromtheinside ofthetopchassisassembly,removethe

threescrews GattachingtheCDmechanismassembly.

(2)Takeout theCDmechanismassemblyfromthetopchas-

sis.

Fig.10

3.1.7Removingthemainboard

(SeeFigs.11 and12)

Prior toperformingthefollowingprocedures, remove thefront

panel assembly, heat sink andtopchassisassembly.

(1)Fromtherearsideofthe bottomchassisassembly,remove

thetwoscrews Hattachingtherearbrackettothebottom

chassisassembly. (SeeFig.11)

(2)Fromthetopsideof thebottomchassisassembly,remove

thetwoscrews Jattachingthe mainboardtothebottom

chassisassembly. (SeeFig.12)

(3)Releasethestopperoftheconnector CN702 on themain

boardinanupwarddirection,disconnectthecardwirefrom

theconnector CN702. (SeeFig.12)

(4)Disconnectthewirefromthe connectorofthefrontdoor

mechanismassembly. (SeeFig.12)

(5)Disconnectthewirefromtheconnector CN951 onthemain

board. (SeeFig.12)

Reference:

Afterconnecting thewires,fixthewireswiththewire

clamp.

(6)Take outthe mainboardfromthebottomchassisassem-

bly.

Fig.11

Fig.12

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