Intrinsyc Open-Q 626 mSOM Manual de usuario

Open-Q™ 626 µSOM Development Kit

Quick Start Guide

Your use of this document is subject to and governed by those terms and conditions (https://www.intrinsyc.com/legal-terms/qualcomm-terms.html) in the Intrinsyc Purchase and Software License Agreement for the Open-Q™ 626 µSOM Development Kit based on the Qualcomm® Snapdrag-

on™ 626 Processor (APQ8053), which you or the legal entity you represent, as the case may be, accepted and agreed to when purchasing an Open-Q™ 626 µSOM Development Kit from Intrinsyc Technologies Corporation (“Agreement”). You may use this document, which shall be considered

part of the defined term “Documentation” for purposes of the Agreement, solely in support of your permitted use of the Open-Q™ 626 µSOM Development Kit under the Agreement. Distribution of this document is strictly prohibited without the express written permission of Intrinsyc Tech-

nologies Corporation and its respective licensors, which they can withhold, condition or delay in its sole discretion. Intrinsyc is a trademark of Intrinsyc Technologies Corporation, registered in Canada and other countries. Qualcomm and Snapdragon are trademarks of Qualcomm Incorporated,

registered in the United States and other countries. Other product and brand names used herein may be trademarks or registered trademarks of their respective owners.

Package Contents

1. WLAN PCB Antenna

2. Audio output expansion header

3. Volume + buon

4. General Purpose buon

5. Audio input expansion header

6. 12V DC input jack

7. Power source switch

8. Baery connector

9. Baery charge cong switch

10. HDMI video output

11. 3.5 mm headset jack

12. Power header

13. USB Type-C connector

14. Debug UART (USB MicroB)

15. GPS ext. ant. SMA connector

16. GPS PCB Antenna (on boom)

17. MIPI camera 2 connector

18. Micro SD slot (on boom)

19. MIPI camera 1 connector

20. MIPI camera 0 connector

21. Sensor board header

22. Conguraon DIP switches

23. 3 x LEDs

24. SOM power measurement

header

25. GPIO expansion header

26. Volume - buon

27. Power buon

28. MIPI DSI LCD/touchscreen

connector to interface with

Intrinsyc display adapter

29. 16GB eMMC ash memory

30. APQ8053 CPU

31. 2GB LPDDR3 RAM memory

32. GPS antenna connector U.FL

33. WLAN antenna connector U.FL

34. Open-Q 626 µSOM (micro Sys-

tem on Module)

1. Open-Q™ 626 µSOM with APQ8053 processor

2. Open-Q™ 626 Carrier board

3. STEVAL_MKI128V6 sensor accessory board

4. AC Power Adapter

5. HDMI Video Cable

6. 4.5” FWVGA MIPI DSI LCD/touchscreen (oponal accessory)

134

1719

29 31

33 32

Open-Q™ 626 µSOM Development Kit

Quick Start Guide

Development Kit Support

For more information or assistance, you can contact us at:

https://www.intrinsyc.com/contact-support

Intrinsyc also provides technical information and videos on Snapdragon

processors at:

http://www.intrinsyc.com/resources

Should you require additional technical support for your Development Kit you can

purchase a block of technical support hours from the Intrinsyc store:

https://www.intrinsyc.com/support

Thank you for purchasing the Open-Q 626 Development Kit

The Intrinsyc Team

Development Kit Setup

1. At a static-safe workstation, remove the development kit board

carefully from the anti static bag

2. If you do not have the optional LCD then connect the HDMI cable from

the development kit (#10) to an HDMI display.

3. Connect the Power Adapter to the 12V DC Jack (#6), then press and

hold the power button (#27) for approximately 3 seconds. If using the

LCD you will see the boot menu appear first, followed by the Intrinsyc

logo as the board boots up. If using HDMI the screen will remain blank

for approximately 45 seconds before the Android screen appears.

4. Documentation and software

To access the documentation (schematics, user guides, programming guides,

tech notes…), platform BSP software and much more, please register at:

http://tech.intrinsyc.com

Specicaons are subject to change - Open-Q 626 DK QSG rev 1.3

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