Intel Q77 Manual de usuario

TECHNICAL MANUAL

Intel Q77 Express Chipset

Based Mini-ITX M/B

NO. G03-NF9E-R11-F

Revision: 2.0

Release date: October 1, 2019

Trademark:

* Specifications and Information contained in this documentation are furnished for information use only, and are

subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

Environmental Protection Announcement

Do not dispose this electronic device into the trash while discarding. To minimize

pollution and ensure environment protection of mother earth, please recycle.

ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iii

USER’S NOTICE .......................................................................................................................iv

MANUAL REVISION INFORMATION.......................................................................................iv

ITEM CHECKLIST.....................................................................................................................iv

CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD

1-1 FEATURE OF MOTHERBOARD................................................................................1

1-2 SPECIFICATION.........................................................................................................2

1-3 LAYOUT DIAGRAM....................................................................................................3

CHAPTER 2 HARDWARE INSTALLATION

2-1 JUMPER SETTING.....................................................................................................8

2-2 CONNECTORS AND HEADERS................................................................................13

2-2-1 CONNECTORS .............................................................................................13

2-2-2 HEADERS .....................................................................................................15

CHAPTER 3 INTRODUCING BIOS

3-1 ENTERING SETUP.....................................................................................................23

3-2 BIOS MENU SCREEN ................................................................................................24

3-3 FUNCTION KEYS .......................................................................................................24

3-4 GETTING HELP ..........................................................................................................25

3-5 MAIN BARS.................................................................................................................25

3-6 MAIN MENU................................................................................................................26

3-7 ADVANCED MENU.....................................................................................................27

3-8 CHIPSET MENU..........................................................................................................34

3-9 BOOT MENU...............................................................................................................39

3-10 SECURITY MENU.......................................................................................................40

3-11 SAVE & EXIT MENU...................................................................................................41

TABLE OF CONTENT

iii

Environmental Safety Instruction

zAvoid the dusty, humidity and temperature extremes. Do not place the product in

any area where it may become wet.

z0 to 60 centigrade is the suitable temperature. (The figure comes from the request

of the main chipset)

zGenerally speaking, dramatic changes in temperature may lead to contact

malfunction and crackles due to constant thermal expansion and contraction from

the welding spots’ that connect components and PCB. Computer should go

through an adaptive phase before it boots when it is moved from a cold

environment to a warmer one to avoid condensation phenomenon. These water

drops attached on PCB or the surface of the components can bring about

phenomena as minor as computer instability resulted from corrosion and oxidation

from components and PCB or as major as short circuit that can burn the

components. Suggest starting the computer until the temperature goes up.

zThe increasing temperature of the capacitor may decrease the life of computer.

Using the close case may decrease the life of other device because the higher

temperature in the inner of the case.

zAttention to the heat sink when you over-clocking. The higher temperature may

decrease the life of the device and burned the capacitor.

USER’S NOTICE

INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED

OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN

PERMISSION OF THE MANUFACTURER.

THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE

DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME

WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY

KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL

DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,

INTERRUPTION OF BUSINESS AND THE LIKE).

PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE

REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE

USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT

INTENT TO INFRINGE.

Manual Revision Information

Reversion Date

2.0 2019-10-01

Item Checklist

Motherboard

Cable(s)

I/O Back panel shield

Chapter 1

Introduction of the Motherboard

1-1 Feature of Motherboard

zIntel®Q77 express chipset

zSupports 3rd and 2nd Generation Intel®Core™ i7, Core™ i5, Core™ i3 series

processor in LAG1155 Package

zSupport 2 * DDRIII SO-DIMM 1066-1333 MHz up to 16GB and dual channel

function

zIntegrated with Intel®82574L and Intel®82579LM Gigabit Ethernet LAN chip

zIntegrated ALC662 6-channel HD Audio Codec

zSupport USB 3.0 data transport demands.

zSupport PCI Express x16 and Mini-PCIE slot

zIntegrated with 24-bit dual channel LVDS

z4* SATAII ports and 2* SATAIII ports

zHDMI, DVI-D and VGA Video Outputs

zSupport CPU Smart FAN

zSupports ACPI S3 Function

zCompliance with EuP Standard

zSupport Watchdog Timer Technology

1-2 Specification

Spec Description

Design zMini-ITX form factor 6 layers ; PCB size: 17.0x17.0cm

Chipset zIntel Q77 Express Chipset

CPU Socket zSupports 3rd and 2nd Generation Intel® Core™ i7,

Core™ i5, Core™ i3 series processor in LAG1155 Package

* for detailed CPU support information please visit our website

Memory Slot

zDDRIII SO-DIMM slot x2

zSupport DDRIII 1066/1333 MHz DDRIII SO-DIMM

expandable to 16GB

zSupport dual channel function

Expansion Slot z1 pcs of PCI Express x16 slot

z1 pcs of Mini-PCIE slot

Dual LAN Chip

zIntegrated Intel®82574L and 82579LM Gigabit Ethernet

LAN chip that supportFast Ethernet LAN function of

providing 10/100/1000Mbps Ethernet data transfer rate

Audio Chip zRealtek ALC662 6-channel Audio Codec integrated

zAudio driver and utility included

BIOS z64M DIP Flash ROM

Multi I/O

zHDMI port connector x1

zVGA port connector x1

zDVI-D port connector x 1

zCOM port connector x 2

zUSB 3.0 port connector x2

zUSB 2.0 port connector x4

zRJ-45 LAN connector x2

zAudio connector x1 (Line-in, Line-out, MIC)

zUSB 2.0 header x1 (support two expansion USB 2.0 ports)

zUSB 3.0 header x1 (support two expansion USB 3.0 ports)

zSATAII Connector x4

zSATAIII Connector x2

zFront panel audio header x1

zKBMS header x1

zLVDS header x1

zLVDS Inverter header x1

zHDMI_SPDIF header x1

zGPIO header x1

zTX-RXCOM header x1

zCIR header x1

zNICLED header x2

zSpeaker header x1

zPWRLED header x1

zFront panel header x1

1-3 Layout Diagram

Rear IO Diagram

MIC-IN

VGA Port

Line-IN

Line-OUT

USB 3.0 Ports

HDMI Port

RJ-45 LAN Ports

DVI-D Port

USB 2.0 Ports

Serial Port

Motherboard Internal Diagram

*Note: PE1 slot supports PCI-Express 2.0 x16 specification when using Intel®Sandy Bridge CPU and

supports PCI-Express 3.0 x16 specification when using Intel®Ivy Bridge CPU.

USB 2.0 Heade

USB 3.0 Ports

over HDMI Port

ATX Powe

connecto

ATX 12V

Power Connecto

DDRIII SODIMM Slo

x 2

（DDRIII 1066

1333）

Speaker Header

DVI-D Port over

VGA Por

Audio Connecto

Intel LGA1155

CPU Socket

HDMI_SPDIF

Heade

GPIO Heade

Intel

77 Chi

set

*PCI Express x16 Slot (PE1)

CPUFAN

eade

RJ-45 Port over

USB 2.0 Ports

LVDS Heade

SATAII Ports

(SATA3/4/5/6)

PWRLED Header

Front Panel

Audio Heade

Front Panel Heade

SYSFA

Header

SYSFA

1 Heade

atter

Connector

CIR Heade

SATAIII Ports

(

SATA1

)

TX-RX COM

Header

RJ-45 Port over

USB 2.0 Ports

Serial Ports Inverte

KBMS Heade

ini-PCIE Slo

USB 3.0 Heade

ICLED Heade

Motherboard Jumper Position

Audio Chip

JBAT

JP2

LAN Chi

JP1

JP4

CASE_OPEN

JP3

LAN Chi

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