Intel H61 Series Manual de usuario

USER'S MANUAL

Intel H61 Express Chipset

Based

M/B for Intel LGA 1155 Processors

Trademark:

* Specifications and Information contained in this documentation are furnished for information use only, and are

subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

NO. G03-I61M2-F

Rev: 4.0

Release date: October 31, 2011

Environmental Safety Instruction

zAvoid the dusty, humidity and temperature extremes. Do not place the product in any

area where it may become wet.

z0 to 40 centigrade is the suitable temperature. (The figure comes from the request of

the main chipset)

zGenerally speaking, dramatic changes in temperature may lead to contact malfunction

and crackles due to constant thermal expansion and contraction from the welding

spots’ that connect components and PCB. Computer should go through an adaptive

phase before it boots when it is moved from a cold environment to a warmer one to

avoid condensation phenomenon. These water drops attached on PCB or the surface

of the components can bring about phenomena as minor as computer instability

resulted from corrosion and oxidation from components and PCB or as major as short

circuit that can burn the components. Suggest starting the computer until the

temperature goes up.

zThe increasing temperature of the capacitor may decrease the life of computer. Using

the close case may decrease the life of other device because the higher temperature in

the inner of the case.

zAttention to the heat sink when you over-clocking. The higher temperature may

decrease the life of the device and burned the capacitor.

Environmental Protection Announcement

Do not dispose this electronic device into the trash while discarding. To minimize pollution

and ensure environment protection of mother earth, please recycle.

CHAPTER 1 INTRODUCTION OF INTEL H61 MOTHERBOARDS ........................1

1-1 FEATURES OF MOTHERBOARD......................................................................1

1-1-1 SPECIAL FEATURES OF MOTHERBOARD............................................1

1-2 SPECIFICATION.................................................................................................2

1-3 LAYOUT DIAGRAM............................................................................................3

CHAPTER 2 HARDWARE INSTALLATION ...........................................................5

2-1 CPU INSTALLATION ........................................................................................5

2-2 MEMORY MODULE INSTALLATION.................................................................6

2-3 EXPANSION CARD INSTALLATION.................................................................7

2-3-1 EXPANSION SLOTS.................................................................................7

2-3-2 PROCEDURE FOR EXPANSION CARD INSTALLATION.......................7

CHAPTER 3 CONNCTORS, HEADERS & JUMPERS SETTING............................8

3-1 MOTHERBOARD INTERNAL CONNECTORS ..................................................8

3-2 I/O BACK PANEL CONNECTORS.....................................................................10

3-3 HEADERS...........................................................................................................11

3-4 JUMPER SETTING.............................................................................................13

CHAPTER 4 USEFUL HELP....................................................................................14

4-1 HOW TO UPDATE BIOS ....................................................................................14

4-2 TROUBLE SHOOTING.......................................................................................14

TABLE OF CONTENT

Chapter 1

Introduction of Intel H61 Motherboards

1-1 Features of Motherboard

The Intel H61 Express chipset based motherboard series are based on Intel H61

Express chipset technology which supports the innovative Intel LGA 1155 socket

Intel® Core™ i7, Intel® Core™ i5, Core™ i3.

The Intel H61 Express chipset based motherboard series comes with an integrated

DDRIII memory controller for dual channel DDRIII 800/ DDRIII 1066 /DDRIII 1333

MHz system memories which are expandable to 8 GB capacity.

The motherboard provides four serial ATAII interfaces of 3.0 Gb / s data transfer rate

for four SATA devices.

The H61 Express chipset based motherboards are integrated with megabit LAN chip

providing 10/100 Mbps data transfer rate. The H61 Express chipset based

motherboard series are embedded 6-channel HD CODEC fully compatible with

Sound Blaster Pro®standards to offer you home cinema quality and absolutely

software compatibility.

The H61 Express chipset based motherboard series offer one PCI-Express 2.0 x16

graphics slot and one PCI Express 2.0 x1 I/O slots to guarantee the rich connectivity

for the I/Os of peripherals.

Embedded USB controllers as well as capability of expanding to 8 of USB 2.0

functional ports delivering 480Mb/s bandwidth of rich connectivity, these

motherboards meet the future USB demands which are also equipped with hardware

monitor function on system to monitor and protect your system and maintain your

non-stop business computing.

Some special features--- CPU Vcore solid capacitors/CPU Smart Fan (Optional)

provide extra protection to the motherboard to extend product life and ensure system

stability.

1-1-1 Special Features of motherboard

CPU Vcore solid capacitors-High-polymer Solid Electrolysis Aluminum Capacitors

The motherboard adopts CPU Vcore solid capacitors to make it possible for

motherboard to work from 55 degrees Centigrade below zero to 125 degrees

centigrade. CPU Vcore capacitors possess superior physical characteristics to

prolong product life ten times than corresponding motherboard without capacitors

every time working temperature increases 20 degrees. Life of product of motherboard

with solid capacitors declines only 10% of those without solid capacitors as well under

same conditions.

CPU Smart Fan (Optional)—The Noise Management System

It’s never been a good idea to gain the performance of your system by sacrificing its

acoustics. CPU Smart Fan Noise Management System is the answer to control the

noise level needed for now-a-day’s high performance computing system. The system

will automatically increase the fan speed when CPU operating loading is high, after

the CPU is in normal operating condition, the system will low down the fan speed for

the silent operating environment. The system can provide the much longer life cycle

for both CPU and the system fans for game use and business requirements.

Notice! CPU Smart Fan is only optional for later version boards. To mask sure if

your board support this function please check BIOS settings.

1-2 Specification

Spec Description

Design zU-ATX PCB size: 17.5 cm x 23.0 cm

Chipset zIntel H61 Express Chipset

CPU Socket zsupports the innovative Intel LGA 1155 socket Intel®

Core™ i7, Core™ i5, Core™ i3 Processor

Memory Slot

zDDRIII module slot x 2

zSupport 2pcs DDRIII 800/DDRIII 1066/DDRIII 1333

memory modules expandable to 8 GB

zSupport dual channel function

Expansion Slots z1pcs PCI-Express 2.0 x16 by16 lane slot

z1pcs PCI-Express 2.0 x1 slot

Serial ATA2 zThe Intel H61chipset supports four internal SATA ports for

four SATA devices providing 3.0 Gb/sec data transfer rate

LAN chip

zIntegrated megabit PCI-E LAN chip that supports Fast

Ethernet LAN function of providing 10/100 Mbps data

transfer rate

HD Audio Chip z6-CHHD Audio Codec integrated

zAudio driver and utility included

BIOS zAMI 32MB DIP Flash ROM

Multi I/O

zPS/2 mouse connector x1

zPS/2 keyboard connector x 1

zVGA connector x1

zDVI connector x1

zHDMI connectorx1 (Optional for I61M2 series only)

zUSB 2.0 port x4 and header x2

zRJ-45 LAN connector x1

zAudio connector x1 (6-CH Audio)

zFront panel audio Header x1

zHDMI-SPDIF header x1

zFront panel header x1

zPWELED header x1

zSpeaker header x1

Item Checklist

zIntel H61 Chipset based motherboard

zDVD for motherboard utilities

zUser’s Manual

zSATA Cable

zI/O back panel shield

1-3 Layout Diagram

For I61M2 Series Motherboard

*Note: The above diagram is for illustration purpose only. Later board version has

moved front panel audio header to the position near USB header. Please refer to

actual product you purchase.

CPU Socket

ATX Power Connecto

CPU FAN1 Header

USB Headers

ATX 12V

Power Connector

RJ-45 LAN Port

Line-IN

MIC-IN

VGA Port

DDRIII Slot x 2

JBAT

Audio Connector

Line-OUT

KB/MS Power on (JP1)

DVI Port

Intel H61 Chipset

PCI Express 2.0x1 slots

VGA Port

PS/2 Mouse port

Over Keyboard Port

USB 2.0 Ports

DVI Port

HDMI port

RJ-45 over

USB 2.0

orts

Front Panel Audio Header

6-CH HD Audio Chip

PCI Express2.0 x16 Lane slot

HDMI-SPDIF Header

Power LED Header

HDMI Port

PS/2 Keyboard Port

USB 2.0 ports

Speaker Heade

JW-FP1 Header

SATA 1 Connecto

SATA 2 Connecto

SATA 4 Connecto

SATA 3 Connecto

Megabit LAN Chip

SYSFAN1 Header

JP2

PS/2 Keyboard Port

For I61M2-GT Series Motherboard

CPU Socket

ATX Power Connecto

CPU FAN1 Header

USB Headers

ATX 12V

Power Connector

RJ-45 LAN Port

Line-IN

MIC-IN

VGA Port

DDRIII Slot x 2

JBAT

Audio Connector

Line-OUT

KB/MS Power on (JP1)

Intel H61 Chipset

PCI Express 2.0x1 slots

VGA Port

PS/2 Mouse port

Over Keyboard Port

USB 2.0 Ports

DVI port

RJ-45 over

USB 2.0

orts

Front Panel

Audio Header

6-CH HD Audio Chip

PCI Express2.0 x16 Lane slot

HDMI-SPDIF Header

Power LED Header

DVI Port

PS/2 Keyboard Port

USB 2.0 ports

Speaker Heade

JW-FP1 Header

SATA 1 Connecto

SATA 2 Connecto

SATA 4 Connecto

SATA 3 Connecto

Megabit LAN Chip

SYSFAN1 Header

JP2

PS/2 Keyboard Port

Chapter 2

Hardware Installation

WARNING! Turn off your power when adding or removing expansion cards or

other system components. Failure to do so may cause severe

damage to both your motherboard and expansion cards.

2-1 CPU Installation

This motherboard provides an 1155-pin DIP, LGA 1155 Land Grid Array socket,

referred to as the LGA 1155 socket.

The CPU that comes with the motherboard should have a cooling FAN attached to

prevent overheating. If this is not the case, then purchase a correct cooling FAN

before you turn on your system.

NOTICE! Be sure that there is sufficient air circulation across the processor’s

heat sink and CPU cooling FAN is working correctly, otherwise it

may cause the processor and motherboard overheat and damage,

you may install an auxiliary cooling FAN, if necessary.

To install a CPU, first turn off your system and remove its cover. Locate the LGA

1155 socket and open it by first pulling the level sideways away from the socket then

upward to a 135-degree angle. Insert the CPU with the correct orientation as shown

below. The notched corner should point toward the end of the level. Because the

CPU has a corner pin for two of the four corners, the CPU will only fit in the orientation

as shown.

When you install the CPU into the LGA 1155 socket, there’s no force required CPU

insertion; then presses the level to locate position slightly without any extra force.

Pin-1 Indicator

Ali

nment ke

2-2 Memory Module Installation

This motherboard provides two 240-pin DDR III DUAL INLINE MEMORY MODULES

(DIMM) socket for DDR III memory expansion available to maximum memory volume

of 8 GB DDRIII SDRAM.

Valid Memory Configurations

Bank 240-Pin DIMM PCS Maximum Capacity

DIMM1 DDR III 800/DDR III 1066/ DDR III1333 X1 4GB

DIMM2 DDR III 800/DDR III 1066/ DDR III1333 X1 4GB

Total System Memory (Max 4GB) 2 8GB

Recommend DIMM Module Combination

：

1. One DDRIII Memory Module ----Plug in DIMMM1.

2. Two DDRIII Memory Modules---Plug in DIMM1 & DIMM2 for Dual channel function

Dual channel Limited!

1. Memory modules plugged in the same color DIMM must be of the same type, same

size, and same frequency for dual channel function.

2. Dual channel function only supports when 2 DIMM Modules plug in either both DIMM1

& DIMM2.

Install DDR SDRAM modules to your motherboard is not difficult, you can refer to

figure below to see how to install DDRIII 800/ DDRIII 1066/DDRIII 1333 SDRAM

module.

DIMM2(BANK2+BANK3)

DIMM1(BANK0+BANK1)

DIMM1 & DIMM2: Dual Channel

NOTICE! When you install DIMM module fully into the DIMM socket the eject

tab should be locked into the DIMM module very firmly and fit into its

indention on both sides.

Installation Tips：

Open the two plastic clips of memory slots then push down the module

vertically into the slot. See to it that the hole of the module fit into the notch of

the slot;

The two plastic clips will automatically close if the memory module is fitted in a

proper way.

2-3 Expansion Card Installation

2-3-1 Expansion Slots

The H61 Express chipset based motherboard series offer one PCI-Express2.0 x16

graphics slot and one PCI Express 2.0 x1 I/O slot to guarantee the rich connectivity

for the I/O of peripherals.

2-5-2 Procedure for Expansion Card Installation

1. Read the documentation for your expansion card and make any necessary

hardware or software setting for your expansion card such as jumpers.

2. Remove your computer’s cover and the bracket plate on the slot you intend to

use.

3. Align the card’s connectors and press firmly.

4. Secure the card on the slot with the screen you remove above.

5. Replace the computer system’s cover.

6. Set up the BIOS if necessary.

7. Install the necessary software driver for your expansion card.

PCI-E2.0 x16@16 Lane Slot

PCI-E 2.0 x1 slot

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