Intel H55 Manual de usuario

USER'S MANUAL

Intel H55 Express Chipset

Based

M/B for Intel LGA 1156 Processors

Trademark:

* Specifications and Information contained in this documentation are furnished for information use only, and are

subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

NO. G03-XBH55MINI-F

Rev: 1.0

Release date: April, 2010

Environmental Safety Instruction

zAvoid the dusty, humidity and temperature extremes. Do not place the product in any

area where it may become wet.

z0 to 40 centigrade is the suitable temperature. (The figure comes from the request of

the main chipset)

zGenerally speaking, dramatic changes in temperature may lead to contact malfunction

and crackles due to constant thermal expansion and contraction from the welding

spots’ that connect components and PCB. Computer should go through an adaptive

phase before it boots when it is moved from a cold environment to a warmer one to

avoid condensation phenomenon. These water drops attached on PCB or the surface

of the components can bring about phenomena as minor as computer instability

resulted from corrosion and oxidation from components and PCB or as major as short

circuit that can burn the components. Suggest starting the computer until the

temperature goes up.

zThe increasing temperature of the capacitor may decrease the life of computer. Using

the close case may decrease the life of other device because the higher temperature in

the inner of the case.

zAttention to the heat sink when you over-clocking. The higher temperature may

decrease the life of the device and burned the capacitor.

Environmental Protection Announcement

Do not dispose this electronic device into the trash while discarding. To minimize pollution

and ensure environment protection of mother earth, please recycle.

CHAPTER 1 INTRODUCTION OF INTEL H55 MOTHERBOARDS

1-1 FEATURES OF MOTHERBOARD................................................................1

1-1.1 SPECIAL FEATURES OF MOTHERBOARD .................................2

1-2 ITEM CHECKLIST.........................................................................................2

1-3 SPECIFICATION...........................................................................................3

1-4 LAYOUT DIAGRAM......................................................................................4

CHAPTER 2 HARDWARE INSTALLATION

2-1 CPU INSTALLATION ..................................................................................5

2-2 MEMORY MODULE INSTALLATION...........................................................6

2-3 EXPANSION SLOTS.....................................................................................7

CHAPTER 3 CONNCTORS, HEADERS & JUMPERS SETTING

3-1 CONNECTORS .............................................................................................7

3-2 HEADERS .....................................................................................................10

3-3 JUMPER SETTING .......................................................................................12

CHAPTER 4 USEFUL HELP

4-1 HOW TO UPDATE BIOS ..............................................................................13

4-2 TROUBLE SHOOTING .................................................................................13

TABLE OF CONTENT

Chapter 1

Introduction of Intel H55 Motherboards

1-1 Features of Motherboard

The Intel H55 Express chipset based motherboard series are based on Intel H55

Express chipset technology which supports the innovative Intel LGA 1156 socket

Intel® Core™ i7, Intel® Core™ i5（Lynnfield & Clarkdale）, Core™ i3 and Pentium®

Processor.

The Intel H55 Express chipset based motherboard series comes with an integrated

DDRIII memory controller for dual channel DDRIII 1066 /DDRIII 1333 MHz system

memories which are expandable to 8 GB capacity and the new generation of PCI

Express interface for the latest graphics AMD cards. The Intel H55 Express chipset

motherboard series are absolutely the ultimate solution for game enthusiasts and

applications, and it also meets the demanding usage of computing of gaming,

multimedia entertainment and business applications.

The motherboard provides four serial ATA2 interfaces of 3.0 Gb / s data transfer rate

for six serial ATA devices.

The H55 Express chipset Based motherboard provides Gigabit LAN function by using

Gigabit LAN chip which support 10M / 100M / 1Gbps data transfer rate. Embedded

6-channel ALC 662 HD CODEC is fully compatible with Sound Blaster Pro®

standards that offer you with the home cinema quality and absolutely software

compatibility.

The H55 Express chipset based motherboard series offer one PCI-Express2.0 x16

graphics slot, two PCI Express 2.0 x1 I/O slots and one 32-bit PCI slot guarantee the

rich connectivity for the I/O of peripherals.

Embedded USB controllers as well as capability of expanding to 8 of USB2.0

functional ports delivering 480Mb/s bandwidth of rich connectivity, these

motherboards meet the future USB demands which are also equipped with hardware

monitor function on system to monitor and protect your system and maintain your

non-stop business computing.

Some special features--- CPU Vcore 7-Shift/CPU Smart Fan/OC-CON/G.P.I.

Function/3D Audio in this motherboard is designed for power user to use the

over-clocking function in more flexible ways. But please be caution that the

over-clocking may cause the failure in system reliability. This motherboard provides

the guaranteed performance and meets the demands of the next generation

computing. But if you insist to gain more system performance with variety possibilities

of the components you choose, please be careful and make sure to read the detailed

descriptions of these value added product features, please get them in the coming

section.

1-1.1 Special Features of motherboard

CPU Vcore 7-Shift—Shift to Higher Performance

The CPU voltage can be adjusted up by 7 steps for the precisely over-clocking of

extra demanding computing performance.

CPU Smart Fan—Noise Management System

It’s never been a good idea to gain the performance of your system by sacrificing its

acoustics. CPU Smart Fan Noise Management System is the answer to control the

noise level needed for now-a-day’s high performance computing system. The system

will automatically increase the fan speed when CPU operating loading is high, after

the CPU is in normal operating condition, the system will low down the fan speed for

the silent operating environment. The system can provide the much longer life cycle

for both CPU and the system fans for game use and business requirements.

OC-CON —High-polymer Solid Electrolysis Aluminum Capacitors

The working temperature is from 55 degrees Centigrade below zero to 125 degrees

Centigrade, OC-CON capacitors possess superior physical characteristics that can

be while reducing the working temperature between 20 degrees Centigrade each time,

intact extension 10 times of effective product operation lives, at not rising degrees

Centigrade of working temperatures each time a relative one, life of product decline

10% only too.

G.P.I. Function—Green power indicator function

The full name of G.P.I technology is Green Power Indicator technology, obviously

technology utilized to low power consumption. G.P.I is a technology with remarkable

power saving function.

3D Audio—3D Audio Sound Effect

OP with two-stage Butterworth filter and quadruple noninverting amplifier enhances

bass effect under the 100MHz range to perfect audio effect, brings you stunning

shock experience in video game, true-to-life simulated feeling when watching films

and the greatest touch as that in the concert. There is a 3D Audio button integrated on

the board. Press down the button to enable 3D audio effect or press again to disabled

it.

1-2 Item Checklist

5Intel H55 Chipset based motherboard

5DVD for motherboard utilities

5User’s Manual

5SATA Cable(s)

5I/O back panel shield

1-3 Specification

Spec Description

Design zU-ATX form factor, PCB size: 20.0cmx24.5cm

Chipset zIntel H55 Express Chipset

CPU Socket

zsupports the innovative Intel LGA 1156 socket Intel®,

Core™ i7, Core™ i5（Lynnfield & Clarkdale）, Core™ i3

and Pentium® Processor

Memory Sockets

zDDRIII module slot x 2

zSupport 2pcs DDRIII 1066/DDRIII 1333 memory modules

expandable to 8 GB

zSupport dual channel function

Expansion Slots z1pcs PCI-Express2.0 x16by16 lane slot

z2pcs PCI-Express2.0 x1 slot

z1pcs 32-bit PCI slot

Serial ATA2 zThe Intel H55 chipset supports four internal Serial ATA

ports for six SATA devices providing 3.0 Gb/sec data

transfer rate.

Gigabit LAN

zIntegrated Realtek PCI-E Gigabit LAN chip

zSupports Fast Ethernet LAN function provide

10Mb/100Mb/ 1Gb /s data transfer rate.

6-CH HD Audio zRealtek ALC 662 HD Audio Codec integrated

zSupport 6-channel 3D surround & Positioning Audio

zAudio driver and utility included

BIOS zAMI 32MB SMT Flash ROM

Multi I/O

zPS/2 keyboard connector x1

zPS/2 mouse connector x1

zHDMI Connector x1

zDVI Connector x1

zVGA Connector x1

zSATA connector x4

zUSB2.0 port x4 and header x2

zRJ-45 LAN connector x1

zAudio connector x1 (6-CH Audio)

zFront Panel Audio Header x1

zSerial Port headerx1

zHDMI-SPDIF header x1

1-4 Layout Diagram

CPU Socket

ATX Power Conn.

PCI Slot

CPU FAN1

RJ-45 Over

USB Connectors

Power LED Header

Speaker Header

Front Panel

Audio Header

USB Headers

SYSFAN1

ATX 12V

Power Connector

RJ-45 LAN

Line-IN

MIC-IN

PS/2 Keyboard

Connector

VGA Connector

DDRIII Slot x 2

USB Connectors

HDMI

Connector

PS2 KB/MS Port

(KB1)

JBAT

Serial-ATAII Connecto

(SATA 1, 2, 3, 4)

Audio Connector

COM Header

PCI Express2.0x16 by 16lane slot

Line-OUT

HDMI Connector

PS/2 Mouse

Connector

KB/MS Power On (JP1)

DVI Connecto

Realtek ALC662

Audio Decode

HDMI-SPDIF

Header

Front Panel Header

Intel H55 Chipset

PCI Express 2.0x1 slots

Gigabit LAN Chip

G.P.I LED

DVI Connector

VGA Connector

USB Connecto

3D Audio Button

Chapter 2

Hardware Installation

WARNING! Turn off your power when adding or removing expansion cards or

other system components. Failure to do so may cause severe

damage to both your motherboard and expansion cards.

2-1 CPU Installation

This motherboard provides an 1156-pin DIP, LGA 1156 Land Grid Array socket,

referred to as the LGA 1156 socket.

The CPU that comes with the motherboard should have a cooling FAN attached to

prevent overheating. If this is not the case, then purchase a correct cooling FAN

before you turn on your system.

NOTED! Be sure that there is sufficient air circulation across the processor’s

heat sink and CPU cooling FAN is working correctly, otherwise it

may cause the processor and motherboard overheat and damage,

you may install an auxiliary cooling FAN, if necessary.

To install a CPU, first turn off your system and remove its cover. Locate the LGA

1156 socket and open it by first pulling the level sideways away from the socket then

upward to a 135-degree angle. Insert the CPU with the correct orientation as shown

below. The notched corner should point toward the end of the level. Because the

CPU has a corner pin for two of the four corners, the CPU will only fit in the orientation

as shown.

When you install the CPU into the LGA 1156 socket, there’s no force required CPU

insertion; then press the level to locate position slightly without any extra force.

Alignment key

Pin-1

Indicato

2-2 Memory Module Installation

This motherboard provides two 240-pin DDR III DUAL INLINE MEMORY MODULES

(DIMM) socket for DDR III memory expansion available to maximum memory volume

of 8 GB DDRIII SDRAM.

Valid Memory Configurations

Bank 240-Pin DIMM PCS Maximum Capacity

DIMM1 DDR III 1066/ DDR III1333 X1 4GB

DIMM2 DDR III 1066/ DDR III1333 X1 4GB

Total System Memory (Max 4GB) 2 8GB

Recommend DIMM Module Combination

：

1. One DDRIII Memory Module ----Plug in DIMMM1.

2. Two DDRIII Memory Modules---Plug in DIMM1 & DIMM2 for Dual channel function

Dual channel Limited!

1. Dual channel function only supports when 2 DIMM Modules plug in either both DIMM1

& DIMM2.

2. Memory modules plugged in the same color DIMM must be of the same type, same

size, and same frequency for dual channel function.

Install DDR SDRAM modules to your motherboard is not difficult, you can refer to

figure below to see how to install DDRIII 1066/DDRIII 1333 SDRAM module.

DIMM2(BANK2+BANK3)

DIMM1(BANK0+BANK1)

DIMM1 & DIMM2: Dual Channel

NOTE! When you install DIMM module fully into the DIMM socket the eject

tab should be locked into the DIMM module very firmly and fit into its

indention on both sides.

Installation Tips：

Open the two plastic clips of memory slots then push down the module

vertically into the slot. See to it that the hole of the module fit into the notch of

the slot;

The two plastic clips will automatically close if the memory module is fitted in a

proper way.

2-3 PCI Express Slots

The H55 Express chipset based motherboard series offer one PCI-Express2.0 x16

graphics slots. Two PCI Express 2.0 x1 I/O slot and one 32-bit PCI slot guarantee the

rich connectivity for the I/O of peripherals.

Chapter 3

Connectors, Headers &Jumper Setting

3-1 Connectors

(1) Power Connector (24-pin block): ATXPWR1

ATX Power Supply connector: This is a new defined 24-pins connector that

usually comes with ATX case. The ATX Power Supply allows using soft power

on momentary switch that connect from the front panel switch to 2-pins Power

On jumper pole on the motherboard. When the power switch on the back of the

ATX power supply turned on, the full power will not come into the system board

until the front panel switch is momentarily pressed. Press this switch again will

turn off the power to the system board.

** We recommend that you use an ATX 12V Specification 2.0-compliant power

supply unit (PSU) with a minimum of 350W power rating. This type has 24-pin

and 4-pin power plugs.

** If you intend to use a PSU with 20-pin and 4-pin power plugs, make sure that the

20-pin power plug can provide at least 15A on +12V and the power supply unit

has a minimum power rating of 350W. The system may become unstable or may

not boot up if the power is inadequate.

PCI-E2.0 x16@16 Lane Slot

PCI slot

PCI-E2.0 x1 slot

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