Intel Denverton Series Manual de usuario

Technical Manual

Intel Denverton Series CPU

Based SBC

NO.G03-NF699-F

Revision: 1.0

Release date: July 12, 2018

Trademark:

* Specifications and Information contained in this documentation are furnished for information use only, and are

subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

Environmental Protection Announcement

Do not dispose this electronic device into the trash while discarding. To minimize

pollution and ensure environment protection of mother earth, please recycle.

iii

ENVIRONMENTAL SAFETY INSTRUCTION ....................................................................... iv

USER’S NOTICE .................................................................................................................. v

MANUAL REVISION INFORMATION................................................................................... v

ITEM CHECKLIST ................................................................................................................ v

CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD

1-1 FEATURE OF MOTHERBOARD ............................................................................ 1

1-2 SPECIFICATION .................................................................................................... 2

1-3 LAYOUT DIAGRAM ............................................................................................... 3

CHAPTER 2 HARDWARE INSTALLATION

2-1 JUMPER SETTING................................................................................................. 6

2-2 CONNECTORS AND HEADERS ............................................................................ 10

2-2-1 CONNECTORS ......................................................................................... 10

2-2-2 HEADERS ................................................................................................. 15

CHAPTER 3 INTRODUCING BIOS

3-1 ENTERING SETUP................................................................................................. 18

3-2 BIOS MENU SCREEN ............................................................................................ 19

3-3 FUNCTION KEYS................................................................................................... 20

3-4 GETTING HELP...................................................................................................... 20

3-5 MEMU BARS.......................................................................................................... 21

3-6 MAIN MENU ........................................................................................................... 22

3-7 ADVANCED MENU ................................................................................................ 23

3-8 INTEL RC SETUP MENU ....................................................................................... 33

3-9 EVENT LOGS MENU.............................................................................................. 36

3-9 CHIPSET MENU..................................................................................................... 33

3-10 SECURITY MENU .................................................................................................. 38

3-11 BOOT MENU.......................................................................................................... 41

3-12 SAVE & EXIT MENU .............................................................................................. 42

TABLE OF CONTENT

Environmental Safety Instruction

 Avoid the dusty, humidity and temperature extremes. Do not place the product in

any area where it may become wet.

 0 to 60 centigrade is the suitable temperature. (The figure comes from the request

of the main chipset)

 Generally speaking, dramatic changes in temperature may lead to contact

malfunction and crackles due to constant thermal expansion and contraction from

the welding spots’ that connect components and PCB. Computer should go

through an adaptive phase before it boots when it is moved from a cold

environment to a warmer one to avoid condensation phenomenon. These water

drops attached on PCB or the surface of the components can bring about

phenomena as minor as computer instability resulted from corrosion and oxidation

from components and PCB or as major as short circuit that can burn the

components. Suggest starting the computer until the temperature goes up.

 The increasing temperature of the capacitor may decrease the life of computer.

Using the close case may decrease the life of other device because the higher

temperature in the inner of the case.

 Attention to the heat sink when you over-clocking. The higher temperature may

decrease the life of the device and burned the capacitor.

USER’S NOTICE

INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED

OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN

PERMISSION OF THE MANUFACTURER.

THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE

DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME

WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY

KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL

DAMAGES (INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,

INTERRUPTION OF BUSINESS AND THE LIKE).

PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE

REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE

USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT

INTENT TO INFRINGE.

Manual Revision Information

Reversion Revision History Date

1.0 First Edition July 12, 2018

Item Checklist

 Motherboard

 User’s Manual

 DVD for motherboard utilities

 Cable(s)

Chapter 1

Introduction of the Motherboard

1-1 Feature of Motherboard

 Intel® Denverton series SoC Processor

 4*288-pin U-DIMM/R-DIMM slots support 4* DDR4 2133/2400MHz ECC SDRAM,

up to 256GB memory

 Support 2 * Intel i210AT GbE & 4 * 10GbE SPF+ ports

 Support 4 * SATA III & M.2 (M key, SATA interface, 2242/2260/2280) storage

 1 * full size Mini-PCIe slot & 1 * PCIe x8 (use PCIe x16 slot) for riser card

expansion

 3 * External USB3.0 & 2 * Internal USB2.0

 1 * Internal VGA pin header

 Support Intel AES NI and on-board TPM to secure customers’ data

 Support Smart FAN function

 Compliance with ErP standard

 Support Watchdog function

 Solution for Surveillance, IoT & Networking Appliance

1-2 Specification

Spec Description

Design  Mini-ITX form factor ;

 PCB size: 17.0 x 17.0 cm

Embedded

CPU

 Intel® Denverton series SoC Processor

* for detailed CPU support information please visit our website

Memory Slot

 4* 288-pin U-DIMM/R-DIMM DDR4 slot

 Support 4* DDR4 2133/2400 MHz U-DIMM/R-DIMM SDRAM up to

256GB

 Support dual channel function (*refer to P-14 for installation guide )

Expansion Slot  1* Full-size Mini-PCIE slot (MPE)

 1* PCIE x8 slot (PCIEX8)

Storage  4* SATAIII 6Gb/s port (SATA1/2/3/4)

 1* M.2 Slot (Socket 3, M-key, support type-2242/2260/2280 SSD)

Networking  Integrated with 2* Intel I210AT PCI-E Gigabit LAN chips

 Support 2 * RJ-45 GbE ports & 4 * SPF+ 10GbE ports

BIOS  AMI Flash ROM

Rear Panel I/O

 3* USB 3.0 port

 2* RJ-45 LAN port

 4* SPF+ port

Internal I/O

 1*24-pin main power connector

 1*8-pin 12V power connector

 1*CPUFAN connector & 1* SYSFAN connector

 1*Front panel header

 1* 9-Pin USB 2.0/1.1 header for 2* USB 2.0/1.1 ports

 1* GPIO header

 1* Front VGA port header (Max. Resolution: 1920x1200@60Hz)

 2* RS232 serial port header (COM1/2)

* Note: Many PCs now include XHCI USB controllers which allow for the support of USB 3.0 and higher

USB speeds. This inclusion of XHCI controllers has lessened the need for EHCI USB controllers within

platforms. However, legacy operating systems (OS) may not natively recognize XHCI controllers. You

might need to pre-install XHCI driver while desiring to install a non-XHCI OS on Intel platforms which do

not include EHCI controllers. Please contact your representative for more details.

1-3 Layout Diagram

Rear IO Panel Diagram:

USB 3.0 Ports

RJ-45 LAN Ports

SFP+ Ports

Reset Switch

Power LED

Internal Diagram-Back Side:

* JP2: JTAG option, for in-house test purpose only.

SATAIII Ports

GPIO Port

Header

VGA Port

Header

Intel

CPU

DDR4

U-DIMM/R-DIMM

Slot x 4

ATX 12V

Power Connector

ATX Main

Power Connector

Front Panel

Header

SYSFAN

Connector

USB 3.0 Port

RJ-45 LAN Ports

Over USB 3.0 Ports

SFP+ Ports

OM2

Serial Port

Header

USB 2.0 Port

Header

Full

size

Mini-

PCIE Slot

(MPE)

CPUFAN

Connector

PCIE x8 Slot

OM1

Serial Port

Header

M.2 M Key

Socket 3

Slot

JP3

JP4

COPEN

JBAT

*JP2

JP1

Jumper

P/N Function Description

JBAT Pin (1-2): Clear CMOS

Pin (3-4): Clear RTC

Pin (5-6): Flash Override

Pin (7-8): ME Recovery

8-Pin Block

COPEN Case Open Message Display Select 2-Pin Block

JP1 Power Switch Selection 3-Pin Block

JP3 COM1 Header Pin9 Function Select 4-Pin Block

JP4 COM2 Header Pin9 Function Select 4-Pin Block

Connectors

Connector Name

ATXPWR Main Power Connector

ATX12V CPU Power Connector

CPUFAN CPUFAN Connector

SYSFAN SYSFAN Connector

SATA1/2/3/4 SATAIII Port Connector

USB3 USB 3.0 Port Connector

UL1/UL2 Top: RJ-45 LAN Port Connector

Bottom: USB 3.0 Port Connector

SFP1/ SFP2 Small Form-factor Pluggable Connector

MPE Full-size Mini-PCIE Slot

M2 M.2 Socket 3 Slot

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