Intel Braswell Series Manual de usuario

Technical Manual

Intel Braswell Series CPU

Based Mini-ITX M/B

NO.G03-NF596I-F

Revision: 1.0

Release date: August 31, 2021

Trademark:

* Specifications and Information contained in this documentation are furnished for information use only, and are

subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

Environmental Protection Announcement

Do not dispose this electronic device into the trash while discarding. To minimize

pollution and ensure environment protection of mother earth, please recycle.

iii

ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iv

USER’S NOTICE .......................................................................................................................v

MANUAL REVISION INFORMATION.......................................................................................v

ITEM CHECKLIST .....................................................................................................................v

CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD

1-1 FEATURE OF MOTHERBOARD................................................................................1

1-2 SPECIFICATION.........................................................................................................2

1-3 LAYOUT DIAGRAM....................................................................................................3

CHAPTER 2 HARDWARE INSTALLATION

2-1 JUMPER SETTING .....................................................................................................8

2-2 CONNECTORS AND HEADERS................................................................................13

2-2-1 CONNECTORS .............................................................................................13

2-2-2 HEADERS .....................................................................................................17

CHAPTER 3 INTRODUCING BIOS

3-1 ENTERING SETUP .....................................................................................................23

3-2 BIOS MENU SCREEN ................................................................................................24

3-3 FUNCTION KEYS .......................................................................................................24

3-4 GETTING HELP ..........................................................................................................25

3-5 MEMU BARS...............................................................................................................25

3-6 MAIN MENU................................................................................................................26

3-7 ADVANCED MENU.....................................................................................................27

3-8 CHIPSET MENU..........................................................................................................42

3-9 SECURITY MENU.......................................................................................................46

3-10 BOOT MENU...............................................................................................................47

3-11 SAVE & EXIT MENU...................................................................................................48

TABLE OF CONTENT

Environmental Safety Instruction

⚫Avoid the dusty, humidity and temperature extremes. Do not place the product in

any area where it may become wet.

⚫0 to 60 centigrade is the suitable temperature. (The figure comes from the request

of the main chipset)

⚫Generally speaking, dramatic changes in temperature may lead to contact

malfunction and crackles due to constant thermal expansion and contraction from

the welding spots’ that connect components and PCB. Computer should go

through an adaptive phase before it boots when it is moved from a cold

environment to a warmer one to avoid condensation phenomenon. These water

drops attached on PCB or the surface of the components can bring about

phenomena as minor as computer instability resulted from corrosion and oxidation

from components and PCB or as major as short circuit that can burn the

components. Suggest starting the computer until the temperature goes up.

⚫The increasing temperature of the capacitor may decrease the life of computer.

Using the close case may decrease the life of other device because the higher

temperature in the inner of the case.

⚫Attention to the heat sink when you over-clocking. The higher temperature may

decrease the life of the device and burned the capacitor.

USER’S NOTICE

INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED

OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN

PERMISSION OF THE MANUFACTURER.

THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIESANDWE

DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME

WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY

KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL

DAMAGES (INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,

INTERRUPTION OF BUSINESS AND THE LIKE).

PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE

REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE

USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT

INTENT TO INFRINGE.

Manual Revision Information

Reversion Revision History Date

1.0 First Edition August 31, 2021

Item Checklist

Motherboard

Cable(s)

Chapter 1

Introduction of the Motherboard

1-1 Feature of Motherboard

◼Onboard Intel®Braswell N3160 2.24GHz SoC Processor, with low power

consumption never denies high performance

◼Support 1* DDR3L 1600 MHz SO-DIMM, up to 8GB

◼Onboard 2 * Intel i211AT gigabit Ethernet LAN chip

◼Support USB 3.0 data transport demand

◼Support DVI-D, HDMI & LVDS multi-display

◼Support 1* SATAIII device

◼Onboard 1*M.2 M-key (type-2242,SATA interface) slot

◼Onboard 1* full-size Mini-PCIE slot & 1* PCIE x1 slot

◼Onboard 1* SIM card slot

◼Support CPU Over-Temperature protection

◼Support CPU Over-Current/Under Voltage protection

◼Support DRAM Over-Current/Under Voltage protection

◼Support Smart FAN

◼Compliance with ErP standard

◼Support Watchdog function

1-2 Specification

Spec

Description

Design

⚫6 layers; PCB size: 17x 17 cm

Embedded CPU

⚫Intel®Braswell *SoC CPU

*CPU model varies from different IPC options. Please consult your dealer

for more information of onboard CPU.

Memory Slot

⚫1 * DDR3L SODIMM Slot for un-buffered *DDR3L 1600 MHz SDRAM,

expandable to 8GB

Expansion Slot

⚫1* Full-size Mini-PCIE slot

⚫1* PCIE x1 slot

⚫1* SIM card slot

LAN Chip

⚫Integrated with 2* Intel i211AT Gigabit Ethernet LAN chip

⚫Support Fast Ethernet LAN function of providing 10/100/1000Mbps

Ethernet data transfer rate

Storage

⚫1* SATAIII port (SATA1)

⚫1*M.2 M-key, type-2242, SATA interface slot

Audio Chip

⚫C-Media HS-100B USB Audio IC

BIOS

⚫AMI 64MB Flash ROM

Rear I/O

⚫1* 12V DC-in system power Jack

⚫1* DVI-D port

⚫1* HDMI port

⚫2* Serial port (COM1/COM2,COM1 support RS232/422/485 function)

⚫4* USB 3.0 port

⚫2* RJ-45 LAN port

⚫1* Line-out port

⚫1* MIC port

Internal I/O

⚫1* 2-Pin Internal 12V DC-in power connector

⚫1* SATA Power-out connector

⚫1* CPUFAN header & 2* SYSFAN header

⚫1* Front panel audio header

⚫1* Front panel header

⚫1* Power LED & speaker header

⚫1* 9-pin USB 2.0 header (Expansible to 2* USB 2.0 ports)

⚫1* PS/2 keyboard & mouse header

⚫4* RS232 serial port header(COM3/4/5/6)

⚫1* SMBUS header/I2C

⚫1* GPIO_CON header

⚫1* LVDS header

⚫1* LVDS inverter header

* Note: 1. Many PCs now include XHCI USB controllers which allow for the support of USB 3.0 and higher USB

speeds. This inclusion of XHCI controllers has lessened the need for EHCI USB controllers within platforms.

However, legacy operating systems (OS) may not natively recognize XHCI controllers. You might need to

pre-install XHCI driver while desiring to install a non-xHCI OS (ex.Windows* 7) on Intel platforms which do not

include EHCI controllers. Please contact your representative for more details. 2. Braswell SOC will support

memory speed at 1600 MHz and 1066 MHz only. If 1333 MHz DIMM is installed, it will run at 1066 MHz. It is not

validated while installing 1066MHz DIMM with this SOC.

1-3 Layout Diagram

Rear IO Panel Diagram:

Warning!

The board has a DC 12V power connector (DCIN) in I/O back panel and an internal ATX12V

(ATX2P) power connector. User can only connect one type of compatible power supply to one

of them to power the system.

RJ-45 LAN Ports

USB 3.0 Ports

DVI-D Port

COM1

Serial Port

DC-in 12V

Power

Connector

HDMI Port

COM2

Serial Port

Line-Out Port

MIC Port

Motherboard Internal Diagram

Note: SODIMM module should be 1.35V DDRIII SODIMM and not exceeding 8GB total capacity.

Internal 12V DC-in

Power connector

SYSFAN1 Header

*DDR3L SODIMM Slot

(SODIMM1)

DVI-D Port

over HDMI Port

RJ-45 LAN Ports

over USB 3.0 Ports

Serial Ports

12V DC -in

Power Connector

Line-Out Port

over MIC Port

Full-size

Mini-PCIE

Slot (MPE)

Front Panel

Audio Header

PCI Express x1 Slot

SATAIII Port

SATA Hard Disk

Power-Out Connector

Power LED Header &

Speaker Header

SYSFAN2 Header

Front Panel

Header

Serial Port Headers

(COM3/4/5/6)

GPIO Header

Intel CPU

Full-size

Mini-SATA

Slot (MSATA1)

CPUFAN Header

SIM Card Slot

LVDS Inverter

SMBUS Header

LVDS Header

USB 2.0 Header

PS2KBMS

Header

LANLED Headers

Jumper Position:

JPCOM2

JPCOM1

JBAT

JPLED

JAT_COPEN

JPLCD

JPCOM3

JPCOM4

JPCOM5

JPCOM6

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