Intel 845 DESIGN Guía

Intel®Pentium®4 Processor in

478-pin Package and Intel®845

Chipset Platform for SDR

Design Guide Update

March 2004

Notice: The Intel®845 chipset family may contain design defects or errors known as errata which

may cause the product to deviate from published specifications. Current characterized errata are

documented in the Specification Update.

Document Number: 250425-003

Preface

Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual

property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability

whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to

fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for

use in medical, life saving, or life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future

definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Intel®845 chipset family may contain design defects or errors known as errata which may cause the product to deviate from published specifications.

Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from:

Intel Corporation

www.intel.com

Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.

*Other names and brands may be claimed as the property of others.

2 Design Guide Update

Preface

Contents

Preface ............................................................................................................................................ 5

Nomenclature...................................................................................................................... 5

Codes Used in Summary Table .......................................................................................... 6

General Design Considerations ................................................................................................................. 7

Schematic, Layout, and Routing Updates .................................................................................................. 9

Documentation Changes .......................................................................................................................... 11

Design Guide Update 3

Preface

Revision History

Rev. Draft/Changes Date

-001 Initial Release March 2002

-002 (1) Added Documentation Change #3, Replace Figure 118, Intel®

845 Chipset Platform Using PC133 SDRAM System Memory

Power Delivery Map

(2) Added Documentation Change #4, Added Section 4.6.7,

Electrostatic Discharge Platform Recommendations

(3) Added Documentation Change #5, Change Table 3, System Bus

Routing Summary for the Processor

(4) Added Documentation Change #6, Add Section 13.2, Intel®

Boxed Processor Mechanical Keep-Outs

(5) Added Documentation Change #7, Add Section 15.1.3, Intel®

Boxed Processor Mechanical Keep-Outs

(6) Added Schematic, Layout, and Routing Updates #1, Schematic

change to the 82845 MCH HSWING Circuit

May 2002

-003 (1) Added Documentation Change 8, Revise Section 4.1, Schematic

Checklist, Host Interface, PWRGOOD

March 2004

4 Design Guide Update

Preface

This Design Guide Update document is an update to the specifications and information contained

in the Intel®Pentium®4 Processor in 478-pin Package and Intel®845 Chipset Platform for SDR

Design Guide, January 2002. This Design Guide Update may reference other documents listed in

the following Affected Documents/Related Documents table. This document is a compilation of

updates to the general design considerations; schematic, layout, and routing updates; and

documentation changes. This document is intended for hardware system manufacturers and for

software developers of applications, operating systems, and tools. The design guide (and this

design guide update) is primarily targeted at the PC market segment and was first published in

2002. Those using this design guide and update should check for device availability before

designing in any of the components included in this document.

Information types defined in the Nomenclature section of this document are consolidated into the

public design guide update document when the public design guide document is first published.

This design guide update document contains a complete list of all known information types.

Affected Documents

Document Title Document

Number

Intel® Pentium® 4 Processor in 478-pin Package and Intel® 845 Chipset Platform for

SDR Design Guide, January 2002

298354-002

Related Documents

Document Title Document

Number

Intel® 845 Chipset: 82845 Memory Controller Hub (MCH) for SDR Datasheet, January

2002

290725-002

Intel® 82801BA (ICH2) I/O Controller Hub Datasheet 290687-002

Nomenclature

General Design Considerations include system level considerations that the system designer

should account for when developing hardware or software products using the Intel® 845 Chipset:

82845 Memory Controller Hub (MCH) for SDR.

Schematic, Layout, and Routing Updates include suggested changes to the current published

schematics or layout, including typos, errors, or omissions from the current published documents.

Documentation Changes include suggested changes to the current published design guide not

including the above.

Design Guide Update 5

Preface

Codes Used in Summary Table

Doc: Document change or update that will be implemented.

Shaded: This item is either new or modified from the previous version of the document.

NO. Plans GENERAL DESIGN CONSIDERATIONS

There are no General Design Consideration changes in this Design Guide Update revision.

NO. Plans SCHEMATIC, LAYOUT, AND ROUTING UPDATES

1 Doc Schematic change to the 82845 MCH HSWING Circuit

NO. Plans DOCUMENTATION CHANGES

1 Doc Change Section 12.4.2, 3.3V/V5REF Sequencing

2 Doc Change Section 14.8, Power and Ground, V5REF_SUS

3 Doc Replace Figure 118, Intel® 845 Chipset Platform Using PC133 SDRAM System Memory

Power Delivery Map

4 Doc Add Section 4.6.7, Electrostatic Discharge Platform Recommendations

5 Doc Change Table 3, System Bus Routing Summary for the Processor

6 Doc Add Section 13.2, Intel® Boxed Processor Mechanical Keep-Outs

7 Doc Add Section 15.1.3, Intel® Boxed Processor Mechanical Keep-Outs

8 Doc Revise Section 14.1, Schematic Checklist, Host Interface, PWRGOOD

6 Design Guide Update

General Design Considerations

There are no General Design Considerations in this Design Guide Update revision.

Design Guide Update 7

General Design Considerations

This page is intentionally left blank.

8 Design Guide Update

Schematic, Layout, and Routing Updates

1. Schematic Change to the 82845SDR MCH HSWING Circuit

Reference Appendix A, Customer Reference Board Schematics, of the Intel® Pentium® 4

Processor in 478-Pin Package and Intel® 845 Chipset Platform for SDR Design Guide, 298354-

002, dated January 2002. Sheet 11 of the “Intel® 845 SDR Schematics Rev 1.3” contains a circuit

at grid location C-7. This circuit has a VCCP input and an HSWING output. Capacitor C5D6 is

shown as a series capacitor between VCCP and the HSWING output. This circuit is not correct as

shown.

Capacitor C5D6 is a decoupling capacitor. It should connect the HSWING output of this circuit to

GND so that resistor R5D5 and capacitor C5D6 are in parallel.

Sheets

62,61,60,59,46,18,17,11,10,9,7,6,5

VCCP IN

R5D7

R5D5

C5D6

HSWING OUT

Sheet 9

Design Guide Update 9

Schematic, Layout, and Routing Updates

This page is intentionally left blank.

10 Design Guide Update

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