TECHNICAL DOCUMENTATION
4
Preliminary
www.inpower-sys.com 1IPSE1A33-60
HANDLING AND MOUNTING ADVICES2.
Any parasitic inductances within the DC-link are to be avoided or at least minimised.•
As long as the driver main board and the adaptation board are not completely assembled, the inputs•
have to be short-circuited.
Electrostatic discharge (ESD) protection must be provided during handling. ESD is avoided by preven-•
ting the build-up of static electricity. Before opening the boxes, place the them on an ESD protected
workstation. Persons working with devices have to wear their own wrist straps which they should test
before use. Human hands contain oil and this oil can contaminate the contacts and can generate dys-
functions on devices. Therefore, it is recommended to handle a device with protection gloves and al-
ways touch it by the sides.
Humidity is an important factor for the generation of static charges. Humidity between 40 and 60 per•
cent is the best choice for an assembly area.
The input terminals of the main driver board are sensitive to over-voltages. Therefore, please avoid•
over-voltages of the control input signal in order to prevent destruction.
Some driver functions should be checked before installation. Check the gate voltage of the driver for•
the on-state (+15V) and the gate voltage for the o-state (-15V). We also recommend to check the input
current consumption of the driver at the required switching frequency and without clock signals.
The connecting cable between the driver board and the IGBT module should be as short as possible.•
Max. length of coaxial cable should not exceed 30cm. Max. length of simple cable should not exceed
7cm.
For the gate and auxiliary emitter connections it is recommended to use coaxial cable RG58 C/U with•
auxiliary emitter connected to the shielding. For power emitter and auxiliary collector it is recommen-
ded to use HV insulation cable, for instance Radox 9 GKW-AX, 1.5mm, order no. 12 537 829.
The driver should be connected to the control electronics, and feedback status signals should be fed to•
the control circuit. In failure events the device must be turned-o immediately.
When rst operating the assembled circuit we advice to apply a low collector voltage and load current•
in the beginning and then to increase their values step by step, observing the behaviour of the free-
wheeling diode and voltage peaks of the IGBT during turning-o.
Short-circuit tests should not be done until the correct function of the device has been checked under•
rated operation conditions. When executing these tests start with low collector voltage as well.
Observation with an oscilloscope and thermal monitoring will be necessary.•
Do not switch-on the IGBT-module repeatedly into a short circuit. It may destroy the device.•
In applications with parallel connection of IGBT-modules we recommend to check each logical switch•
under power-cycling conditions before starting-up the whole system. Usually it is sucient to switch
with single or double pulses.
As the specic inverter construction determines many parameters, we recommend to check the IGBT•
modules in the worst case conditions to be sure that they are within the SOA.
When testing, please be aware that the gate drivers for all IGBTs of the system must be supplied with•
energy – in order to hold the turn-o stage by applying negative gate voltage – even if only individual
IGBTs are tested.
