Infineon EiceDRIVER 2EDL803 Series Manual de usuario

User Manual Please read the Important Notice and Warnings at the end of this document V 1.0

www.infineon.com/2edl803x page 1 of 19 2023-06-07

UM_2305_PL88_2305_223554

Half-bridge buck converter evaluation board

using the EiceDRIVER™ 2EDL803x

Order code: EVAL_HB_2EDL803x-G3C, EVAL_HB_2EDL803x-G4B,

EVAL_HB_2EDL803x-G4C

About this document

Scope and purpose

The 2EDL803x is the EiceDRIVER™family designed to drive both high-side and low-side MOSFETs in a half-

bridge configuration. The floating high-side driver is capable of driving a high-side MOSFET operating at up to

120 V bootstrap voltage. Version 4 provides full 4 A current capability, while version 3 provides 3 A. The high-

side bias voltage is generated using a bootstrap technique with an integrated bootstrap diode. The inputs of

the driver are TTL logic compatible and can withstand input common mode swing from -10 V up to 20 V.

Independent inputs allow controlling high- and low-side domains independently. Undervoltage lockout (UVLO)

on both high- and low-side supplies forces the corresponding outputs low in case of insufficient supply. The

2EDL803x is available in SON-8 pins 4 mm x 4 mm, SON-10 pins 4 mm x 4 mm, and SON-10 pins 3 mm x 3 mm

packages.

The half-bridge buck converter evaluation board described in this document is designed as a test platform for

evaluating the performance of 2EDL8034_G3C. For evaluation of different packages, evaluation boards are

available as shown in Table 1.

Table 1 Board specifications

Part number

Package

Body size

Evaluation board

2EDL803x-G3C

PG-VDSON-10-4

3 mm x 3 mm

EVAL_HB_2EDL803x-G3C

2EDL803x-G4B

PG-VSON-8-5

4 mm x 4 mm

EVAL_HB_2EDL803x-G4B

2EDL803x-G4C

PG-VDSON-10-2

4 mm x 4 mm

EVAL_HB_2EDL803x-G4C

Intended audience

Power supply designers, component engineers, hardware engineers, etc.

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Half-bridge buck converter evaluation board using the EiceDRIVER™

2EDL803x

Table of contents

About this document....................................................................................................................... 1

Table of contents............................................................................................................................ 2

1Introduction .......................................................................................................................... 3

2Getting started with the hardware ........................................................................................... 4

2.1 Evaluation board.....................................................................................................................................4

2.2 List of connection and test points ..........................................................................................................5

2.3 Quick start guide .....................................................................................................................................5

3Test results............................................................................................................................ 6

4Footprint selection for different FETs....................................................................................... 9

5Addendum............................................................................................................................12

5.1 Schematic..............................................................................................................................................12

5.2 Layout....................................................................................................................................................15

5.3 Bill of materials (BOM) ..........................................................................................................................17

Revision history.............................................................................................................................18

User Manual 3 of 19 V 1.0

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Half-bridge buck converter evaluation board using the EiceDRIVER™

2EDL803x

Introduction

1Introduction

The evaluation board provides the design engineer with a test platform for evaluating the performance of the

2EDL8034 gate driver –such as, but not limited to, its propagation delay, delay matching, and rise/fall time

characteristics. The influence of the surrounding gate drive circuitry such as the external gate resistors on the

MOSFET’s switching behavior can also be evaluated. The board is configured as a half-bridge buck converter in

an open-loop configuration and tested with 48 V typical input voltage and 12 V typical output voltage. The

Infineon components used in this evaluation board are:

•EiceDRIVER™2EDL8034 as half-bridge driver for the low-side and high-side MOSFET

•OptiMOS™100 V 4 mΩ(BSC040N10NS5) in SuperSO8 package as the power MOSFET

Table 2 shows the typical board electrical specifications, but the user has the freedom to vary the input voltage

(60 V maximum), output voltage, output current, switching frequency and dead time, because the board is

configured in open-loop configuration. Care must be taken not to exceed the components’maximum voltage

ratings and current ratings (e.g., the inductor’s saturation current rating), as well as the devices’temperature

ratings. Provide adequate airflow or forced air if necessary.

Table 2 Board specifications

Parameter

Symbol

Value

Unit

Input voltage

Vin

Output voltage

Vout

Output current

Iout

0 to 8

Switching frequency

Fsw

200

kHz

Dead time

DTon, DToff

100

Board dimensions

88.0 mm (L) x 60.5 mm (W)

Figure 1 Block diagram of EVAL_HB_2EDL803x

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Half-bridge buck converter evaluation board using the EiceDRIVER™

2EDL803x

Getting started with the hardware

2Getting started with the hardware

2.1 Evaluation board

Figure 2 EVAL_HB_2EDL803x –top side

Figure 3 EVAL_HB_2EDL803x –bottom side

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Half-bridge buck converter evaluation board using the EiceDRIVER™

2EDL803x

Getting started with the hardware

2.2 List of connection and test points

Table 3 Connection and test points –functional descriptions

Connection/test point

Description

HI and LI PWM input

Input GND

Vout connector

VDD connector

Output GND

Vin connector

X7*

EN connector

+Vin

Vin sense point

+Vout

Vout sense point

Note: EN connector (X7) is only available on board EVAL_2EDL803x-G3C

2.3 Quick start guide

1. Input the PWM signals (LI and HI) using a function generator with the desired pulse width, dead time and

frequency through connector X1. Ensure that there is sufficient dead time to avoid cross-conduction of the

two MOSFETs.

2. Supply VDD voltage using an external auxiliary power supply between 8 V and 17 V through connector X4.

3. For 2EDL803x-G3C, enable signal should be supplied between 3 V and VDD + 0.3 V through connector X7.

Other drivers don’t require enable signal.

4. Supply the Vin voltage using an external power supply with 48 V (60 V maximum) through connector X6 (Vin)

and X2 (GND). If verifying the gate driver IC characteristics only, such as propagation delay, there is no need

to supply the Vin voltage. In this case, the HS pin must be shorted to GND in order to have a charging path for

the bootstrap capacitor.

5. Connect the Vout to the electronic load through connector X3 (Vout) and X5 (GND) and increase the output

current up to 8 A maximum. Care must be taken not to exceed the inductor’s saturation limit.

6. The VDD, LI, HI, LO, and HS pin of the gate driver can be measured by a low-voltage single-ended probe, while

the HO-HS and HB-HS should be measured using low-voltage differential probes. Probing loops should be

as short as possible to avoid any induced ringing, and probes should be placed near the driver pins to

ensure accurate measurement of the driver’s performance.

7. To power down the board, turn off the load first and then turn off the input voltage supply. Then turn off the

enable signal in the case of 2EDL80x-G3C. Finally, turn off the driver bias supply.

User Manual 6 of 19 V 1.0

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Half-bridge buck converter evaluation board using the EiceDRIVER™

2EDL803x

Test results

3Test results

Figure 4 and Figure 5 show the falling and rising propagation delay of the low-side and high-side drives with

the VDD bias supplied and Vin = 48 V with no load on output.

Figure 4 LI-LO falling (33.6 ns) and rising (34.7 ns) propagation delay (VDD = 12 V, Vin = 48 V, Cload =

4.1 nF)

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Half-bridge buck converter evaluation board using the EiceDRIVER™

2EDL803x

Test results

Figure 5 HI-HO falling (34.3 ns) and rising (33.5 ns) propagation delay (VDD = 12 V, Vin = 48 V, Cload =

4.1 nF)

Figure 6 shows the high-side and low-side output waveforms together with the switch node waveforms at Vin =

48 V, VDD = 12 V, duty = 23 percent, Fsw = 200 kHz, load = 8 A, and TA= 25°C.

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Half-bridge buck converter evaluation board using the EiceDRIVER™

2EDL803x

Test results

Figure 6 LO (green), HO (pink), HS (yellow) waveforms

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Half-bridge buck converter evaluation board using the EiceDRIVER™

2EDL803x

Footprint selection for different FETs

4Footprint selection for different FETs

The evaluation board allows the user to test the performance of the driver IC with different FETs available in

various footprints. Table 4 lists all the footprints supported on this board.

Table 4 FET footprints supported on the evaluation board

Package

Ref. designator

Preferred FET

Figure

PG-TDSON-8-1

(SuperSO8)

Q1 and Q2

BSC040N10NS5

Figure 7

TO263-7-3

Q3 and Q10

IPB032N10N5

Figure 8

PG-HSOF-8-1

Q4 and Q9

IPT020N10N3

Figure 9

PG-HSOG-8-1

Q5 and Q8

IAUS300N10S5N014

Figure 10

PG-HDSOP-16-2

Q6 and Q7

IAUS260N10S5N019T

Figure 11

Figure 7 PG-TDSON-8-1 (SuperSO8) package

Figure 8 TO263-7-3 package

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Half-bridge buck converter evaluation board using the EiceDRIVER™

2EDL803x

Footprint selection for different FETs

Figure 9 PG-HSOF-8-1 package

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