HPE AP-585 Instrucciones de montaje

MF877-00 Page 1

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Product End-of-Life Disassembly Instructions

Product Category

: Networking

Marketing Name / Model

[List multiple models if applicable.]

Aruba AP-585 Unified AP

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by

Directive 2012/19/EU of the European Parliament and of the Council on Waste Electrical and Electronic Equipment

(WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium

coin or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

1134

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

5 (AP585)

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

MF877-00 Page 2

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Item Description Notes

Quantity

of items

included

in product

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Description #1 Tamper Resistant Torx screwdriver

T25

Description #2 Tamper Resistant Torx screwdriver

Description #3 Phillips Screwdriver

PH2

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove accessories.

2. Remove four M5 screws using T25 Tamper Resistant Torx screwdriver from holder, then remove the holder and solar

mask.

3. Remove eight M5 screws using T25 Tamper Resistant Torx screwdriver, then remove Top Cover.

4. Remove five M3 screws using PH2 Phillips screwdriver.

5. Remove five Antenna cables from the Antenna Plate by hand, then remove it (include O-ring).

6. Remove ten M3 screws using PH2 Phillips screwdriver.

7. Remove GPS Antenna cables and PSU connector from the PCBA by hand, then remove PCBA.

8. Remove five M3 and one M4 screws using PH2 Phillips screwdriver, then remove the PSU.

9. Remove the air vent.

10. Remove four M3 screws using T8 Tamper Resistant Torx screwdriver, then remove GPS Cover.

11. Remove four M3 screws using PH2 Phillips screwdriver, then remove GPS PCBA.

MF877-00 Page 3

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

1. Remove accessories.

2. Remove four M5 screws using T25 Tamper Resistant Torx screwdriver from holder, then remove holder and

solar mask.

3. Remove eight M5 screws using T25 Tamper Resistant Torx screwdriver, then remove Top Cover.

MF877-00 Page 4

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

4. Remove five M3 screws using PH2 Phillips Screwdriver.

5. Remove five Antenna cables from Antenna Plate by hand, then remove it (include O-ring).

6. Remove ten M3 screws using PH2 Phillips screwdriver.

7. Remove GPS Antenna cables and PSU connector from the PCBA by hand, then remove the PCBA.

MF877-00 Page 5

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

8. Remove five M3 and one M4 screws using PH2 Phillips screwdriver, then remove the PSU.

9. Remove the air vent.

10. Remove four M3 screws using T8 Tamper Resistant Torx screwdriver, then remove GPS Cover.

11. Remove four M3 screws using PH2 Phillips screwdriver, then remove GPS PCBA.

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