HP JH321A Instrucciones de montaje

EL-MF877-00 Page 1

Template Revision B

Product End-of-Life Disassembly Instructions

Product Category: Networking Equipment

Marketing Name / Model

[List multiple models if applicable.]

HPE FF 5950 32Q28 Swch(JH321A)

HPE FF 5950 32Q28 TAA Swch(JH322A)

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sqcm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame

Retardantsweighing > 25 grams (not including

PCBs or PCAs already listed as a separate item

above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

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Tool Description

Tool Size (if

applicable)

Screw driver

Socket wrench

2.5#

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Unscrew the screws on mounting angle 1, and then remove mounting angle 1.

2. Unscrew the screws on mounting angle 2, and then remove mounting angle 2.

3. Remove the fan-assembly 3.

4. Remove the power 4.

5. Remove the filler panel 5.

6. Unscrew the screws on top cover 6, and remove top cover 6.

7. Unscrew the screws on front panel 7, and then remove front panel 7.

8. Unscrew the screws on heat sink device 9

9. Unscrew the screws on plastic airguide 10,and then remove the plastic airguide 10

10. Unscrew the screws on PCB-assembly 11, and then remove PCB-assembly 11.

11. Remove all of the labels.

12. Unscrew the screws and hexagon posts on PCB 12, and then remove PCB 12.

13. Unscrew the screws on 13, and remove 13.

14. Unscrew the screws on PCB-assembly 14, and remove PCB-assembly 14.

15. Unscrew the screws on fan 3-1, and then remove fan 3-1.

16. Remove the fan snap rivets 3-2.

17. Remove the 3-3.

18. Remove the 3-4.

19. Unscrew the hexagon posts on PCB 11-1, and remove PCB 11-1.

20. Unscrew the screws on PCB 14-1, and remove PCB 14-1.

21. Remove all the shielding finger.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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Figure 1Remove mounting angleFigure 2 Rear of the product

Figure 3Treatments to the productFigure 4Treatments to the product

Figure 5 Treatments to fan-assembly 3Figure 6Treatments to PCB-assembly 11

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3.3 Material of the facility built

Facility

Components

Material

Weight(g)

Weight

percentage

Selective treatment for

materials and components

Details

362

3.57%

recycling

0.76%

recycling

3-1

0.25%

recycling

3-2

0.10%

Containing brominated flame

retardants

3-3

0.25%

recycling

3-4

100

0.99%

Containing brominated flame

retardants

3-5

0.25%

recycling

1050

10.43%

recycling

0.20%

recycling

1950

19.38%

recycling

330

3.28%

recycling

2650

26.33%

recycling

400

3.97%

recycling

0.21%

Containing brominated flame

retardants

Figure 7Treatments to PCB-assembly 14

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11-1

Complex

PWB

0.10%

The surface of PCB is greater

than 10 square centimeters;

11-2

Complex

PWB

200

1.99%

The surface of PCB is greater

than 10 square centimeters;

Complex

PWB

2700

26.83%

The surface of PCB is greater

than 10 square centimeters;

0.29%

recycling

14-1

Complex

PWB

0.20%

The surface of PCB is greater

than 10 square centimeters;

14-2

Complex

PWB

0.60%

The surface of PCB is greater

than 10 square centimeters;

4. Revised record

Date

Version

Author

Modify content

2016.03.17

Zhou Hongjia

Initial version

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