HP A5920AF-24XG Instrucciones de instalación
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Networking Equipment
Marketing Name / Model
[List multiple models if applicable.]
HP A5920AF-24XG (JG296A）
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
3
Batteries
All types including standard alkaline and lithium coin
or button style batteries
2
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
6
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Tool Description
Tool Size (if
applicable)
Screw driver
2#
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Unscrew the Power Cable Holder 1.
2. Unscrew the screws on mounting angle 2, and then remove mounting angle 2.
3. Unscrew the screws on mounting angle 3, and then remove mounting angle 3.
4. Unscrew all screws of battery 4, and then remove battery 4 from the chassis.
5. Unscrew all screws on blank panel 5, and then remove panel 5 from chassis.
6. Unscrew all screws on fan 6, and then remove fan 6 from the chassis.
7. Unscrew all screws, and then remove the top cover 7.
8. Remove all of the inner cables.
9. Unscrew all screws on PCB 8, and then remove PCB 8 from the chassis.
10. Remove part 9 from PCB 8.
11. Remove all of the labels from the chassis.
12. Unscrew all screws 5-2 , and then remove handle 5-1 from blank panel 5-4.
13. Remove the part 5-3.
14. Unscrew all screws, and then remove fan 6-9 from fan rack 6-1..
15. Unscrew all screws, and then remove part 6-8 from fan rack 6-1.
16. Unscrew all screws, and then remove pcb 6-7 from fan rack 6-1.
17. Unscrew all screws, and then remove part 6-6 from fan rack 6-1.
18. Unscrew all screws, and then remove part 6-5 from fan rack 6-1.
19. Unscrew all screws, and then remove part 6-4 from fan rack 6-1.
20. Unscrew all screws, and then remove part 6-3 from fan rack 6-1.
21. Unscrew all screws, and then remove handle 6-2 from fan rack 6-1.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 3
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure 1 Remove mounting angle Figure 2 Rear of HP S5830-24S
Figure 3 Treatments to the top cover Figure 4 Treatments to pcb 8
Figure 5 Treatments to blank panel 5 Figure 6 Treatments to front panel 6
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