HP 5500-24G-PoE+-4SFP Instrucciones de montaje
Product End-of-Life Disassembly Instructions
Product Category: Networking Equipment
Marketing Name / Model
[List multiple models if applicable.]
HP 5500-24G-PoE+-4SFP HI Switch w/2 Slt(JG541A)
HP 5500-24G-PoE+-4SFP HI TAA Swch w/2Slt(JG679A)
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
2
Batteries
All types including standard alkaline and lithium coin
or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
4
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
EL-MF877-00 Page 1
Template Revision B
Tool Description
Tool Size (if
applicable)
Screw driver
2#
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Unscrew the screws on mounting angle 1, and then remove mounting angle 1.
2. Unscrew the screws on mounting angle 2, and then remove mounting angle 2.
3. Unscrew the screws 3, and then remove the screws 3.
4. Unscrew the screws on the dummy bar 4,and then remove the dummy bar 4.
5. Remove the power 5 and the filler panel 6.
6. Unscrew the screws on top cover 7, and then remove top cover 7.
7. Remove plastic panel 8.
8. Remove all of the inner cables.
9. Unscrew the screws on the shutter 10, and then remove the shutter 10.
10. Unscrew the screws on the shutter 11, and then remove the shutter 11.
11. Unscrew the screws on fan-assembly 9, and then remove fan-assembly 9 from the chassis.
12. Unscrew the screws on PCB 12, and remove PCB 12 from the chassis.
13. Unscrew the screws 9-1,and then remove the fan 9-3 from the bracket 9-2.
14. Unscrew the screws on PCB 12-2, and then remove PCB 12-2 from PCB 12-1.
15. Remove the lamp guide 12-3 from PCB 12-1.
16. Remove all of the labels from the chassis.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 2
Template Revision B
3.3 Material of the facility built
Facility
Components
Material
Weight(g)
Weight percentage
Selective treatment for
materials and components
Details
1
Fe
70
1.15%
Fe recycling
2
Fe
90
1.48%
Fe recycling
4
Fe
40*2
1.32%
Fe recycling
5
960
15.82%
Fe recycling
6
Fe
100
1.65%
Fe recycling
Figure 1Remove mounting angle Figure 2 Rear of the product
Figure 3Treatments to the product Figure 4Treatments to the product
Figure 5 Treatments to fan-assembly Figure 6Treatments to PCB
EL-MF877-00 Page 3
Template Revision B
7
Fe
1500
24.72%
Fe recycling
8
PC+ABS
50
0.82%
Containing
brominated flame
retardants
Pla recycling
9
9-2
Fe
40
0.66%
Fe recycling
9-3
PBT+Cu
73
1.20%
Containing
brominated flame
retardants
Cu recycling
10
Fe
25
0.41%
Fe recycling
11
PC+ABS
50
0.82%
Containing
brominated flame
retardants
Pla recycling
12
12-1
Complex
PWB
1010
16.64%
The surface of PCB is greater
than 10 square centimeters;
12-2
Complex
PWB
80
1.32%
The surface of PCB is greater
than 10 square centimeters;
12-3
PC
10
0.16%
Containing
brominated flame
retardants
Pla recycling
13
Fe
1930
31.81%
Fe recycling
4. Revised record
Date
Version
Author
Modify content
2013.01.08
V0
Li Meng
Initial version
2013.04.10
V1
Liu Baoquan
Add the module JG679A
EL-MF877-00 Page 4
Template Revision B
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