HP Cray CS E1000 Instrucciones de instalación

MF877-00 Page 1

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Storage

Marketing Name / Model

[List multiple models if applicable.]

HPE Cray CS E1000 4TB SAS 5U84 42pk HDD Bdl

HPE Cray CS E1000 6TB SAS 5U84 42pk HDD Bdl

HPE Cray CS E1000 8TB SAS 5U84 42pk HDD Bdl

HPE Cray CS E1000 4TB 5U84 SED 42pk HDD Bdl

HPE Cray CS E1000 10TB 5U84 SED 42pk HDD Bdl

HPE Cray CS E1000 16TB 5U84 SED 42pk HDD Bdl

HPE Cray CS E1000 SAS 5U84 LFF Drv Encl

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic

instructions for the disassembly of HPE products to remove components and materials requiring selective treatment,

as defined by Directive 2012/19/EU of the European Parliament and of the Council on Waste Electrical and Electronic

Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

5 in each chassis.

1 in each of 2 power supplies.

1 in each of 5 DC fan modules.

1 in each of 2 I/O modules (IOMs).

14 Max

Batteries

All types including standard alkaline and lithium

coin or button style batteries

Mercury-containing components

For example, mercury in lamps, display

backlights, scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with

gas discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

5 capacitors in each of 2 power supplies.

External electrical cables and cords

1 power cord for each of 2 power supplies.

MF877-00 Page 2

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Item Description

Notes

Quantity

of items

included

product

3 SAS expansion cables for each of 2 IOMs.

1 RJ45 cables for each of 2 IOMs.

Gas Discharge Lamps

Plastics containing Brominated Flame

Retardants weighing > 25 grams (not including

PCBs or PCAs already listed as a separate item

above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and

toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts, and materials containing

refractory ceramic fibers

Components, parts, and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where

components and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Phillips driver

#0, #1, #2

Torx driver

T10, T25

Hex driver

Socket driver

10mm

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective

treatment:

1. Remove the bezel and hubcaps from the front of the enclosure.

2. Remove all disk drives.

3. For each disk drive, remove the disk from the plastic carrier.

4. Remove both power supply units (PSUs), both IOMs, and fan modules.

5. Disassemble each PSU. See the PSU disassembly procedure.

6. Disassemble each IOM. See the IOM disassembly procedure.

7. Disassemble each fan module. See the fan module disassembly procedure.

8. Disassemble the chassis. See the chassis disassembly procedure.

MF877-00 Page 3

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations)

3.2.1 PSU Disassembly procedure

1. Remove the casing screws using a Phillips #1 bit and pull the top cover off.

MF877-00 Page 4

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

MF877-00 Page 5

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

2. Remove the cable connection connecting the board—present on a PSU side—marked in the image below.

3. Remove the five screws connecting the PCBA to metal enclosure using Phillips #1 bit screwdriver, and then

separate the casing.

4. Pull the lugs in the direction shown in the image below.

MF877-00 Page 6

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

MF877-00 Page 7

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

5. After removing all the connections, remove the PCA from the enclosure.

3.2.2 IOM Disassembly procedure

1. Remove the two screws from the lid.

MF877-00 Page 8

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

2. Remove the top cover by sliding the metal enclosure in the direction shown.

MF877-00 Page 9

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

4. Remove the six screws marked in the image.

MF877-00 Page 10

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

5. Pull the PCA in the direction shown by the red arrow to remove the PCA from the metal case.

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