HP Pavilion 11 x2 PC Instrucciones de instalación

Product End-of-Life Disassembly Instructions

Product Category: Notebooks and Tablet PCs

Marketing Name / Model

[List multiple models if applicable.]

HP Pavilion 11 x2 PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

PCBA

Batteries

All types including standard alkaline and lithium coin

or button style batteries Main battery & RTC battery

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps LCD Panel

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Description Screwdriver

#1#2

Description #2

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Release hinge BTN and Pull up Slate.fig#1

2. Disassemblly Slate Cover.fig#2

3. Release bootm trim's screw and disasemblly bottom trim.fig#3

4. Release Thermal bracket's screw and disasemblly Thermal bracket.fig#4

5. Disasemblly Speaker fig#5

6. Release MB's screw and disasemblly MB.fig#6

7. Release Battery's screw and disasemblly Battery.fig#7

8. Slate disasemblly finish.fig#8

9. Remove Base Rubber foot.fig#9

10. Release Base's screw and disasemblly Base case.fig#10

11. Release Hinge's cable and screw and disasemblly Hinge module.fig#11

12. Release Battery's screw and disasemblly Battery.fig#12

13. Release all board's screw and disasemblly all board.fig#13

14. Dock disaemblly finish.fig#14

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

1. Release hinge BTN and Pull up Slate

2. Disassemblly Slate Cover

EL-MF877-00 Page 2

Template Revision B

PSG instructions for this template are available at EL-MF877-01

3. Release bootm trim's screw and disasemblly bottom trim

4. Release Thermal bracket's screw and disasemblly Thermal bracket

5. Disasemblly Speaker

6. Release MB's screw and disasemblly MB

EL-MF877-00 Page 3

Template Revision B

PSG instructions for this template are available at EL-MF877-01

7. Release Battery's screw and disasemblly Battery

8. Slate disasemblly finish

9. Remove Base Rubber foot

10. Release Base's screw and disasemblly Base case

EL-MF877-00 Page 4

Template Revision B

PSG instructions for this template are available at EL-MF877-01

11. Release Hinge's cable and screw and disasemblly Hinge module

12. Release Battery's screw and disasemblly Battery

13. Release all board's screw and disasemblly all board

14.Dock disaemblly finish

EL-MF877-00 Page 5

Template Revision B

PSG instructions for this template are available at EL-MF877-01

EL-MF877-00 Page 6

Template Revision B

PSG instructions for this template are available at EL-MF877-01

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