HP Notebook Instrucciones de montaje

Product End-of-Life Disassembly Instructions

Product Category: Notebooks and Tablet PCs

Marketing Name / Model

[List multiple models if applicable.]

HP Notebook, HP Notebook 17

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE)

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

EL-MF877-00 Page 1

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Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Description #1 Screwdriver

Description #2

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove battery module

2. Remove base rubber foot -L & -R

3. Dis-fasten Base Cap -L & -R screw*2

4. Remove Base Cap foot -L & -R

5. Dis-fasten ODD screw*1

6. Remove ODD

7. Dis-fasten BASE screw*20

8. Pull out FFC*3 (Power, Touchpad, keyboard membrane)

9. Dis-fasten daughter boards screw*4 (Power, Touchpad)

10. Remove daughter boards*2 (Power, Touchpad )

11. Pull out wire cable *5(LCD, DC cable, HDD, ODD, speaker) Pull out FFC(USB, Battery)

12. Pull out Antenna cables

13. Dis-fasten Wireless screw*1

14. Remove Wireless card

15. Remove HDD

16. Dis-fasten USB boards screw*2

17. Remove USB boards

18. Dis-fasten motherboard screw*7

19. Remove motherboard

20. Remove Memory

21. Pull out fan cable

22. Dis-fasten Fan screws*1

23. Remove Fan

24. Dis-fasten thermal module screw*4

25. Remove thermal module

26. Remove ODD cable

27. Dis-fasten Battery boards screw*2

28. Remove Battery boards

29. Dis-fasten speaker screw*2

30. Remove speaker -L & -R

31. Dis-fasten Hinge screw*10

32. Remove DC cable

33. Remove LCD bezel

34. Pull out LCD cable & camera cable

35. Dis-fasten LCD Bezel screws*6

36. Remove LCD module

37. Remove Camera module

38. Dis-fasten LCD BKT -L & -R screws*4

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Template Revision B

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39. Remove LCD module

40. Dis-fasten Hinge screw*8

41. Remove Hinge -L & -R

42. Remove Antenna cables -L & -R

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

3.21 Total

3.22 Remove battery module and Base Cap -L & -R

3.23 Remove ODD module.

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Template Revision B

PSG instructions for this template are available at EL-MF877-01

3.24 Remove TOP assy.

3.25 Remove Power boards & Touchpad

3.26 Remove Wireless card & HDD & USB boards.

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Template Revision B

PSG instructions for this template are available at EL-MF877-01

3.27 Remove motherboard & Battery boards & speaker & ODD cable.

3.28 Remove Memory & thermal module

EL-MF877-00 Page 5

Template Revision B

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3.29 Remove LCD Cover from hinge up.

3.30 Remove lcd cable and camera module.

3.31 Remove Panel & LCD BKT.

EL-MF877-00 Page 6

Template Revision B

PSG instructions for this template are available at EL-MF877-01

3.32. Remove Hinge and Antenna.

EL-MF877-00 Page 7

Template Revision B

PSG instructions for this template are available at EL-MF877-01

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