HP EliteBook x360 830 G5 Instrucciones de montaje

EL-MF877-00 Page 1

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Notebooks

Marketing Name / Model

[List multiple models if applicable.]

HP EliteBook x360 830 G8 Notebook PC

HP EliteBook x360 830 G8

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the

disassembly of HP Inc. products to remove components and materials requiring selective treatment, as defined by EU directive

2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).

NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the

plastic part. For any questions on plastic marking or identification of location of parts or components requiring selective treatment,

please contact HP’s Sustainability Contact.

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment. An “X” in the list of components and parts indicates the product

contains the component or part requiring selective treatment

Item Description

Components and parts requiring selective treatments

Quantity of

items

included in

product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA) with a surface greater than 10 sq cm

☒Main board (MB) PCB

☒Solid state drive (SSD) PCB

☒Wireless WAN module (WWAN) PCB

☐Touch module PCB

☒Power supply PCB

☐External Keyboard (KB)

☐External Mouse

☐Others: _____________

Batteries, excluding Li-Ion batteries. This includes

standard alkaline, coin or button style batteries

☒RTC/CMOS battery

☐Others: _____________

Li-Ion batteries. Includes all Li-Ion batteries if more

than one is provided with the product (such as a

detachable notebook keyboard battery, etc.)

Li-ion battery(ies) are attached to the product by:

☒screws

☐snaps

☐adhesive

☐other. Explain

Mercury-containing components. For example,

mercury in lamps, display backlights, scanner lamps,

switches, batteries

EL-MF877-00 Page 2

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

Item Description

Components and parts requiring selective treatments

Quantity of

items

included in

product

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm. Includes background illuminated

displays with gas discharge lamps

☒Panel LCD

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring greater

than 2.5 cm in diameter or height

☐Power Supply capacitor(s) or condenser(s)

External electrical cables and cords

☒AC power cord

☐Audio, video or data cables

☐Other: _________

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants (not

including external electrical cables and cords, PCBs or

PCAs already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner.

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing refractory

ceramic fibers

Components, parts and materials containing

radioactive substances

Components containing chlorofluorocarbons (CFC),

hydrochlorofluorocarbons (HCFC) or

hydrofluorocarbons (HFC), hydrocarbons (HC)

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components and

materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screwdriver

Heatgun

N/A

Suction cup

N/A

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment including

the required steps to remove the external enclosure.

EL-MF877-00 Page 3

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

1. Follow steps described in disassembly instruction & operation name in 3.2 section.

2. If parts can be removed without using a tool, remove it first.

3. Use correct screwdriver and torque value before unlocking the screw.

3.2 Location of components requiring selective treatment. The photos and/or graphics below identify the location of the parts or

components requiring selective treatment within the main unit. For End-of-Life product disassembly instructions of external

accessories including external power supply (EPS), external keyboard (KB) external mouse and external cables and cords, refer to the

following URL: End-of-Life Product Disassembly Instructions (hp.com)

EL-MF877-00 Page 4

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

Prepared by：：

Checked by：Yang jsaon Yi qiu-ling

Sta. Ver. Sta. Ver. Sta. Ver. Sta. Ver. Sta. Ver. Sta. Ver.

1 1.00 9 1.00 17 1.00

2 1.00 10 1.00 18 1.00

3 1.00 11 1.00 19 1.00

4 1.00 12 1.00 20 1.00

5 1.00 13 1.00 21 1.00

6 1.00 14 1.00 22 1.00

7 1.00 15 1.00 23 1.00

8 1.00 16 1.00 24 1.00

Sta. Ver.

ALL 1.**

2020/3/21

initial

Zhao neil

A.Current station version list:

B.Version Modify list:

Date

Content

Design

Written by:

Yi qiu-ling

Date:

2020/3/21

Page:

1 of 25

Sub-assembly name:

Oleander Disassemble SOP

Document No.:

Oleander Disassemble SOP

Revision:

1.00

MANUFACTURING PROCESS INSTRUCTIONS

MECHANICAL ASSEMBLY

MODEL : Oleander

EL-MF877-00 Page 5

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

Standard Operation Procedure

step：

Document No. : Oleander Disassemble SOP Station :

Operation Name : Ver. : Edit date :

Prepared ：Zhou.gui-ling

Notice: Please inform production line leader or master if you found any abnormal..

Fixture list (Spec.) Qty Symbol

Issued：IE department

Safe Order Hear Look Do Static

Qual

ity

Fixtur

1(1/1)

1. Loosen Base screw *5pcs as below

picture showing

❖Torque：2.5 ±0.2 kgf.cm

❖screw can not be slipped.

2. Disassembly Base

❖Pull down the back shell to the side of

the sky after the left and right side of the

card is removed

Disassembly Base 1.00 2020/3/21

Picture 1

Screw driver（T5）1

EL-MF877-00 Page 6

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

Standard Operation Procedure

step：

Document No. : Oleander Disassemble SOP Station :

Operation Name : Ver. : Edit date :

Prepared ：Zhou.gui-ling

Notice: Please inform production line leader or master if you found any abnormal..

Fixture list (Spec.) Qty Symbol

Issued：IE department

Safe Order Hear Look Do Static

Qual

ity

Fixtur

2(1/1)

1. Disassemble battery CNTR（picture 1）

2. Disassemble SSD Shielding

Can(6053B1743801) (picture 2)

❖pull shielding can remove the handle is on

the right

Disassembly SSD Shielding Can 1.00 2020/3/21

Picture 1

Picture 2

EL-MF877-00 Page 7

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

Standard Operation Procedure

step：

Document No. : Oleander Disassemble SOP Station :

Operation Name : Ver. : Edit date :

Prepared ：Zhou.gui-ling

Notice: Please inform production line leader or master if you found any abnormal..

Fixture list (Spec.) Qty Symbol

Issued：IE department

Safe Order Hear Look Do Static

Qual

ity

Fixtur

3(1/1)

1. Disassemble DDR Shielding

Can(6053B1744001) (picture1)

❖pull shielding can the right handle lift

unloading

2. Take DDR（picture 2）

1.00 2020/3/21

Disassemble DDR

Picture 1

Picture 2

EL-MF877-00 Page 8

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

Standard Operation Procedure

step：

Document No. : Oleander Disassemble SOP Station :

Operation Name : Ver. : Edit date :

Prepared ：Zhou.gui-ling

Notice: Please inform production line leader or master if you found any abnormal..

Fixture list (Spec.) Qty Symbol

Issued：IE department

Safe Order Hear Look Do Static

Qual

ity

Fixtur

4(1/1)

1. Hold the Camera Cable handle，and

unplug the CNTR（picture1）

2. Hold the LCM Cable handle，and unplug

the CNTR （picture2）

Disassemble LCM&camera CNTR 1.00 2020/3/21

picture1

picture2

EL-MF877-00 Page 9

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

Standard Operation Procedure

step：

Document No. : Oleander Disassemble SOP Station :

Operation Name : Ver. : Edit date :

Prepared ：Zhou.gui-ling

Notice: Please inform production line leader or master if you found any abnormal..

Fixture list (Spec.) Qty Symbol

Issued：IE department

Safe Order Hear Look Do Static

Qual

ity

Fixtur

5(1/1)

1. Unplug all antenna CNTR on WWAN

card and tie the antenna out of the

antenna slot（picture1）

Disassemble WWAN antenna 1.00 2020/3/21

picture1

picture2

NO.6

antenna

NO.5an

tenna

No.7

antenna

NO.号

antenna

EL-MF877-00 Page 10

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

Standard Operation Procedure

step：

Document No. : Oleander Disassemble SOP Station :

Operation Name : Ver. : Edit date :

Prepared ：Zhou.gui-ling

Notice: Please inform production line leader or master if you found any abnormal..

Fixture list (Spec.) Qty Symbol

Issued：IE department

Safe Order Hear Look Do Static

Qual

ity

Fixtur

6(1/1)

1. Remove the 7 and 8 antennas from the

I/O frame and speaker（picture）

Remove the 7and8 antennas 1.00 2020/3/21

picture1

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