EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
including liquids, semi-liquids (gel/paste) and toner
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
Description #1 Motor-screw-driver “+”
Cross head
of screwdriver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. remove 6-cell battery
2. remove 1 screw of RAM door, and then take out RAM door
3. remove 1 screw of HDD door, and then take out HDD door.
4. remove 4 screw of HDD Brkt , and the take out the HDD from HDD bay
5. remove WLAN antenna connector x2
6. remove 2 screws on WLAN module, and then take out WLAN module.
7. remove 1 screw of ODD brkt , and the take out ODD module
8. remove 2 rubber feet and 22 scrws on the bottom case (follow the sequence as shown in SOP)
9. turn the unit 180 degree, then start to remove Top cover
10. open the LCM in 135 degree, lift the top cover and remove FFC for Touch pad module
11. remove the FPC for KBD,, then Top cover can be removed completely
12. remove the USB FFC from MB
13. remove USB PCB screw x 2 , then USB PCB can be remove completely
14. remove DC-IN cable from MB
15. remove DC-IN bracket screw x2 , then DC-IN cable can be completely
16. remove SPEAKER cable from MB
17. remove SPEAKER screw *1 , then SPEAKER can be completely
18. remove Power PCB FFC from MB
19. remove POWER PCB screw x 1 , then POWER PCB can be remove completely
20. disassembly screw*4 aside hinge brkt , then LCM can be removed completely
21. remove blue tooth cable from M/B CNTR, then Blue tooth module can be removed from bottom case
22. remove screw x3 for MB ,then MB can be removed completely
23. DDR can be remove from MB now
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
