HP ProDesk 600 G1 Tower Instrucciones de instalación
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP ProDesk 600 G1 Tower Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic
instructions for the disassembly of HP products to remove components and materials requiring selective treatment ,as
defined by EU directive 2002/96/EC,Waste Electrical and Electronic Equipment (WEEE)
1.0 Items Requiring Selective
Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
Yes
2
Batteries
All types including standard alkaline and lithium
coin or button style batteries Yes
1
Mercury-containing components
For example, mercury in lamps, display
backlights, scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
Liteon 320W STD
5
External electrical cables and cords
Yes
1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink
Include the cartridges, print heads, tubes, vent
including liquids, semi-liquids (gel/paste) and toner
chambers, and service stations.
Components and waste containing asbestos
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PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where
components and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
#1Torx Screwdriver
#2 Phillips Screwdriver
#3 Micro shear
T-15
2
170II
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective
treatment:
1. Remove the access panel.(see Figure 1 below)
2. Disconnect the cables from the board.(see Figure 2-7 below)
3. Remove the HDD、slim ODD、ODD from cage.(see Figure 8-10 below)
4. Remove the Memory from the board.(see Figure 11 below)
5. Remove the CPU HeatSink from the board(see Figure 12&13 below)
6. Remove the fan from CPU HeatSink(see Figure 14&15 below)
7. Remove the CPU from the board.(see Figure 16&17 below))
8. Remove the battery from the system board.(see Figure 18 below)
9. Remove M/B from chassis.(see Figure 19&20 below)
10. Remove system fan from chassis.(see Figure 21&22 below)
11. Remove PSU from chassis.(see Figure 23-25 below)
12. Remove Speaker from chassis .(see Figure 26&27 below)
13. Remove front bezel.(see Figure 28 below)
14. Remove Front I/O and power LED cable.(see Figure 29-31 below)
15. Remove PSU cover.(see Figure 32&33 below)
16. Remove PSU PCA,and disconnect power cables.(see Figure 34&35 below)
17. Remove the Electrolytic Capacitors.(see Figure 36-38 below)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
EL-MF877-00 Page 3
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure1 Remove the access panel Figure2 Disconnect PSU cables from the board
Figure3 Disconnect the ODD/HDD PSU cables Figure4 Disconnect the cables from the ODD
Figure5 Disconnect the cables from the HDD Figure6 Disconnect the cooler cable
EL-MF877-00 Page 4
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure7 Disconnect the Front IO cable Figure8 Remove the HDD from cage
Figure9 Remove the slim ODD from cage Figure10 Remove the ODD from cage
Figure11 Remove the Memory from the board Figure12 Loose the screws from the CPU HeatSink
EL-MF877-00 Page 5
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure13 Remove the CPU HeatSink from the board Figure14 Loose the screws from the CPU HeatSink
Figure15 Remove the fan from CPU HeatSink Figure16 Rotate the handle and open it up
Figure17 Remove the CPU from the board Figure18 Remove the battery from the system board
EL-MF877-00 Page 6
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure19 Loose the screws from board Figure20 Remove M/B from chassis
Figure21 Loose the screws from system fan Figure22 Remove system fan
Figure23 Loose the screws from PSU Figure24 Press the baffle and slide the PSU
EL-MF877-00 Page 7
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure25 Remove PSU from chassis Figure26 Loose the screw from Speaker
Figure27 Remove Speaker Figure28 Remove front bezel
Figure29 Loose the screw of FIO Figure30 Remove FIO
EL-
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EL-MF877-00 Page 9
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure37 Remove Ele-Cap from PCBA
Figure38 Remove Ele-Cap from PCBA
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