HP ProDesk 480 G3 MT Instrucciones de instalación
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP ProDesk 480 G3 MT Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
2
Batteries
All types including standard alkaline and lithium coin
or button style batteries
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
6
External electrical cables and cords
Power cord
1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Cooler fan 81g,system fan 99g,PSU fan 67g
247g
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw driver
T-15
Micro shear
YN-3
Screw driver
PH2
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove access panel. (see Figure 1-2)
2. Remove front bezel. (see Figure 3)
3. Disconnect cooler cable then remove the cooler from board. (see Figure4-5)
4. Remove the HDD (see Figure 6-8)
5. Remove the Slim ODD (see Figure 9-10)
6. Unplug all cable conn. from PCA. (see Figure 11)
7. Remove the PCA(see Figure 12-13)
8. Remove the DIMM. (see Figure 14)
9. Remove the CPU. (see Figure 15-16)
10. Remove the Battery. (see Figure 17)
11. Remove the FIO module from chassis. (see Figure 18-19)
12. Remove the PWR_LED switch cable from chassis. (see Figure 20-21)
13. Remove the SD card reader from chassis. (see Figure 22-23)
14. Remove the speaker from chassis. (see Figure 24-25)
15. Remove Sys fan from chassis. (see Figure 26-27)
16. Remove the PSU from chassis. (see Figure 28-29)
17. Remove the PSU chassis and remove the PSU board. (see Figure 30-39)
18. Remove the Electrolytic Capacitors from PSU board. (see Figure 40-54)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 3
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure1 Release Thumb screw on the access panel.
Figure2 Griping the tab at the end of access panel, pull
towards the rear and remove from unit.
Figure3 Pull 3 pcs bezel hooks and remove the front bezel
from chassis.
Figure4 Unplug the cooler cable from PCA
Figure5 Release 4 screws from cooler and remove it
Figure6 Disconnect the SATA and power cables from
HDD
EL-MF877-00 Page 4
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure7 Release the HDD screws
Figure8 Remove the HDD form chassis
Figure9 Push the latch and release the Slim ODD.
Figure10 Remove the Slim ODD form chassis.
Figure11 Unplug all cable conn. from PCA.
Figure12 Release 8 pcs screws from PCA
EL-MF877-00 Page 5
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure13 Remove PCA from chassis
Figure14 Push the hooks on both sides and then pick up
the memory
Figure15 Rotate the handle and open it up
Figure16 Remove the CPU from board
Figure17 Remove the battery from the PCA
Figure18 Release the screw of the FIO cable
EL-MF877-00 Page 6
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure19 Rotation and Remove the FIO module from
chassis
Figure20 Push the plastic hook.
Figure21 Remove the PWR_LED switch from chassis
Figure22 Release 1 pcs screw of speaker
Figure23 Remove the speaker form chassis
Figure24 Release the SD card reader screw
EL-MF877-00 Page 7
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure25 Remove the SD Card reader from chassis
Figure26 Release 2 pcs screws from system fan.
Figure27 Remove the system fan from chassis
Figure28 Release 4 pcs screws of PSU and remove it
Figure29 Pull up the PSU and remove it
Figure30 Cut the cable tie
EL-MF877-00 Page 9
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure37 Remove PCB screw
Figure38 Remove AC inlet screw
Figure 39 Cut output cable, AC inlet wire, LED wire
Figure40 Remove capacitors use solder iron
Figure41 Heat the solder of Electrolytic Capacitors
greater than 2.5cm in diameter or height and remove it.
(C801,C151,C303,C951) (Gamay-S 300W APFC-Delta)
Figure42 Heat the solder of Electrolytic Capacitors greater
than 2.5cm in diameter or height and remove it.
(C801 ,C951) (Crasto-S 180W E-Star6-Delta)
C801
C151
C303
C951
EL-MF877-00 Page 10
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure43 Heat the solder of Electrolytic Capacitors
greater than 2.5cm in diameter or height and remove it.
(C801) (Ortega 180W ATX bronze-Delta)
Figure44 Heat the solder of Electrolytic Capacitors greater
than 2.5cm in diameter or height and remove it.
(C1,C6) (Gamay-S 300W APFC_AcBel)
Figure45 Heat the solder of Electrolytic Capacitors
greater than 2.5cm in diameter or height and remove it
(C1,C6,C19) (Gamay-S 300W Bronze_AcBel)
Figure46 Heat the solder of Electrolytic Capacitors greater
than 2.5cm in diameter or height and remove it.
(C6,C19) (Crasto-S 180W APFC_AcBel)
Figure47 Heat the solder of Electrolytic Capacitors
greater than 2.5cm in diameter or height and remove it.
(C6,C19) (Crasto-S 180W Bronze_AcBel)
Figure48 Heat the solder of Electrolytic Capacitors greater
than 2.5cm in diameter or height and remove it.
(C6,C19,C57,C13) (Ortega 180W Bronze_AcBel)
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