HP ProDesk 405 G2 Instrucciones de montaje

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Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP ProDesk 405 G2 MT Business PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Power cord

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Cooler fan 84g,system fan 92g,PSU fan 63.5g

239.5g

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

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Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screw driver

T-15

Micro shear

YN-3

Screw driver

PH2

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove access panel. (see Figure 1-2)

2. Remove front bezel. (see Figure 3)

3. Remove the HDD (see Figure 4-6)

4. Remove the Slim ODD (see Figure 7-8)

5. Unplug all cable conn. from PCA. (see Figure 9)

6. Remove the PCA(see Figure 10-11)

7. Remove the DIMM. (see Figure 12)

8. Disconnect cooler cable then remove the cooler from board. (see Figure13-14)

9. Remove the Battery. (see Figure 15)

10. Remove the FIO module from chassis. (see Figure 16-17)

11. Remove the SD card reader from chassis. (see Figure 18-19)

12. Remove the speaker from chassis. (see Figure 20-21)

13. Remove the PSU from chassis. (see Figure 22-23)

14. Remove the PSU chassis and remove the PSU board. (see Figure 24-34)

15. Remove the Electrolytic Capacitors from PSU board. (see Figure 35-41)

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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Figure1 Release Thumb screw on the access panel.

Figure2 Griping the tab at the end of access panel, pull

towards the rear and remove from unit.

Figure3 Pull 3 pcs bezel hooks and remove the front bezel

from chassis.

Figure4 Disconnect the SATA and power cables from

HDD

Figure5 Release the HDD screws

Figure6 Remove the HDD form chassis

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Figure7 Push the latch and release the Slim ODD.

Figure8 Remove the Slim ODD form chassis.

Figure9 Unplug all cable conn. from PCA.

Figure10 Release 6 pcs screws from PCA

Figure11 Remove PCA from chassis

Figure12 Push the hooks on both sides and then pick up

the memory

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Figure13 Unplug the cooler cable from PCA

Figure14 Release 4 screws from cooler and remove it

Figure15 Remove the battery from the PCA

Figure16 Release the screw of the FIO cable

Figure17 Push the plastic hook and rotation the FIO

module inside. Remove the FIO module from chassis

Figure18 Release the SD card reader screw

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Figure19 Remove the SD Card reader from chassis

Figure20 Release two screws of speaker

Figure21 Remove the speaker form chassis

Figure22 Release 4 pcs screws of PSU and remove it

Figure23 Pull up the PSU and remove it

Figure24 Cut the cable tie

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Figure25 Remove screw for bottom

Figure26 Remove screw for top

Figure27 Remove FG screw

Figure28 Disconnect fan connector

Figure29 Cut the cable tie

Figure30 Remove LED

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Figure31 Remove plastic cover

Figure32 Remove PCB screw

Figure33 Remove AC inlet , select switch screw

Figure34 Cut output cable, AC inlet wire, LED wire

Figure35 Remove capacitors use solder iron

Figure36 Heat the solder of Electrolytic Capacitors

greater than 2.5cm in diameter or height and remove it.

(Crasto-S 180W E-Star-Acbel)

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Figure37 Heat the solder of Electrolytic Capacitors

greater than 2.5cm in diameter or height and remove it.

(C801 ,C951)(Crasto-S 180W E*6 PSU-Delta)

Figure38 Heat the solder of Electrolytic Capacitors

greater than 2.5cm in diameter or height and remove it.

(C801,C802,C951,C303) (Crasto-S 180W REG PSU-

Delta)

Figure39 Heat the solder of Electrolytic Capacitors

greater than 2.5cm in diameter or height and remove it.

( Crasto-S 180W APFC-Acbel)

Figure40 Heat the solder of Electrolytic Capacitors

greater than 2.5cm in diameter or height and remove it.

(Crasto-S 180W REG PSU-Chicony)

Figure41 Heat the solder of Electrolytic Capacitors

greater than 2.5cm in diameter or height and remove it.

(Crasto-S 180W APFC PSU-Chicony)

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