HP ENVY Instrucciones de instalación

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Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Notebooks and Tablet PCs

Marketing Name / Model

[List multiple models if applicable.]

HP ENVY Notebook PC/HP ENVY 14 Notebook PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

EL-MF877-00 Page 2

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PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screwdriver

Description #2

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove battery module

2. Dis-fasten ODD screw*

3. Remove ODD

4. Remove BASE rubber feet*2

5. Dis-fasten BASE Cap screw*2

6. Disassemble BASE Cap*2

7. Dis-fasten BASE screw*15

8. Disassemble KB Deck

9. Pull out FFC*3 (Power, Touchpad, Fingerprint)

10. Pull out FFC*1 (USB)

11. Dis-fasten daughter boards screw*1 (Power)

12. Remove daughter boards*2 (Power, USB)

13. Pull out wire cable connectors*2 (LCD, DC cable)

14. Pull out wire cable*2 (speaker, woofer)

15. Pull out HDD assembly

16. Dis-fasten DC BKT screw*2

17. Remove DC BKT

18. Dis-connect antenna cable connector

19. Remove WLAN module

20. Dis-fasten motherboard screw*5

21. Remove motherboard

22. Dis-fasten Speaker R&L screw*1

23. Remove speaker -L & -R

24. Pull out fan cable

25. Dis-fasten Fan screws*1

26. Remove Fan module

27. Dis-fasten thermal module screw*7

28. Remove thermal module

29. Pull out DC cable connector

30. Dis-fasten Hinge screw*5

31. Remove hinge-up

32. Remove LCD Bezel screw pad*2

33. Dis-fasten LCD Bezel screws*2

EL-MF877-00 Page 3

Template Revision B

PSG instructions for this template are available at EL-MF877-01

34. Remove LCD bezel

35. Dis-fasten Hinge BKT screw*6

36. Pull out LCD cable & camera cable

37. Dis-fasten LCD BKT -L & -R screws*4

38. Remove LCD module

39. Remove Camera module

40. Remove antenna cables -L & -R

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

3.21 Total part disassembly

3.22 Remove battery module

3.23 LCD module set disassembly

EL-MF877-00 Page 4

Template Revision B

PSG instructions for this template are available at EL-MF877-01

3.24 Top case disassembly

3.25 Thermal module and mother board disassembly

EL-MF877-00 Page 5

Template Revision B

PSG instructions for this template are available at EL-MF877-01

3.26 Bottom case disassembly

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