HP ProDesk 600 G4 Instrucciones de instalación
EL-MF877-00
Template RevisionB
Page 1
PSGinstructions for this template are available atEL-MF877-01
ProductEnd-of-LifeDisassemblyInstructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP ProDesk 600 G4 PCI Microtower Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.1
Items listed below are classified as requiring selective treatment.
1.2
Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
2
Batteries
All types including standard alkaline and lithium coin
or button style batteries
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
250W
EPA92
Acbel
1
External electrical cables and cords
2
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
Include the cartridges, print heads, tubes, vent
1.0 Items Requiring Selective Treatment
EL-MF877-00
Template RevisionB
Page 2
PSGinstructions for this template are available atEL-MF877-01
including liquids, semi-liquids (gel/paste) and toner
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screwdriver
T-15
Micro
shear
170II
Screwdriver
PH1
Description
#4
Description
#5
3.0 Product Disassembly Process
3.1
List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Pull the latch and remove access panel.
2.
Pull the HDD latch from HDD cage.
3.
Disconnect SATA/Power cables from the HDD.
4.
Disconnect SATA/Power cables from slim ODD.
5.
Remove main bezel from chassis
6.
Remove HDD cage from the chassis
7.
Press slim ODD latch
8.
Remove slim ODD from ODD cage
9.
Disconnect HDD SATA cable from theMB.
10.
Disconnect HDD Power cable from theMB
11.
Disconnect P1 Power cable from the MB
12.
Disconnect P2 Power cable from the MB.
13.
Disconnect speaker cable from the MB
14.
Disconnect CPU power cable from theMB
15.
Disconnect ODD power cable from theMB
16.
Disconnect ODD SATA cable from theMB
17.
Poke clip and remove SATA & power cables
18.
Disconnect heat sink cable from the MB
19.
Disconnect system fan cable from the MBt
20.
Use T-15 screwdriver to loose the screws and remove heat sink
21.
Use PH1 screwdriver to loose the screws and remove the fan
22.
Separate the fan from CPU heat sink
23.
Disconnect memory from theMB
24.
Rotate the handle and open it up
25.
Remove CPU from MB
26.
Remove the battery from the MB
27.
Use T-15 to loose the screws of MB
28.
Remove MB from chassis
29.
Use PH1 screwdriver to loose screws of system fan and remove it
30.
Use T-15 screwdriver to loose the screws of speaker and remove it
PSGinstructions for this template are available atEL-MF877-01
31.
Use 170II micro shear to cut two cable ties of PSU cables from chassis
32.
Use T-15 screwdriver to loose the screws of PSU
33.
Press PSU latch and remove it
34.
Cut the cable tie
35.
Remove screw for bottom
36.
Remove screw for top
37.
Remove cover
38.
Remove FG screw
39.
Disconnect fan connector and inlet connector.
40.
Heat the solder of Electrolytic Capacitors greater than 2.5cm in diameter or height and remove it.
3.2
Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 3
Template Revision B
PSGinstructions for this template are available atEL-MF877-01
Figure 1 Pull the latch and remove access panel
Figure 2 Pull the HDD latch from HDD cage
Figure 3 Disconnect SATA/Power cables from the HDD
Figure 4 Disconnect SATA/Power cables from slim ODD
Figure 5 Remove main bezel from chassis
Figure 6 Remove HDD cage from the chassis
EL-MF877-00 Page 4
Template Revision B
PSGinstructions for this template are available atEL-MF877-01
Figure 7 Press slim ODD latch
Figure 8 Remove slim ODD from ODD cage
Figure 9 Disconnect HDD SATA cable from the MB
Figure 10 Disconnect HDD Power cable from the MB
Figure 11 Disconnect P1 Power cable from the MB
Figure 12 Disconnect P2 Power cable from the MB
EL-MF877-00 Page 5
Template Revision B
PSGinstructions for this template are available atEL-MF877-01
Figure 13 Disconnect speaker cable from the MB
Figure 14 Disconnect CPU power cable from the MB
Figure 15 Disconnect ODD power cable from the MB
Figure 16 Disconnect ODD SATA cable from the MB
Figure 17 Poke clip and remove SATA & power cables
Figure 18 Disconnect heat sink cable from the MB
EL-MF877-00 Page 6
Template Revision B
PSGinstructions for this template are available atEL-MF877-01
Figure 19 Disconnect system fan cable from the MB
Figure 20 Use T-15 screwdriver to loose the screws and
remove heat sink
Figure 21 Use PH1 screwdriver to loose the screws and
remove the fan
Figure 22 Separate the fan from CPU heat sink
EL-MF877-00 Page 7
Template Revision B
PSGinstructions for this template are available atEL-MF877-01
Figure 23 Disconnect memory from the MB
Figure 24 Rotate the handle and open it up
Figure 25 Remove CPU from MB
Figure 26 Remove the battery from the MB
Figure 27 Use T-15 to loose the screws of MB
Figure 28 Remove MB from chassis
EL-MF877-00 Page 8
Template Revision B
PSGinstructions for this template are available atEL-MF877-01
Figure 29 Use PH1 screwdriver to loose screws of
system fan and remove it
Figure 30 Use T-15 screwdriver to loose the screws of
speaker and remove it
Figure 31 Use 170II micro shear to cut two cable ties of
PSU cables from chassis
Figure 32 Use T-15 screwdriver to loose the screws of
PSU
EL-MF877-00 Page 9
Template Revision B
Otros manuales para ProDesk 600 G4
4
Otros manuales de De oficina de HP
HP
HP Pavilion t3700 - Desktop PC Cómo utilizar
HP
HP Kayak XU04 Manual de usuario
HP
HP dx5150 Manual de usuario
HP
HP Blade Blade Manual de usuario
HP
HP Compaq Evo d500 SFF Manual de usuario
HP
HP Compaq 8200 Elite Series Manual
HP
HP CQ2800 Manual de usuario
HP
HP Compaq dc5750 Series Instrucciones de uso
HP
HP Vectra VEC 7 Manual de funcionamiento
HP
HP Pavilion Elite m9150f Cómo utilizar
HP
HP Personal Computer Manual de usuario
HP
HP Pavilion v500 - Desktop PC Manual de instrucciones
HP
HP Presario SR1400 - Desktop PC Manual de usuario
HP
HP 200 G1 Microtower Manual de usuario
HP
HP Pavilion a200 - Desktop PC Manual de usuario
HP
HP 100B - All-in-One PC Manual de funcionamiento
HP
HP Xw8200 - Workstation - 1 GB RAM Manual de uso y cuidado
HP
HP -380467-003 - COMPAQ PRESARIO C300 C500 C700 F500 F700 LAPTOP... Instrucciones de instalación
HP
HP Workstation x1100 Manual de usuario
HP
HP Brio BA300 Manual de instrucciones
